PRODUCT DESCRIPTION (for qualification) Information provided this

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PROM MARKETING PART NUMBER CY7C270 CY7C276 DEVICE DESCRIPTION Reprogrammable Processor-Specific PROM Reprogramable PROM
PRODUCT DESCRIPTION (for qualification)
Information provided this document intended generic qualification technically describes Cypress part supplied: Marketing Part Device Description: Cypress Division: Size (stepping): CY7C270 PROM Cypress Semiconductor Corporation mils mils What markings Die: 1/1993 7C270A
Overall Mask) Level (pre-requisite qualification): Cypress Qualification completion/Marketing Availability Dates (Current REV):
TECHNOLOGY/FAB PROCESS DESCRIPTION
Number Metal Layers: Passivation Type Materials: Free Phosphorus contents glass layer(%): Coating(s), used: Gate Oxide Material/Thickness (MOS): Name/Location (prime) Facility: Line ID/Wafer Process None Double Poly, Double Metal SiO2 Cypress Semiconductor, Round Rock, PLD20DJ Generic Process Technology/Design Rule (µ-drawn): Metal Composition: Metal 1%SiAl, Metal SiAl None
4,000A 15,000A Oxynitride
PLASTIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Assembly Line Process Name/Location Assembly (prime) facility: Epoxy Thermocompression Copper Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: Anam, Korea/ J44S mils mils Silver Epoxy Gold 44-pins Square PLCC mils side Sumitomo EME-6300H(R)
Cypress Semiconductor, Round Rock,
CYPRESS SEMICONDUCTOR PAGE
HERMETIC PACKAGE/ASSEMBLY DESCRIPTION
Package Outline, Type, Name: Package edge clearance: Mold Compound Name/Manufacturer: Lead Frame material: Lead Finish, composition: Attach Area Plating: Attach Method: Wire Bond Method: Name/Location Assembly (prime) facility: Assembly Line Process Paste Ultrasonic Alloy Solder Dipped, 63%Sn, 37%Pb Silver Attach Dim: Attach Material: Wire Material/Size: mils mils Silver Glass Aluminum 1.25 -Pin Windowed Leaded Chip Carrier mils side
Cypress Semiconductor, Jose, Cypress Semiconductor H44S
CYPRESS SEMICONDUCTOR PAGE
OTHER INFORMATION
approval similarity, identify other devices using same basic with bonding metal mask options test selections explain: CY7C270/276 Cypress planning changes near future, identify change (Qtr/Yr) Design Rev./Shrink: Fab/Assembly site change: Other Devices qualified this technology: Other Packages qualified this device: Voltage Rating (per STD-008, Method 3018): Flammability Classification (UL-94V): Alternate Fab/Assembly Locations: None Assembly Anam, Korea Leadless Chip Carrier Windowed Leadless Chip Carrier >2,000V Process Change: Cross Licensee/Licensor:
Please attach following Qualification Reliability data revision Package type, assembly sites identified above (mark included): HAST (5.5V, 140°C, 85%RH, 15psig) Temperature Cycles (-65°C 150°C) Data Retention Bake, Plastic (165°C) Data Retention Bake, Hermetic (250°C) Autoclave (PCT, 121°C, 100%RH) Tests (MIL-STD 883, method 3015) Operating Life (temp): Latchup Testing Steady State Life (HTSSL, 5.75V, 150°C) Temperature Humidity Bias (5.5V, 85°C, 85%RH) Other: Other: Temperature cycle (-40°C 125°C) 150°C
CYPRESS SEMICONDUCTOR PAGE
PRODUCT INFORMATION QUALIFICATION SIMILARITY
Product Family: Division: CY7C270 Cypress Semiconductor Rated Speed Size/ Type Revision Size (stepping) Design Rule Fabrication Passivation Mold Type Compound Assembly Line Location Volt Availability Rating (mm/yy)
Supplier's Part Number
Process Line CY7C270 -**HC(HMB) -**JC -**LMB -**QMB -**HC(HMB) -**JC -**LMB -**QMB WHLCC PLCC WLCC WHLCC PLCC WLCC 0.8µ CMOS Oxynitride Oxynitride Sumitomo Hysol Sumitomo Hysol Jose, Anam, Korea Jose Anam, Korea >2,000V
CY7C276
O.8µ
CMOS
>2000V
CYPRESS SEMICONDUCTOR PAGE
DEVICE RELIABILITY SUMMARY
Marketing Part: Description: CY7C270 44-pin Square Windowed Leaded Chip Carrier 44-pin Square PLCC Wafer Fab: Assembly: Round Rock, Cypress Jose, Anam, Korea
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Early Failure Rate Device 7C270-JC 7C270-HC 7C270-HC 7C270-HC Lot# 89716 87442/8 87442/8 87442/8 Hours 1/213 0/189 0/1941 0/5172 Cumulative 1/1113 Topside damage,
High Temperature Dynamic Operating Life (HTOL, 5.75V, 150°C) Latent Failure Rate Device 7C270-JC 7C270-HC Lot# 89716 87442/8 Hours 0/194 0/193 Hours 0/193 0/193 Cumulative 0/387
Group Subgroup Life Test (HTOL, 5.75V, 150°C) Device 7C270-HMB Lot# 91001 Hours 0/78 High Temperature Steady State Life Test (HTSSL, 5.75V, 150°C) Device 7C270-JC 7C270-HC
1,2,3
Cumulative 0/78
Lot# 89716 87442/8
Hours 0/76 0/753
Hours 0/76 0/75
Cumulative 0/151
CYPRESS SEMICONDUCTOR PAGE
Data Retention Bake, Plastic Packaged Devices bias, 165°C) Device 7C270-JC Lot# 89716 Hours 0/76 Hours 0/76 Cumulative 0/76
Data Retention Bake, Hermetic Packaged Devices bias, 250°C) Device 7C270-HC Lot# 87442/8 Hours 0/76 Hours 0/76 Cumulative 0/76
Temperature Cycle (Condition -65°C 150°C) Device 7C270-HC Lot# 87442/8 Cycles 0/45 1000 Cycles 0/45 Cumulative 0/45
Temperature Cycle (JEDEC -40°C 125°C) Device 7C270-JC Lot# 89716 Hours 0/47 Hours 0/47 Cumulative 0/47
High Accelerated Saturation Test (HAST, 5.5V, 140°C, 85%RH, 15psig) Device 7C270-JC Lot# 89716 Hours 0/28 Hours Cumulative 0/28
CYPRESS SEMICONDUCTOR PAGE
Device Reliability Summary
92192 7C270 Electrostatic Discharge Human Body Model Circuit 883, Method 3015 >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V >+2,000V Unit >-2,000V (Highest passing voltage, +10% Guard-banded)
Latchup Testing Cypress Internal Latch-up Procedure Tests: Current Injection 200mA Trigger Socket VCC0 7.5V 1MHz Temp 150°C,
CYPRESS SEMICONDUCTOR PAGE
CYPRESS QUALIFICATION REPORT
Marketing Part: Status: Complete Date: Prod. Family: Results: Mask Rate (FITs):
Process
Technology:
Process Loc:
Package: Attach Mat:
Mold Compound: Package Loc:
Lead Frame: Test Loc:
Cypress Test
Stress/Test
Reference Method Temp/Bias
Actual Conditions
Status SS/Fail
Qualification Data Reference
Test Result
Hrs/Cyc
Pass
Fail
HTOL EFR/LFR High Temp. Bake/DRET HAST Steam Test/Autoclave/PCT Temperature Cycle Thermal Shock Accelerated Soft Error Rate System Soft Error Rate
Mechanical Sequence X-Ray ESD-HBM ESD-CDM Latch-up Flammability Oxygen Index Moisture Resistance Internal Water Vapor Solvent Resistance Internal Visual Physical Dimensions Solderability Lead Integrity Bond Strength Shear Strength Torque Corner Pins Corner Pins Internal Pins Internal Pins
Interim, Complete

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