User's Guide Mixed-Signal Products SLOU037 IMPORTANT NO

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THS7002 Programmable Gain Amplifier Evaluation Module
User's Guide
Mixed-Signal Products
SLOU037
IMPORTANT NOTICE Texas Instruments subsidiaries (TI) reserve right make changes their products discontinue product service without notice, advise customers obtain latest version relevant information verify, before placing orders, that information being relied current complete. products sold subject terms conditions sale supplied time order acknowledgement, including those pertaining warranty, patent infringement, limitation liability. warrants performance semiconductor products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques utilized extent deems necessary support this warranty. Specific testing parameters each device necessarily performed, except those mandated government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS INVOLVE POTENTIAL RISKS DEATH, PERSONAL INJURY, SEVERE PROPERTY ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). SEMICONDUCTOR PRODUCTS DESIGNED, AUTHORIZED, WARRANTED SUITABLE LIFE-SUPPORT DEVICES SYSTEMS OTHER CRITICAL APPLICATIONS. INCLUSION PRODUCTS SUCH APPLICATIONS UNDERSTOOD FULLY CUSTOMER'S RISK. order minimize risks associated with customer's applications, adequate design operating safeguards must provided customer minimize inherent procedural hazards. assumes liability applications assistance customer product design. does warrant represent that license, either express implied, granted under patent right, copyright, mask work right, other intellectual property right covering relating combination, machine, process which such semiconductor products services might used. TI's publication information regarding third party's products services does constitute TI's approval, warranty endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
Preface
Related Documentation From Texas Instruments
THS7002 PROGRAMMABLE-GAIN AMPLIFIER (literature number SLOS214) This data sheet THS7002 amplifier integrated circuit used EVM. THS4001 HIGH-SPEED LOW-POWER OPERATIONAL AMPLIFIER (literature number SLOS206) This data sheet THS4001 amplifier integrated circuit used EVM. PowerPADThermally Enhanced Package (literature number SLMA002) This technical brief special PowerPAD package which THS7002 amplifier supplied.
Warning
This equipment intended laboratory test environment only. generates, uses, radiate radio frequency energy been tested compliance with limits computing devices pursuant subpart part rules, which designed provide reasonable protection against radio frequency interference. Operation this equipment other environments cause interference with radio communications, which case user expense will required take whatever measures required correct this interference.
Trademarks
trademark Texas Instruments Incorporated. PowerPAD trademark Texas Instruments Incorporated.
Chapter Title-Attribute Reference
Running Title-Attribute Reference
Contents
General Information Features Description Programmable Gain Amplifier Gain Control Switch Functionality Circuit Configuration 1-10 Using THS7002 1-12 THS7002 Performance 1-13 General High-Speed Amplifier Design Considerations 1-16 General PowerPAD Design Considerations 1-17 1.10 THS7002 Specifications 1-20
Reference THS7002 Programmable-Gain Amplifier Parts List THS7002 Board Layouts
Chapter Title-Attribute Reference
Running Title-Attribute Reference
Figures
1-10 1-11 1-12 1-13 THS7002 Evaluation Module THS7002 Power Conditioning Schematic Diagram THS7002 Schematic Diagram Simplified Section THS7002 THS7002 Evaluation Module Block Diagram 1-10 THS7002 Preamplifier Frequency Response 1-13 THS7002 Preamplifier Phase Response 1-13 THS7002 Frequency Response 1-14 THS7002 Phase Response 1-14 THS7002 Preamplifier Frequency Response 1-15 THS7002 Preamplifier Phase Response 1-15 PowerPAD Etch Pattern 1-17 Maximum Power Dissipation Free-Air Temperature 1-18 THS7002 Component Placement Silkscreen Solder Pads THS7002 Board: Assembly THS7002 Board: Layer THS7002 Board: Bottom Layer
Tables
THS7002 Nominal Gain/Attenuation Switch Functionality THS7002 Jumper Settings 1-12 THS7002 Switch Settings 1-12 THS7002 Programmable-Gain Amplifier Parts List
Chapter
General Information
This chapter details Texas Instruments (TITM) THS7002 programmable-gain amplifier evaluation module (EVM), SLOP136. includes list features, brief description module illustrated with pictorial schematic diagrams, specifications, details configuring, connecting, using EVM, discussion high-speed amplifier PowerPAD package design considerations.
Topic
Page
Features Description Programmable Gain Amplifier Gain Control Switch Functionality CIrcuit Configuration 1-10 Using THS7002 1-12 THS7002 Performance 1-13 General High-Speed Amplifier Design Considerations 1-16 General PowerPADDesign Considerations 1-17
1.10 THS7002 Specifications 1-20
General Information
Features
Features
THS7002 programmable-gain amplifier features include:
Multiple Input Configurations On-board Jumpers Switches Allow Quick Easy Adjustment Gain, Shut Down, Reference Voltage, Output Clamping Includes THS4001 High-Speed Amplifier Inverter Standard Connectors Inputs Outputs 15-V Operation with Reference Input Nominal Impedance Inputs Outputs Includes Test Points Easy Digital Control Circuit Gain Operating Parameters Good Example PowerPAD Package High-Speed Amplifier Design Layout
Description
THS7002 programmable-gain amplifier evaluation module (EVM) complete dual-channel low-noise receiver highly configurable programmable-gain amplifier circuit. consists THS7002 Programmable-Gain Amplifier THS4001 high-speed, low-power operational amplifier number passive parts, mounted multilayer circuit board (Figure 1-1). Although THS7002 developed primarily xDSL receiver front-ends, there large number different circuits that benefit from many features incorporated into THS7002. This illustrates universal design used numerous system configurations. uses standard connectors inputs outputs also includes test points user connections testing. completely assembled, fully tested, ready just connect power, signal source, load desired).
General Information
Description
Figure 1-1. THS7002 Evaluation Module
SLOP136 Rev.
THS7002 Board
+VCC
-VCC
AS/D AVREF
Pre-Amp Output
1998
Input
Texas Instruments
Output
Output
BVREF BS/D
Input
Pre-Amp Output
Input power applied through banana jacks filter each power isolates circuits from external supply (Figure 1-2). provides reference point numerous circuit functions draws relatively little current. schematic amplifiers appears Figure 1-3.
Figure 1-2. THS7002 Power Conditioning Schematic Diagram
0.22 -VCC 0.22
General Information
R23,
C19, U1-B 49.9 S1-F C20, S2-A S2-B S2-C 49.9 AVREF S1-D S1-E AS/D C10, 49.9
U1-A THS7002 -Vcc C18, TP12 U2-Out U1-C 49.9 Pre-amp Output THS4001 49.9 Pre-amp VREF VIN-
Input
R27,
R25,
R35,
R37,
C14,
R39,
Input
VREF
C17, TP2, TP4, AG2, S2-F R24, R26, R28, C12, PGA-A Output BG2, BG1, TP10 BG0, TP11 R36, R38, R40, U1-D VIN- PGA-B Output 49.9 BVREF TP14 S2-D BS/D TP13 S2-E
Description
49.9
49.9
General Information
Figure 1-3. THS7002 Schematic Diagram
Description
THS7002 equipped with separate input connector each channels module. Each input terminated with resistor provide correct line impedance matching (Figure 1-3). Note that using source with output impedance will create voltage divider inputs. Thus, accurate knowledge source output characteristics required determine proper input signal amplitudes. outputs preamplifier stages routed through resistors provide proper cable impedance matching termination impedance matching. drawbacks using this type impedance matching that places equivalent 100- load output preamplifiers. Although preamplifier sections have large output current capability, programmable gain amplifier (PGA) sections have limited current drive capability. recommended that total impedance placed outputs section least THS4001 THS7002 voltage feedback amplifiers. They follow classic operational amplifier gain equations: Inverting Gain
Non-Inverting Gain
gain these amplifiers easily changed support different applications changing resistor ratios. Although components board replaced with different values, imperative that THS7002 preamplifier gain kept minimum stability purposes. Also, component pads have been placed convenient locations (shown components with value schematic) allow numerous modifications basic configuration. However, care must taken because surface-mount solder pads board somewhat fragile will survive large number soldering/desoldering operations. single-ended input configurations, THS4001 used invert incoming signal drive second channel THS7002. This allows single-to-differential analysis EVM. However, simply moving jumper (JP3) using second input connector (J7), differential source independent signals seen outputs. independent evaluation preamplifiers, connectors directly preamplifier output pins allow user investigate these amplifiers independently sections.
General Information
Description
shutdown feature THS7002 implemented this EVM. There separate shutdown each half THS7002 shutdown signals normal THS7002 operation. When shutdown high corresponding preamplifier section turned off. Shutdowns controlled switches S1:D channel) S2:D channel), applying external shutdown signal test-points channel) TP13 channel) with switches OFF. Isolation resistors THS7002 shutdown control input pins used minimize surges environment omitted final system design.
General Information
Programmable Gain Amplifier Gain Control
Programmable Gain Amplifier Gain Control
Each channel THS7002 provided with three digital control inputs setting gain stage (AG0 BG2). Standard CMOS Logic signals operate these control inputs. gain control inputs latched respond control signals real time. Therefore, control signals these inputs must remain constant gain remain constant. stand-alone evaluation this function, onboard switches (S1:A S1:C S2:A S2:C) used control gain each PGA. Note that switch gain control elements must gain digital control signals. convenience, test points (TP2 TP11) placed each these lines allow easy external connections. There 330- isolation resistors series with each gain control input pins. These were added only surge suppression required actual system design. Nominal gain/attenuation shown Table 1-1.
Table 1-1. THS7002 Nominal Gain/Attenuation
Gain (dB) Gain (V/V) 0.08 0.16 0.32 0.63 1.26 2.52 5.01
aspect THS7002 signal inputs that must considered that there internal variable resistors that gain. resistance changes from about (gain about (gain dB). Therefore, source impedance input amplifiers will cause gain error seen output. buffer/amplifier highly recommended directly drive input section help minimize this effect. Another consideration that when each amplifier VREF connected ground, internal resistor connected virtual ground. Therefore, termination resistor used source side, total terminating resistance parallel combination terminating resistance internal resistor. This, conjunction with series impedance problem mentioned previously, potentially cause voltage mismatch between output source expected output voltage. These points illustrated following formula simplified diagram THS7002 section shown Figure 1-4. TOTALTERMINATION
TERMINATION TERMINATION
SOURCE
SOURCE
General Information
Programmable Gain Amplifier Gain Control
Figure 1-4. Simplified Section THS7002
Source Impedance -VIN RSOURCE RTERMINATION VREF VOUT Negative Clamp THS7002
Positive Clamp
VREF terminals also accessible test points TP14. Typically, switches used keep this point ground. voltage applied this terminal, then output section will amplify applied reference voltage plus selected gain. Thus, output gain only VREF will from +0.6 according following formula:
Gain(V
Typically, output will directly drive converter. Because limited linear input range saturation characteristics most ADCs, outputs incorporate voltage clamp. Because internal clamps same clamping reference voltages, outputs both PGAs clamped same values. These clamps typically connected power supply pins allow full output range. However, setting switch S1:F setting switch S2:F outputs will clamped either +Vcc (depending JP5) ground. outputs further limited applying external reference voltage test points (VH) (VL). accuracy this clamp dependant amount current flowing through internal clamping diodes. typical with diodes, voltage drop across this diode increases with current. Therefore, accuracy clamp highly dependant upon output voltage, clamping voltage differences, output current. series resistors placed this only surge suppression. final system layout, these resistors required proper operation.
General Information
Switch Functionality
Switch Functionality
THS7002 fully evaluated without external digital control signals applied. This accomplished through banks switches. Each switch bank incorporates SPST switches labeled through functionality each switch described Table 1-2.
Table 1-2. Switch Functionality
SWITCH S1:A S1:B S1:C S1:D S1:E S1:F S2:A S2:B S2:C S2:D S2:E S2:F LABEL A-G0 A-G1 A-G2 A-S/D A-VREF VREF B-G2 B-G1 B-G0 B-S/D B-VREF VREF POSITION DESCRIPTION A-Channel Gain (LSB): Value (Low) A-Channel Gain (LSB): Value (High) A-Channel Gain Value (Low) A-Channel Gain Value (High) A-Channel Gain (MSB): Value (Low) PGA- A-Channel Gain (MSB): Value (High) A-Channel Shutdown: Value (Low) Side Active A-Channel Shutdown: Value (High) Side Shutdown A-Channel VREF Floating (Connect Ext. Ref.) A-Channel VREF Connected Ground Side Clamp Ground (Connect Ref) Side Clamp Connected -Vcc B-Channel Gain (MSB): Value (Low) B-Channel Gain (MSB): Value (High) B-Channel Gain Value (Low) B-Channel Gain Value (High) B-Channel Gain (LSB): Value (Low) B-Channel Gain (LSB): Value (High) B-Channel Shutdown: Value (Low) Side Active B-Channel Shutdown: Value (High) Side Shutdown B-Channel VREF Floating (Connect TP14 Ref) B-Channel VREF Connected Ground High Side Clamp Ground (Connect Ref) High Side Clamp Connected (Vcc
General Information
Circuit Configuration
Circuit Configuration
THS7002 design allows evaluation each section THS7002 amplifier separately well differential system. Configuration accomplished through jumpers mounted module PCB. Each jumper three-pin header that acts SPDT switch when shunt placed across three pins select either signal routes (Figure 1-5).
Figure 1-5. THS7002 Evaluation Module Block Diagram
Preamp Input
THS7002
Clamp
THS7002
Output Preamp Output
U1:A
THS4001
U1:C
THS7002
THS7002
Output Preamp Output
Input Inverter
Preamp
Jumper JP1:
Connects input A-channel (U1: input (J6), bypassing THS7002 A-channel preamplifier (U1:A) Connects input A-channel (U1: output A-channel preamplifier (U1:A)
Jumper JP2:
1-10
Connects inverting input terminal B-channel preamplifier (U1:C) signal from (either THS4001 inverting amplifier (U2) output input (J7) signal, depending setting JP3). order this functionality, components R13, must selected installed user Connects noninverting input terminal B-channel preamplifier (U1:C) signal from
Jumper JP3: Connects input B-channel preamplifier (U1: B-channel (U1:D) output THS4001 inverting amplifier (U2). This signal inverted version input (J6) signal Connects input B-channel preamplifier (U1: B-channel (U1:D) input (J7)
General Information
Circuit Configuration
Jumper JP4:
Connects input B-channel (U1: signal from Connects input B-channel (U1: output B-channel preamplifier (U1:C)
Jumper JP5:
Connects THS7002 positive clamp input (VH) when switch S2:F appropriately Connects THS7002 positive clamp input (VH) when switch S2:F appropriately
example, single-ended input preamplifiers buffers gain: Apply input input (J6) output THS7002 PGAs differential signal inverter (U2). either independent differential signal source, should position.
General Information
1-11
Using THS7002
Using THS7002
THS7002 operates from split power supply with voltages ranging from also uses volt logic control signals configure operation when switches used. single supply this recommended. shipped, preamplifiers gain configured single-ended input that uses preamplifiers directly drive stages. oscilloscope typically used view analyze output signals. Ensure that power supplies before making power supply connections THS7002 EVM. Select operating voltage connect appropriate split power supplies banana jacks module marked +VCC (J1) -VCC (J3). Connect power supply banana jack marked (J4). Connect power supply grounds banana jack marked (J2). Connect oscilloscope probe PGA-A amplifier output (J9). Connecting directly with nominal impedance cable probe recommended. output drive capability PGAs very limited. Such connection will load output excessively, reducing output voltage range amplifier true measurement amplifier performance. jumpers shown Table 1-3.
Table 1-3. THS7002 Jumper Settings
switch elements shown Table 1-4.
Table 1-4. THS7002 Switch Settings
SWITCH S1:A S1:B S1:C S1:D S1:E S1:F LABEL A-G0 A-G1 A-G2 A-S/D A-VREF POSITION SWITCH S2:A S2:B S2:C S2:D S2:E S2:F LABEL B-G2 B-G1 B-G0 B-S/D B-VREF POSITION
power supplies Connect signal input INPUT (J6). Note that each input connector this terminated with resistor ground. With source impedance, voltage seen THS7002 amplifier will source signal voltage applied input connector.
Verify output signal oscilloscope using high-impedance probe voltage gain approximately should observed.
1-12
General Information
THS7002 Performance
THS7002 Performance
Figure shows typical frequency response Figure shows typical phase response THS7002 preamplifiers. Typical bandwidth with 15-V power supply preamplifier each channel with power supply.
Figure 1-6. THS7002 Preamplifier Frequency Response
Output Amplitude Vp-p Frequency 100M 500M
100k
Figure 1-7. THS7002 Preamplifier Phase Response
Output Phase
-120
-150 -180 100k
Vp-p Frequency 100M 500M
General Information
1-13
THS7002 Performance
Figure shows typical frequency response Figure shows typical phase response THS7002 PGAs. This data collected with gain Typical bandwidth with power supply with 15-V power supply.
Figure 1-8. THS7002 Frequency Response
Output Amplitude Vp-p Frequency 100M 500M
100k
Figure 1-9. THS7002 Phase Response
Output Phase
Vp-p Frequency 100M 500M
100k
1-14
General Information
THS7002 Performance
Figure 1-10 shows typical frequency response Figure 1-11 shows typical phase response THS7002 preamplifiers PGAs. This data collected with preamplifiers directly driving inputs. gain Typical bandwidth with power supply with 15-V power supply.
Figure 1-10. THS7002 Preamplifier Frequency Response
Output Amplitude Vp-p Frequency 100M 500M
100k
Figure 1-11. THS7002 Preamplifier Phase Response
Output Phase
Vp-p Frequency 100M 500M
100k
General Information
1-15
General High-Speed Amplifier Design Considerations
General High-Speed Amplifier Design Considerations
THS7002 layout been designed optimized with high-speed signals used example when designing THS7002 applications. Careful attention been given component selection, grounding, power supply bypassing, signal path layout. Disregard these basic design considerations could result less than optimum performance THS7002 dual differential line drivers receivers Surface-mount components were selected because extremely lead inductance associated with this technology. Also, because surface-mount components physically small, layout very compact. This helps minimize both stray inductance capacitance. Tantalum power supply bypass capacitors (C4, C21) power input pads help supply currents rapid, large signal changes amplifier output. power supply bypass capacitors (C2, C11, C12, C18, C19) were placed close possible power input pins order keep trace inductance minimum. This improves high-frequency bypassing reduces harmonic distortion. proper ground plane both sides should always used with high-speed circuit design. This provides low-inductive ground connections return current paths. area preamplifier input pins, however, ground plane removed minimize stray capacitance reduce ground plane noise coupling into these pins. This especially important inverting while amplifier operating noninverting mode. Because voltage this swings directly with noninverting input voltage, stray capacitance would allow currents flow into ground plane, causing possible gain error and/or oscillation. Capacitance variations amplifier input less than significantly affect response amplifier. general, always best keep signal lines short straight possible. Sharp corners should generally avoided round corners series bends should used, instead. Stripline techniques should also incorporated when signal lines greater than inches length. These traces should designed with characteristic impedance either required application. Such signal lines should also properly terminated with appropriate resistor. Finally, proper termination inputs outputs should incorporated into layout. Unterminated lines, such coaxial cable, appear reactive load amplifier terminating transmission line with characteristic impedance, amplifier's load then appears purely resistive, reflections absorbed each line. Another advantage using output termination resistor that capacitive loads isolated from amplifier output. This isolation helps minimize reduction amplifier phase-margin improves amplifier stability improved performance such reduced peaking settling times.
1-16
General Information
General PowerPAD
Design Considerations
General PowerPAD
Design Considerations
THS7002 mounted special package incorporating thermal that transfers heat from directly PCB. PowerPAD package constructed using downset leadframe. mounted leadframe electrically isolated from bottom surface lead-frame exposed metal thermal underside package makes physical contact with PCB. Because this thermal direct physical contact with both PCB, excellent thermal performance achieved providing good thermal path away from thermal mounting point PCB. Although there many ways properly heatsink this device, following steps illustrate recommended approach used THS7002 EVM, which built multilayer with internal ground plane. Prepare with side etch pattern shown Figure 1-12. There should etch leads well etch thermal pad.
Figure 1-12. PowerPAD Etch Pattern
Thermal area (0.15 0.17) with vias (Via diameter mils)
Place holes area thermal pad. These holes should mils diameter. They kept small that solder wicking through holes problem during reflow. Additional vias under package, outside thermal area, will improve heat transfer required. These holes should mils diameter. They larger because they area soldered that wicking problem. Connect holes, within thermal area others outside area, internal ground plane. When connecting these holes ground plane, typical spoke connection methodology. connections have high thermal resistance connection that useful slowing heat transfer during soldering operations. This makes soldering vias that have plane connections easier. However, this application, thermal resistance desired most efficient heat transfer. Therefore, holes under THS7002 package should make their connection internal ground plane with complete connection around entire circumference plated through hole.
General Information
1-17
General PowerPAD
Design Considerations
top-side solder mask should leave exposed terminals package thermal area with holes. larger holes outside thermal area, still under package, should covered with solder mask. Apply solder paste exposed thermal area operational amplifier terminals. With these preparatory steps place, THS7002 simply placed position through solder reflow operation standard surface-mount component. This results part that properly installed. actual thermal performance achieved with THS7002 PowerPAD package depends application. example above, size internal ground plane approximately inches inches, then expected thermal coefficient, about 27.8_C/W. given maximum power dissipation shown Figure 1-13 calculated following formula:
Where:
Maximum power dissipation THS7002 (watts) TMAX Absolute maximum junction temperature (150°C) Free-ambient temperature (°C) Thermal coefficient from junction case (0.72 °C/W) Thermal coefficient from case ambient (°C/W)
Figure 1-13. Maximum Power Dissipation Free-Air Temperature
MAXIMUM POWER DISSIPATION FREE-AIR TEMPERATURE
Maximum Power Dissipation 56.2°C/W Trace Copper without Solder 27.9°C/W Trace Copper with Solder 150°C Size Flow
Free-Air Temperature
1-18
General Information
General PowerPAD
Design Considerations
Even though THS7002 different than example above, results should give idea much power dissipated PowerPAD package. THS7002 good example proper thermal management when using PowerPAD-mounted devices. Correct layout manufacturing techniques critical achieving adequate transfer heat away from PowerPAD package. More details proper board layout found THS7002 PROGRAMMABLEGAIN AMPLIFIER data sheet (SLOS214). more general information PowerPAD package thermal characteristics, Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package (SLMA002).
General Information
1-19
THS7002 Specifications
1.10 THS7002 Specifications
Supply voltage range, Supply current, Input voltage, VCC, Output drive, THS7002 Preamplifiers, Output drive, THS7002 PGA, Continuous total power dissipation 25°C (THS7002), complete THS7002 amplifier specifications parameter measurement information, additional application information, THS7002 data sheet, Literature Number SLOS214.
1-20
General Information
Chapter
Reference
This chapter includes parts list layout illustrations THS7002 EVM.
Topic
Page
THS7002 Dual Differential Line Drivers Receivers Parts List THS7002 Board Layouts
Reference
THS7002 Programmable-Gain Amplifier Parts List
THS7002 Programmable-Gain Amplifier Parts List
Table 2-1. THS7002 Parts List
Reference C11, C12, SW1, R15, R18, R31, R16, R44, R23, R25, R27, R29, R33, R35, R37, R10, R24, R26, R28, R30, R34, R36, R38, R32, TP14 R12, R13, C10, C13, Description CAPACITOR, CERAMIC, 20%, TANTALUM, CAPACITOR, CERAMIC, 10%, 0805 Size Manufacturer/Distributor Part Number (SPRAGUE) 293D685X9035D2T (MuRata) GRM40-X7R104K25
INDUCTOR, 0.22 AXIAL, THRU HOLE CONNECTOR, VERTICAL MOUNT, THRU HOLE JACK, BANANA RECEPTACLE, 0.025 DIA. HOLE HEADER, PIN, CTRS., 0.025 PINS SHORTING JUMPERS, CTRS, 0.025 PINS 6PST SWITCH (CTS Series Gold Finish) RESISTOR, RESISTOR, RESISTOR, 49.9 1/10 RESISTOR, 49.9 RESISTOR, RESISTOR, 1/10 1206 0805 0805 1206 1206 0805
(DELEVAN) DN41221/ (DIGI-KEY) DN41221-ND (MOUSER) 523-31-5329 (NEWARK) 35F865 (DIGI-KEY) S1021-36-5329
(DIGI-KEY) CT2196MST-ND
RESISTOR, 1/10 RESISTOR, RESISTOR, 1/10
0805 1206 0805
RESISTOR, 1/10 THS7002CPWP AMP, THS4001CD TEST POINT, (RED) TEST POINT, (BLACK) RESISTOR, OHMS, CAPACITOR, CERAMIC
0805 SOIC-8
(TI) THS7002CPWP (TI) THS4001CD (FARNELL) 240-345 (FARNELL) 240-333
0805
4-40 THREAD STANDOFFS 0.625" LENGTH, 0.250" 4-40 THREAD SCREWS
(MOUSER) 534-1804
PCB1 PCB, THS7002 SLOP136 values these components determined user accordance with application requirements.
Reference
THS7002 Board Layouts
THS7002 Board Layouts
Board layout examples THS7002 shown following illustrations. They scale appear here only reference.
Figure 2-1. THS7002 Component Placement Silkscreen Solder Pads
SLOP136 Rev.
THS7002 Board
-VCC
AS/D AVREF
Pre-Amp Output
1998
Texas Instruments
Input
U2-Out
Output
Input
BVREF BS/D
Output
Pre-Amp Output
Reference
THS7002 Board Layouts
Figure 2-2. THS7002 Board: Assembly
Figure 2-3. THS7002 Board: Layer
Reference
THS7002 Board Layouts
Figure 2-4. THS7002 Board: Bottom Layer (Top VIew)
Reference
Reference

User's Guide Mixed-Signal Products SLOU037 IMPORTANT NO

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