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BF1105; BF1105R; BF1105WR N-channel dual-gate MOS-FETs Product sp
Top Searches for this datasheetBF1105; BF1105R; BF1105WR N-channel dual-gate MOS-FETs Product specification Supersedes data 1997 File under Discrete Semiconductors, SC07 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs FEATURES Short channel transistor with high forward transfer admittance input capacitance ratio noise gain controlled amplifier GHz. Internal self-biasing circuit ensure good cross-modulation performance during good stabilization. APPLICATIONS applications with supply voltage, such television tuners professional communications equipment. page BF1105; BF1105R; BF1105WR PINNING DESCRIPTION source drain gate gate view MSB035 handbook, columns BF1105R marking code: NAp. Fig.2 Simplified outline (SOT143R). alfpage DESCRIPTION Enhancement type N-channel field-effect transistor with source substrate interconnected. Integrated diodes between gates source protect against excessive input voltage surges. BF1105, BF1105R BF1105WR encapsulated SOT143B, SOT143R SOT343R plastic packages respectively. QUICK REFERENCE DATA SYMBOL Ptot Cig1-ss Crss Xmod PARAMETER drain-source voltage drain current total power dissipation forward transfer admittance input capacitance gate reverse transfer capacitance noise figure cross-modulation operating junction temperature CAUTION This product supplied anti-static packing prevent damage caused electrostatic discharge during transport handling. further information, refer Philips specs.: SNW-EQ-608, SNW-FQ-302A SNW-FQ-302B. Tamb CONDITIONS MIN. TYP. MAX. UNIT dBµV view MSB014 view MSB842 BF1105 marking code: NEp. BF1105WR marking code: Fig.1 Simplified outline (SOT143B). Fig.3 Simplified outline (SOT343R). input level 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL Ptot Tstg Note Device mounted printed-circuit board. PARAMETER drain-source voltage drain current gate current gate current total power dissipation storage temperature operating junction temperature BF1105; BF1105R; BF1105WR CONDITIONS Tamb note Fig.4 MIN. MAX. +150 +150 UNIT MGM243 handbook, halfpage Ptot (mW) Tamb (°C) Fig.4 Power derating curve. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs THERMAL CHARACTERISTICS SYMBOL Note Device mounted printed-circuit board. STATIC CHARACTERISTICS unless otherwise specified. SYMBOL V(BR)DSS PARAMETER drain-source breakdown voltage PARAMETER thermal resistance from junction ambient free thermal resistance from junction soldering point BF1105; BF1105R; BF1105WR CONDITIONS note VALUE UNIT CONDITIONS VG1-S VG2-S MIN. TYP. MAX. UNIT V(BR)G1-SS gate 1-source breakdown voltage VG2-S IG1-S V(BR)G2-SS gate 2-source breakdown voltage VG1-S IG2-S VG2-S (th) IDSX IG1-SS IG2-SS gate 2-source threshold voltage self-biasing drain current gate cut-off current gate cut-off current VG1-S VG2-S VG1-S VG2-S VG1-S VG2-S DYNAMIC CHARACTERISTICS Common source; Tamb VG2-S self-biasing current; unless otherwise specified. SYMBOL Cig1-ss Cig2-ss Coss Crss PARAMETER forward transfer admittance input capacitance gate input capacitance gate output capacitance noise figure power gain MHz; opt; opt; MHz; Fig.16 opt; opt; MHz; Fig.17 Xmod cross-modulation input level AGC; MHz; funw MHz; Fig.18 input level AGC; MHz; funw MHz; Fig.18 CONDITIONS pulsed; MIN. TYP. MAX. UNIT dBµV dBµV reverse transfer capacitance 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR handbook, halfpage MGM244 (mA) handbook, halfpage MGM245 (mA) VG2-S VG2-S Fig.5 Output characteristics; typical values. Fig.6 Transfer characteristics; typical values. MGM246 handbook, halfpage handbook, halfpage MGM247 (mS) VG2-S (mA) (mA) VG2-S Fig.7 Forward transfer admittance function drain current; typical values. Fig.8 Drain current function gate voltage; typical values. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR fMGM248 handbook, halfpage MGM249 handbook, halfpage (mA) (mA) (µA) VG2-S VG2-S Fig.9 Drain current function drain-source voltage; typical values. Fig.10 Drain current function gate current; typical values. MGM250 handbook, halfpage Vunw (dBµV) gain reduction (dB) VG2nom IDnom Iself bias; MHz; funw MHz; Tamb Fig.11 Unwanted voltage cross-modulation function gain reduction; typical values (see Fig.18). 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR handbook, halfpage (mS) MGM251 handbook, halfpage |yrs| (µS) MGM252 -103 (deg) -102 |yrs| 10-1 10-2 (MHz) (MHz) VG2-S Tamb VG2-S Tamb Fig.12 Input admittance function frequency; typical values. Fig.13 Reverse transfer admittance phase function frequency; typical values. handbook, halfpage |yfs| (mS) |yfs| MGM253 -102 (deg) MGM254 handbook, halfpage (mS) 10-1 (MHz) 10-2 (MHz) VG2-S Tamb VG2-S Tamb Fig.14 Forward transfer admittance phase function frequency; typical values. Fig.15 Output admittance function frequency; typical values. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR handbook, full pagewidth VAGC BF1105 BF1105R BF1105WR output input BB405 Vtun input BB405 Vtun output MGM255 MHz. turns, internal diameter copper wire. turns, internal diameter copper wire; tapped approximately half turn from cold side, adjusted Fig.16 Gain test circuit. handbook, full pagewidth VAGC input BF1105 BF1105R BF1105WR ,,,, ,,,, output MGM256 MHz. silvered copper wire above ground plane. silvered copper wire above ground plane. turns copper wire without spacing, internal diameter approx. Fig.17 Gain test circuit. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR handbook, full pagewidth Rgen BF1105 BF1105R BF1105WR MGM257 Fig.18 Cross-modulation test set-up. Table (MHz) 1000 Table Scattering parameters: VG2-S MAGNITUDE (ratio) 0.994 0.991 0.982 0.968 0.956 0.937 0.918 0.897 0.878 0.858 0.840 ANGLE (deg) -3.8 -7.5 -14.7 -21.7 -28.8 -35.4 -41.8 -48.1 -54.0 -59.9 -65.5 MAGNITUDE (ratio) 3.060 3.047 3.004 2.932 2.896 2.815 2.735 2.651 2.575 2.482 2.396 ANGLE (deg) 175.4 170.9 162.1 153.4 145.3 137.1 129.2 121.5 114.0 106.5 99.5 MAGNITUDE (ratio) 0.000 0.002 0.003 0.004 0.006 0.007 0.007 0.008 0.008 0.008 0.008 ANGLE (deg) 86.9 86.1 82.7 79.7 77.8 76.7 76.3 76.7 79.7 82.2 88.0 MAGNITUDE (ratio) 0.985 0.983 0.980 0.976 0.972 0.967 0.961 0.955 0.948 0.941 0.935 ANGLE (deg) -2.1 -4.2 -8.3 -12.1 -16.2 -20.0 -23.7 -27.3 -30.9 -34.4 -37.9 Noise data: VG2-S (MHz) Fmin (dB) (ratio) 0.674 (deg) 39.7 37.15 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs PACKAGE OUTLINES Plastic surface mounted package; leads BF1105; BF1105R; BF1105WR SOT143B detail scale DIMENSIONS original dimensions) UNIT 0.48 0.38 0.88 0.78 0.15 0.09 0.45 0.15 0.55 0.45 OUTLINE VERSION SOT143B REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-02-28 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR Plastic surface mounted package; reverse pinning; leads SOT143R detail scale DIMENSIONS original dimensions) UNIT 0.48 0.38 0.88 0.78 0.15 0.09 0.55 0.25 0.45 0.25 OUTLINE VERSION SOT143R REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-03-10 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs BF1105; BF1105R; BF1105WR Plastic surface mounted package; reverse pinning; leads SOT343R detail scale DIMENSIONS original dimensions) UNIT 0.25 0.10 1.35 1.15 1.15 0.45 0.15 0.23 0.13 OUTLINE VERSION SOT343R REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-21 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values BF1105; BF1105R; BF1105WR This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications. Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale. 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs NOTES BF1105; BF1105R; BF1105WR 1997 Philips Semiconductors Product specification N-channel dual-gate MOS-FETs NOTES BF1105; BF1105R; BF1105WR 1997 Philips Semiconductors worldwide company Argentina: South America Australia: Waterloo Road, NORTH RYDE, 2113, Tel. 9805 4455, Fax. 9805 4466 Austria: Computerstr. A-1101 WIEN, P.O. 213, Tel. 1010, Fax. 1210 Belarus: Hotel Minsk Business Center, Bld. 1211, Volodarski Str. 220050 MINSK, Tel. +375 733, Fax. +375 Belgium: Netherlands Brazil: South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, James Bourchier Blvd., 1407 SOFIA, Tel. +359 211, Fax. +359 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. 7381 China/Hong Kong: Hong Kong Industrial Technology Centre, Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: South America Czech Republic: Austria Denmark: Prags Boulevard 1919, DK-2300 COPENHAGEN Tel. 2636, Fax. 0044 Finland: Sinikalliontie FIN-02630 ESPOO, Tel. +358 615800, Fax. +358 61580920 France: Carnot, BP317, 92156 SURESNES Cedex, Tel. 6161, Fax. 6427 Germany: D-20097 HAMBURG, Tel. Fax. Greece: 25th March Street, 17778 TAVROS/ATHENS, Tel. 4894 339/239, Fax. 4814 Hungary: Austria India: Philips INDIA Ltd, Band Building, floor, 254-D, Annie Besant Road, Worli, MUMBAI 025, Tel. 8541, Fax. 0966 Indonesia: Singapore Ireland: Newstead, Clonskeagh, DUBLIN Tel. +353 7640 000, Fax. +353 7640 Israel: RAPAC Electronics, Kehilat Saloniki 18053, AVIV 61180, Tel. +972 0444, Fax. +972 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza Novembre 20124 MILANO, Tel. 6752 2531, Fax. 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. 3740 5130, Fax. 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. 1412, Fax. 1415 Malaysia: Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. 5214, Fax. 4880 Mexico: 5900 Gateway East, Suite 200, PASO, TEXAS 79905, Tel. +9-5 7381 Middle East: Italy Netherlands: Postbus 90050, 5600 EINDHOVEN, Bldg. Tel. 82785, Fax. 88399 Zealand: Wagener Place, C.P.O. 1041, AUCKLAND, Tel. 4160, Fax. 7811 Norway: Manglerud 0612, OSLO, Tel. 8000, Fax. 8341 Philippines: Philips Semiconductors Philippines Inc., Valero Salcedo Village, P.O. 2108 MCC, MAKATI, Metro MANILA, Tel. 6380, Fax. 3474 Poland: Lukiska 04-123 WARSZAWA, Tel. 2831, Fax. 2327 Portugal: Spain Romania: Italy Russia: Philips Russia, Usatcheva 35A, 119048 MOSCOW, Tel. 6918, Fax. 6919 Singapore: Lorong Payoh, SINGAPORE 1231, Tel. 2538, Fax. 6500 Slovakia: Austria Slovenia: Italy South Africa: S.A. PHILIPS Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. 7430 Johannesburg 2000, Tel. 5911, Fax. 5494 South America: Vicente Pinzon, 173, floor, 04547-130 PAULO, Brazil, Tel. 2333, Fax. 2382 Spain: Balmes 08007 BARCELONA, Tel. 6312, Fax. 4107 Sweden: Kottbygatan Akalla, S-16485 STOCKHOLM, Tel. 2000, Fax. 2745 Switzerland: Allmendstrasse 140, CH-8027 Tel. 2686, Fax. 7730 Taiwan: Philips Semiconductors, Chien Rd., Sec. TAIPEI, Taiwan Tel. +886 2134 2865, Fax. +886 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. 4090, Fax. 0793 Turkey: Talatpasa Cad. 80640 Tel. 2770, Fax. 6707 Ukraine: PHILIPS UKRAINE, Patrice Lumumba str., Building Floor 252042 KIEV, Tel. +380 2776, Fax. +380 0461 United Kingdom: Philips Semiconductors Ltd., Bath Road, Hayes, MIDDLESEX 5BX, Tel. 5000, Fax. 8421 United States: East Arques Avenue, SUNNYVALE, 94088-3409, Tel. 7381 Uruguay: South America Vietnam: Singapore Yugoslavia: PHILIPS, Pasica 5/v, 11000 BEOGRAD, Tel. +381 344, Fax.+381 other countries apply Philips Semiconductors, International Marketing Sales Communications, Building BE-p, P.O. 218, 5600 EINDHOVEN, Netherlands, Fax. 24825 Philips Electronics N.V. 1997 Internet: SCA56 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Printed Netherlands 117067/00/03/pp16 Date release: 1997 Document order number: 9397 03136 Other recent searchesUCC3981 - UCC3981 UCC3981 Datasheet UCC39811 - UCC39811 UCC39811 Datasheet SN74BCT757 - SN74BCT757 SN74BCT757 Datasheet Q24S30018 - Q24S30018 Q24S30018 Datasheet BC307 - BC307 BC307 Datasheet
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