MARKETING PART NUMBER CY7C901 CY7C910 DEVICE DESCRIPTION CMOS Four-Bit

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MARKETING PART NUMBER CY7C901 CY7C910 DEVICE DESCRIPTION CMOS Four-Bit

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MARKETING PART NUMBER CY7C901 CY7C910 DEVICE DESCRIPTION CMOS Four-Bit Slice CMOS Microprogram Controller
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C901/CY7C910 CMOS Four-Bit Slice (CY7C901) CMOS Microprogram Controller (CY7C910) Cypress Semiconductor Corporation mils mils (CY7C901) What markings Die: mils mils (CY7C910) Sept/1991 (CY7C910) Jul/1993 (CY7C901)
Overall Mask) Level (pre-requisite qualification):
Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process CMOS, Single Poly, Single Metal /1.2 SiO2 Cypress Semiconductor Round Rock, Fab2/L13 Generic Process Technology/Design Rule (µ-drawn): Metal Composition: None SiAl, 15KA Oxynitride
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CYPRESS SEMICONDUCTOR
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Copper Solder Plated, 85%Sn, 15%Pb Silver Spot Paste Thermosonic Attach Dim: Attach Material: Wire Material/Size: Omedata, Indonesia INDNS-O/P4061X mils mils(901) mils mils(910) Silver Epoxy Gold 40-pin,600-mil PDIP (CY7C901/910) mils side (CY7C901) mils side (CY7C910) Sumitomo EME-6300H(R)
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb None Attach Dim: Attach Material: Wire Material/Size: USA-C/D406C mils mils Silver Glass Aluminum 1.25 40-pin, 600-mil CerDIP (CY7C910) mils side
Cypress Semiconductor Jose,
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CYPRESS SEMICONDUCTOR
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain:
Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly Anam, Korea (PLCC) Omedata, Indonesia (PDIP) Cypress Bangkok, Thailand (CDIP, LCC) PLCC, (CY7C910) PLCC, LCC, CDIP (CY7C901) >2,000V Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 130°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Temperature Cycles (-40°C 165°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Operating Life (temp): Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Tests (MIL-STD 883, method 3015) Other: Read Record Life Test 150°C
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CYPRESS SEMICONDUCTOR
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: CY7C901/CY7C910 Cypress Semiconductor Rated Speed (ns) Size/ Type Rev. Size Design Rule (stepping) Fabrication Passivation Mold Type Compound Assembly Line Location Volt Availa Rating bility (mm/y
Supplier's Part Number
Process Line CY7C901 -**PC -**JC -**DC/DMB -**LC/LMB -**PC -**JC -**DC/DMB -**LC/LMB 40.6 PDIP PLCC 40.6 CDIP 40.6 PDIP PLCC 40.6 CDIP 1.2µ CMOS Oxynitride Oxynitride Sumitomo Omedata, Indonesia Anam, Korea CBI, Thailand CBI, Thailand Sumitomo Omedata, Indonesia Anam, Korea CBI, Thailand CBI, Thailand >2,200V 09/91
CY7C910
1.2µ
CMOS
>2,200V
08/93
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C910 40-pin, 600-mil PDIP, 40-pin, 600-mil CDIP
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Fab2, Round Rock, Cypress Semiconductor,
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7C910-DC CY7C910-DC Assy Lot# 77377 77681 2125570 2125570 Hours 0/791 0/878 Hours 0/661 0/877 Hours 0/649 0/869 Cumulative 0/1669
High Temperature Dynamic Operating Life (HTOL, 7.0V, 125°C) Early Failure Rate Device CY7C910-PCF Assy Lot# 81860 2212320 Hours 0/9911 Hours 0/9812 Hours 0/981 Cumulative 0/991
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C910-DC Assy Lot# 77377 Lot# 2125570 Hours 0/345 Hours 0/345 Cumulative 0/345
High Temperature Dynamic Operating Life (HTOL, 7.0V, 125°C) Latent Failure Rate Device CY7C910-PC Assy Lot# 81860 Lot# 2212320 Hours 0/980 Hours 0/350 Cumulative 0/980
High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device CY7C910-DC CY7C910-PC Assy Lot# 77377 81860 Lot# 2125570 2212320 Hours 0/74 0/80 Hours 0/74 0/80 Cumulative 0/154
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C910 40-pin, 600-mil PDIP, 40-pin, 600-mil CDIP
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Fab2, Round Rock, Cypress Semiconductor,
Temperature Cycle (Condition -65°C 150°C) Device CY7C910-DC Assy Lot# 77377 Lot# 2125570 Cycles 0/45 1000 Cycles 1/453 1000 Cycles Cumulative 1/45
Temperature Cycle (JEDEC Condition -40°C 125°C) Device CY7C910-PC Assy Lot# 81860 Lot# 2212320 Cycles 0/50 1000 Cycles 1/50 1000 Cycles Cumulative 0/50
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C910-PC Assy Lot# 81860 Lot# 2212320 Hours 0/50 Cumulative 0/50
High Accelerated Saturation Test (HAST, 5.5V, 130°C, 85%RH, 15psig) Device CY7C910-PC Assy Lot# 81860 Lot# 2212320 Hours 0/48 Read Record (7.0V, 125°C) Device CY7C910-OC Assy Lot# 81860 Lot# 2212320 Hours 0/10 Hours 0/10 Hours 0/10 Cumulative 0/10 Cumulative 0/48
Mechanical
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C910 40-pin, 600-mil PDIP, 40-pin, 600-mil CDIP
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Fab2, Round Rock, Cypress Semiconductor,
Electrostatic Discharge CY7C910 Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard banded)
Latchup Testing Cypress Internal Latch-up Procedure Current Injection 200mA Trigger Socket Temp 125°C
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
CY7C901 40-pin, 600-mil PDIP
DEVICE RELIABILITY SUMMARY
Wafer Fab: Assembly:
Fab2, Round Rock, Omedata, Indonesia (PDIP)
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device CY7C901-PC Assy Lot# 62512 2051593 Hours 0/2028 Hours 0/2028 Cumulative 1/2094
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device CY7C901-PC Assy Lot# 62512 Lot# 2051593 Hours 0/348 Hours 0/348 Cumulative 0/348
Temperature Cycle (Condition -65°C 150°C) Device CY7C901-PC Assy Lot# 62512 Lot# 2051593 Cycles 0/80 1000 Cycles 0/80 1000 Cycles Cumulative 0/80
Autoclave (PCT, bias, 121°C, 100%RH, 15psig) Device CY7C901-PC Assy Lot# 62512 Lot# 2051593 Hours 0/100 Hours 0/100 Cumulative 0/100
High Accelerated Saturation Test (HAST, 5.5V, 130°C, 85%RH, 15psig) Device CY7C901-PC Assy Lot# 62512 Lot# 2051593 Hours 0/69 Hours 0/69 Cumulative 0/69
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CYPRESS SEMICONDUCTOR
Marketing Part: Description:
DEVICE RELIABILITY SUMMARY CY7C901 Wafer Fab: 40-pin, 600-mil PDIP Assembly:
Fab2, Round Rock, Omedata, Indonesia (PDIP)
Electrostatic Discharge CY7C901 Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard banded)
Latchup Testing Cypress Internal Latch-up Procedure Current Injection 200mA Trigger Socket Temp 125°C

MARKETING PART NUMBER CY7C901 CY7C910 DEVICE DESCRIPTION CMOS Four-Bit

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