SRAM (256K "CHOP") (Bloomington, QUALIFICATION MARKETING PART NUMBER C

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SRAM (256K "CHOP") (Bloomington, QUALIFICATION MARKETING PART NUMBER C

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1993, 92281 Version
SRAM (256K "CHOP") (Bloomington, QUALIFICATION MARKETING PART NUMBER CY7C161/A* CY7C162/A* CY7C164/A* CY7C166/A* CY7C185/A* CY7C186/A* CY7C187/A* DEVICE DESCRIPTION Static RAM, Separate Static RAM, Separate Static Static RAM, Output Enable Static Static Static
military products.
CYPRESS SEMICONDUCTOR PAGE
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C185/A SRAM Cypress Semiconductor Corporation Rev. 7C185B 1992 mils mils What markings Die:
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process Generic Process Technology/Design Rule (µ-drawn): Metal Composition: TiW,1%SiAl, 500A Ti,1200A TiW,8500A SiAl,500ATi None CMOS, Double Poly, Single Metal /0.8µm SiO2 Cypress Semiconductor, Bloomington,
4,000A 15,000A Oxynitride Plastic Silicone Gel; Hermetic Polyimide (PIQ3600)
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: 22-pin, 300-mil Plastic (7C164,7C187) 24-pin, 300-mil Plastic (7C166) 28-pin, 300-mil Plastic (7C161, 7C162, 7C185) 28-pin, 600-mil Plastic (7C186) mils side (300-mil), mils side (600-mil) Sumitomo EME-6300H(R) Copper Solder Dipped, 63%Sn, 37%Pb Silver Epoxy Thermocompression Attach Dim: Attach Material: Wire Material/Size: Alpha-X mils (300 mil) mils (600 mil) Silver Epoxy Gold
Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Name/Location Assembly (prime) facility:
Cypress Semiconductor, Alphatec, Bangkok, Thailand
CYPRESS SEMICONDUCTOR PAGE
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: 22-pin, 300-mil CDIP (7C164,7C187) 24-pin, 300-mil CDIP (7C166) 28-pin, 300-mil CDIP (7C161, 7C162, 7C185) 28-pin, 600-mil CDIP (7C186) mils side (300-mil), mils side (600-mil) Alloy Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: mils (28-pin) mils (24-pin) mils (22-pin) Silver Glass Aluminum 1.25
Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating:
Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process
Paste Ultrasonic
Attach Material: Wire Material/Size: Alpha-X/
Cypress Semiconductor, Alphatec, Bangkok, Thailand
CYPRESS SEMICONDUCTOR PAGE
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain:
Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly Omedata, Indonesia SOJ, LCC, CERPACK >2,000V Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 125°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: Other: 150°C
CYPRESS SEMICONDUCTOR PAGE
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: SRAM (256K "chop") Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Type Compound Line Location Volt Availability Rating (mm/yy)
Supplier's Part Number
Process Line CY7C161 -**PC -**VC CY7C161/A -**LC/LMB -**DC/DMB CY7C162 -**PC -**VC CY7C162/A -**LC/LMB -**DC/DMB -**KMB -**PC -**VC CY7C164/A -**LC/LMB -**DC/DMB -**KMB CY7C166 -**PC -**VC CY7C166/A -**DC/DMB -**LC/LMB -**KMB CY7C185 -**PC -**VC CY7C185/A -**DC/DMB -**LC/LMB -**KMB CY7C186 -**PC CY7C186/A -**DC/DMB CY7C164 28.3 PDIP 28.3 CDIP 28.3 PDIP 28.3 CDIP CERPACK 22.3 PDIP 22.3 CDIP CERPACK 24.3 PDIP 24.3 CDIP CERPACK 28.3 PDIP 28.3 CDIP CERPACK 28.6 PDIP 28.6 CDIP 0.8µ CMOS Oxynitride Oxynitride Sumitomo INDNS-O, ALPHA-X Hysol Sumitomo INDNS-O, ALPHA-X Hysol >4,000V
0.8µ
CMOS
>4,000V
0.8µ
CMOS
Oxynitride
Sumitomo INDNS-O, ALPHA-X Hysol
>4,000V
0.8µ
CMOS
Oxynitride
Sumitomo INDNS-O, ALPHA-X Hysol
>4,000V
0.8µ
CMOS
Oxynitride
Sumitomo INDNS-O ALPHA-X Hysol
>4,000V
0.8µ
CMOS
Sumitomo INDNS-O, ALPHA-X
>4,000V
CYPRESS SEMICONDUCTOR PAGE
-**LMB Product Family: Division:
SRAM (256K "chop") Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication
Oxynitride
Hysol
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Supplier's Part Number
Passivation Mold Assembly Type Compound Line Location
Volt Availability Rating (mm/yy)
Process Line -**PC 22.3 PDIP -**VC CY7C187/A -**DC/DMB 22.3 CDIP -**LC/LMB -**KMB CERPACK CY7C187 0.8µ CMOS Sumitomo INDNS-O, Oxynitride Hysol ALPHA-X >4,000V
CYPRESS SEMICONDUCTOR PAGE
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C185/A 28.3 PDIP, 28.3 CDIP Wafer Fab: Assembly: Bloomington, Alphatec, Bankok, Thailand
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Device 7C185PC 7C185DC Lot# 3219339 3218278 Assy Lot# 84726 84725 Hours 0/194 0/196 Hours 0/194 0/196 Cumulative 0/390
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Group Device 7C185DMB Lot# 3219339 Assy Lot# 84727 Hours 0/132 Cumulative 0/132
High Temperature Steady State Life (HTSSL, 5.75V, 150°C) Device 7C185PC 7C185DC Lot# 3219339 3218278 Assy Lot# 84726 84725 Hours 0/80 0/80 Hours 0/80 0/80 Cumulative 0/160
Temperature Cycle (Condition -65°C 150°C) Device 7C185DC Lot# 3218278 Assy Lot# 84725 Cycles 0/50 1000 Cycles 0/50 Cumulative 0/50
Temperature Cycle -40°C 125°C) Device 7C185PC Lot# 3219339 Assy Lot# 84726 Cycles 0/50 1000 Cycles 0/50 Cumulative 0/50
CYPRESS SEMICONDUCTOR PAGE
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C185/A 28.3 PDIP, 28.3 CDIP Wafer Fab: Assembly: Bloomington, Alphatec, Bankok, Thailand
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device 7C185PC Lot# 3219339 Assy Lot# 84726 Hours 0/50 Cumulative 0/50
Highly Accelerated Biased Humidity Test (HAST, 5.5V, 130°C, 85%RH) Device 7C185PC Lot# 3219339 Assy Lot# 84726 Hours 0/49 Cumulative 0/49
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) (Early Life) Device 7C185PC 7C185DC Lot# 3219339 3218278 Assy Lot# 84726 84725 Hours 0/1015 2/1015 Cumulative 0/1015 2/1015
failures contact spiking. Cerdip units have hour production burnin implemented screen these failures; pending process corrective action verification.
CYPRESS SEMICONDUCTOR PAGE
Device Reliability Summary
SRAM CY7C185A Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+4400V Unit >-4400V >+4400V Unit >-4400V >+4400V Unit >-4400V (Highest passing voltage, +10% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Temp 150°C
Other Qualifications that affect this product family process Qual Qualification Description 91094 SRAM (Fab3) 92062 256K SRAM (Fab3)

SRAM (256K "CHOP") (Bloomington, QUALIFICATION MARKETING PART NUMBER C

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