CY7B991 (TTL) CY7B992 (CMOS) QUALIFICATION REPORT February,
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PROGRAMMABLE SKEWCLOCK BUFFER
CY7B991 (TTL) CY7B992 (CMOS)
QUALIFICATION REPORT
February, 1994 Version 92202/93462
PROGRAMMABLE SKEW CLOCK BUFFER CY7B991 (TTL) CY7B992 (CMOS)
CYPRESS TECHNICAL CONTACT QUALIFICATION DATA:
George Perreault Reliability Engineering Manager
PAGE
CYPRESS SEMICONDUCTOR
(408)943-6853
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Cypress Division: Size (stepping): CY7B991 CY7B992 Cypress Semiconductor Corporation, DataCom Group Rev. 7B991A/7B992A May, 1993 mils mils What markings Die: Device Description: PROGRAMMABLE SKEW CLOCK BUFFER (PSCB) Overall Mask) Level (pre-requisite qualification):
Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Metal Composition: Metal 1200A TiW, 6,000A 500A Metal 1,500A 10,000A
Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process
3,000A TEOS 15,000A Oxynitride Single Poly, Double Metal 0.8µm BiCMOS
Generic Process Technology/Design Rule (µ-drawn):
SiO2 Control gate Cypress Semiconductor, Jose, (Fab Cypress Semiconductor, Round Rock, (Fab 1/STARM13 2/STARM13
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Name/Location Assembly (prime) facility: Silver Syringe dispense Thermocompression Copper Solder Dipped, 63%Sn, 37%Pb Attach Dim: Attach Material: Wire Material/Size: ANAM, Korea ANAM J32RB PLCC: mils mils Silver Epoxy Gold 32-pin Rectangular Plastic Leaded Chip Carrier (PLCC) x=170 mils side; mils side Sumitomo EME-6300H(R)
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HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic None Solder Dipped, 63%Sn, 37%Pb Attach Dim: Attach Material: Wire Material/Size: LCC: mils mils Silver Glass Aluminum 1.25 32-pin Rectangular Leadless Chip Carrier (LCC) x=166 mils side; mils side
Alphatec, Bangkok, Thailand Alpha-X/L32Rl
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OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: None Cypress planning changes near future, identify change (Qtr/Yr) 4Q93 Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Fab1: Jose, Fab2: Round Rock, Rev. Process Change: Cross Licensee/Licensor: None 2,200V None None
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-40°C 125°C) Temperature Cycles (-65°C 150°C) Data Retention Bake, Plastic (185°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Steady State Life (HTSSL, 5.25V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Latchup Testing Other: Other: Other: Internal Water Vapor 125°C
CYPRESS SEMICONDUCTOR PAGE
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: BiCMOS Clock (CY7C991/992) Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Assembly Type Compound Line Location Volt Availabilit Rating (mm/yy)
Supplier's Part Number
Process Line CY7B991/ -**JC/JI CY7B922 CY7B991/ -**LC/LI/LMB CY7B922 32-pin PLCC 32-pin 0.8µ SM13B Plasma Oxynitride Sumitomo AnamKorea AlphatecThailand >2,200V
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DEVICE RELIABILITY SUMMARY
Device Type(s): Description: CY7B991/CY7B992 32-pins PLCC 32-pins Wafer Fab: Assembly: Jose, Anam Korea Alphatec Thailand
High Temperature Dynamic Operating Life (HTOL, 5.5V, 125°C) Early Failure Rate Device CY7B991-JC CY7B991-JC CY7B992-LC Lot# 1222664 1246520 1228851 Hours Hours Hours 0/535 0/900 0/325 Cumulative 0/1760
0/900
High Temperature Dynamic Operating Life (HTOL, 5.5V, 125°C) Latent Failure Rate Device CY7B991-JC CY7B992-LC Lot# 1222664 1228851 Hours Hours 0/250 0/322 1000 Hours 0/250 0/210 2000 Hours 0/250 Cumulative 0/5721
Group Subgroup Life Test (HTOL, 5.5V, 150°C) Device CY7B991-LMB CY7B992-LMB Lot# 1228852 1228851 Hours 0/50 0/48 Cumulative 0/98
High Temperature Steady State Life Test (HTSSL, 5.75V, 125°C) Device CY7B991-JC CY7B992-LC Lot# 1222664 1228851 Hours 0/75 0/71 Hours 0/75 0/71 Cumulative 0/1462
Temperature Cycle (Condition -40°C 125°C) Device CY7B991-JC Lot# 1222664 Cycles 0/46 1000 Cycles 0/46 Cumulative 0/46
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Temperature Cycle (Condition -65°C 150°C) Device CY7B992-LC Lot# 1228851 Cycles 0/44 1000 Cycles 0/44 Cumulative 0/443
Autoclave (PCT, bias, 121°C, 100% psig) Device CY7B991-JC Lot# 1222664 Hours 0/46 Cumulative 0/46
High Accelerated Saturation Test (HAST, 5.5V, 140°C, psig) Device CY7B991-JC Lot# 1222664 Hours 0/46 Cumulative 0/46
from 1228851. from 1222664. from 1228851.
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Device Reliability Summary
PROGRAMMABLE CLOCK SKEW BUFFER (FAB CY7B992 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 +2200V +2200V Unit Unit -2200V -2200V
+2200V Unit -2200V (Highest passing voltage, +10% Guard-banded)
Latchup (FAB1) Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Oscillation 7.5V 1MHz Temp 150°C
Other miscellaneous tests Input/Output capacitance Passed Read Record Passed Current Density Passed
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DEVICE RELIABILITY SUMMARY
Device Type(s): Description: CY7B991/CY7B992 32-pins PLCC 32-pins Wafer Fab: Assembly: Round Rock, Anam Korea Alphatec Thailand
High Temperature Dynamic Operating Life (HTOL, 5.5V, 125°C) Early Failure Rate Device CY7B991-JC CY7B991-JC CY7B991-JC CY7B992-LC 49304967 49304968 49306462 219306627 Hours 0/322 0/426 0/143 0/539 Cumulative 0/1429
High Temperature Dynamic Operating Life (HTOL, 5.5V, 125°C) Latent Failure Rate Device CY7B991-JC CY7B992-LMB Lot# 49304968 219306627 Hours 0/139 0/116 Hours 0/139 0/116 Cumulative 0/255
Group Subgroup Life Test (HTOL, 5.5V, 150°C) Device CY7B991-LMB CY7B992-LMB Lot# 219305442 219306627 Hours 0/77 0/77 Cumulative 0/154
High Temperature Steady State Life Test (HTSSL, 5.75V, 125°C) Device CY7B991-JC CY7B992-LMB Lot# 49304968 219306627 Hours 0/96 0/76 Hours 0/96 Cumulative 0/172
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Device Reliability Summary
PROGRAMMABLE CLOCK SKEW BUFFER (FAB CY7B992 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 +2200V +2200V Unit Unit -2200V -2200V
+2200V Unit -2200V (Highest passing voltage, +10% Guard-banded)
Latchup (FAB2) Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket Oscillation 7.5V 1MHz Temp 150°C
Other qualifications that affect this product family process Qual 92441 Qualification Description BiCMOS SRAM/SM23B TECHNOLOGY QUALIFIED
CYPRESS SEMICONDUCTOR PAGE
CYPRESS QUALIFICATION REPORT
Device CY7B161/162/164/166 CY7B185 FULL QUAL November, 1993 Prod. Family: BiCMOS SRAM Mask 6A166
Status: Complete Date:
Results:
PASS
Rate (FITs):
Process
SM23B
Technology:
BiCMOS
Process Loc:
Round Rock,
Package: Attach Mat:
24-pins, 300-mil Silver Epoxy
Mold Compound: Package Loc:
Sumitomo EME-6300H(R) Omedata, Indonesia
Lead Frame: Test Loc:
Copper Jose,
Cypress Test
Stress/Test
Reference Method Temp/Bias
Actual Conditions Hrs/Cyc Hrs. Hrs. SS/Fail 0/1123 0/2814 0/2813 1/2452 0/151 0/227 0/135
Status
Qualification Data Reference
Test Result Pass Fail
Early Failure Rate
29-00020
150°C/5.75V
QTP# 92441 QTP# 92441 QTP# 92441 QTP# 92441 QTP# 92441 QTP# 92441 QTP# 92441
Latent Failure Rate
29-00020
150°C/5.75V
Hrs. Hrs.
High Temp. Steady State
29-00020
150°C/5.75V
Hrs. Hrs.
Temperature Cycle
JEDEC22, COND.
40°C 125°C
Cyc.
Cyc. Pressure 29-00047 121°C. 100%RH, 30PSIA 5.5V,140°C 85%RH 150°C,5.75V Hrs.
0/135 0/90
QTP# 92441 QTP# 92441
HAST
29-00063
Hrs.
0/90
QTP# 92441
Long Life Verification
29-00020
1000 Hrs. 2000 Hrs.
0/332 0/332
QTP# 92441 QTP# 92441
Interim, Complete Particle related reject.
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