MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474

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MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474

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CY7C46X/47X, MINNESOTA
MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 DEVICE DESCRIPTION Cascadable FIFO Cascadable FIFO Cascadable FIFO FIFO FIFO FIFO
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C464/CY7C474 Cascadable FIFO FIFO Cypress Semiconductor Corporation Rev. 7C470A June/1994 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Polyimide CMOS, Doble Poly, Single Metal /0.8µm SiO2 Cypress Semiconductor, Bloomington, Fab3 Generic Process Technology/Design Rule (µ-drawn): Metal Composition: None TiW, SiAl, Oxynitride
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CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Thermosonic Copper Solder Plated, 85%Sn, 15%Pb Silver Spot Attach Dim: Attach Material: Wire Material/Size: Omedata, Indonesia INDNS-O P2868 mils mils Silver Epoxy Gold 28-pin, 600-mil PDIP mils side Sumitomo EME-6300H(R)
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Thermosonic Copper Solder Plated, 85%Sn, 15%Pb Silver Spot Attach Dim: Attach Material: Wire Material/Size: Anam, Korea KOREA-A J32R mils mils Silver Epoxy Gold Plastic Leaded Chip Carrier mils side Sumitomo EME-6300H(R)
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CYPRESS SEMICONDUCTOR
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb None Attach Dim: Attach Material: Wire Material/Size: Cypress Bangkok, Thailand ALPHA-X/D286L mils mils Silver Glass Aluminum 1.25 28-pin, 600-mil CerDIP mils side
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb None Attach Dim: Attach Material: Wire Material/Size: Cypress Bangkok, Thailand ALPHA-X/L32RU mils mils Silver Glass Aluminum 1.25 32-pin Rectangular Leadless Chip Carrier mils side
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CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly >2,000V Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 165°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Operating Life (temp): Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Tests (MIL-STD 883, method 3015) Other: Current Density Input Capacitance Read Record Life Test Internal Water Vapor 150°C/125°C
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CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: FIFO Cypress Semiconductor Rate Speed (ns) Size/ Type Rev. Size Design Rule (stepping) Fabrication Passivation Mold Type Compound Assembly Line Location Volt Availa Rating bility (mm/y
Supplier's Part Number
Process Line CY7C460/ CY7C462/ CY7C464 CY7C470/ CY7C472/ CY7C474 -**JC/JI -**PC/PI -**DC/DMB -**LMB -**JC/JI -**PC/PI **DC/DI/DMB -**LMB PLCC 28.6 PDIP 28.6 CDIP PLCC 28.6 PDIP 28.6 CDIP 0.8µm CMOS Oxynitride Oxynitride Sumitomo Anam, Korea Omedata, Indonesia Hysol CBI, Thailand CBI, Thailand Sumitomo Anam, Korea Omedata, Indonesia Hysol CBI, Thailand CBI, Thailand >2000V
0.8µm
CMOS
>2000V
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C464/CY7C470/CY7C474 28-pin,600-mil Cerdip 28-pin,600-mil Pdip Rectangular Rectangular PLCC
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Cypress Semiconductor Minnesota, Cypress Bangkok, Thailand Omedata, Indonesia Cypress Bangkok, Thailand Anam, Korea
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7C464-JC Assy Lot# 49401347 3353852B Hours 0/410 Hours 0/410 Cumulative 0/410
High Temperature Dynamic Operating Life (HTOL, 5.75V, 125°C) Early Failure Rate Device CY7C474-JC CY7C474-DC Assy Lot# 49401618 219402112 3353852 3402992 Hours 0/284 0/503 Cumulative 0/787
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C474-DC Assy Lot# 219402112 Lot# 3402992 Hours 0/116 Hours 0/1161 1000 Hours Cumulative 0/116
High Temperature Dynamic Operating Life (HTOL, 5.75V, 125°C) Latent Failure Rate Device CY7C474-JC Assy Lot# 49401618 Lot# 3353852 Hours 0/116 Hours 0/1162 Cumulative 0/116
Group Subgroup Life Test (HTOL, 5.75V, 125°C) Device CY7C474-DMB Assy Lot# 93628 Lot# 3243199 Hours 0/80 DEVICE RELIABILITY SUMMARY
Cumulative 0/80
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C464/CY7C470/CY7C474 28-pin,600-mil Cerdip 28-pin,600-mil Pdip Rectangular Rectangular PLCC
Wafer Fab: Assembly:
Cypress Semiconductor Minnesota, Cypress Bangkok, Thailand Omedata, Indonesia Cypress Bangkok, Thailand Anam, Korea
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device CY7C464-JC CY7C474-DC Assy Lot# 49401347 219402112 Lot# 3353852B 3402992 Hours 0/78 0/76 Hours 0/78 0/763 Cumulative 0/154
Temperature Cycle (Condition -65°C 150°C) Device CY7C474-DC Assy Lot# 219402112 Lot# 3402992 Cycles 0/92 1000 Cycles Cumulative 0/92
Temperature Cycle (JEDEC22, -40°C 125°C) Device CY7C464-PC CY7C474-JC Assy Lot# 92190 49400839 Lot# 3237982 3352805 Cycles 0/45 0/48 1000 Cycles 0/45 0/48 Cumulative 0/93
Autoclave (PCT, bias, 121°C, 100%RH) Device CY7C474-JC Assy Lot# 49400839 Lot# 3352805 Hours 0/49 Cumulative 0/49
High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH) Device CY7C464-PC CY7C464-PC Assy Lot# 92190 49400573 Lot# 3237982 3340159 Hours 0/45 0/45 Cumulative 0/90
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CYPRESS SEMICONDUCTOR
DEVICE RELIABILITY SUMMARY CY7C46x/CY7C47x Minnesota CY7C460/462/464/470/472/474 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard banded)
Latchup Testing Cypress Internal Latch-up Procedure Current Injection 200mA Trigger Socket Temp 150°C
Other miscellaneous tests Current Density Input Capacitance Internal Water Vapor Pass Pass Pass

MARKETING PART NUMBER CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474

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