Process [C06] Automotive, including standard. Printer Drivers. DC

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Process [C06] Automotive, including standard. Printer Drivers. DC

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0.6µm CMOS
Process [C06]
Automotive, including standard. Printer Drivers. DC/DC converters. Switch-mode PSU. Industrial. Display Drivers. Smart Power. power MOS. Communications.
Main Process Flow
Metal3 IMD2 Metal2 IMD1 Metal1 Gate Field Oxide Poly2 Gate Poly Metal1 Metal2 IMD1
Substrate Well Formation LOCOS Field Oxidation Twin Retrograde Wells Source Drain Formation Gate Formation Gate Formation Poly resistor formation (optional) Poly2 Resistor Capacitor (optional) Inter Layer Dielectric Metal Inter Metal Dielectric Metal Inter Metal Dielectric (optional) Metal Oxide Nitride Passivation
Process Features
fully-symmetrical CMOS. Industry standard CMOS. High resistance polysilicon resistors. Zener diode one-time programming.
Diagrams
Passivation
P-Well
N-Well
Field Oxide
NMOS
PMOS
Figure double poly capacitor structure
Figure layer metal structure
IMD1 IMD1 Metal1 Field Oxide Gate Field Oxide Gate Metal1
HV-Nwell
Figure NMOS structure
Figure PMOS structure
0.6µm CMOS Process
Logic layout performance compatible with industry standard. cell library 5.5k gates/mm2. High resistance polysilicon resistors (optional). Zener diode structure allowing one-off programming (analogous fuse). Double poly capacitor optional. Typical worst-case models BSIM3v3.1 (MOS, BJT, RES, CAP). noise characterised included model. Interconnect model Diva2D. Models supported TCAD measurement. PCell component library. Diva Dracula verification decks. Transistors
Device (µA/µm) BVDSS
Capacitors
Device Area (fF/µm2)
NMOS PMOS
Poly1 Poly2 Layout Rules
Feature
0.85
Size (µm)
Transistors
Device IDS* (µA/µm) BVDSS
NMOS PMOS
VDS=VGS=40V.
Resistors
Device
Poly1 High Poly1 Poly2 P-diffusion N-diffusion N-Well
(/sq.)
1000 1050
Active Area pitch Active Area contacted pitch Polysilicon pitch Polysilicon contacted pitch Transistor minimum width Transistor min. length Transistor min. length Metal1 pitch Metal1 contacted pitch Metal2 pitch Metal2 contacted pitch Metal3 pitch Metal3 contacted pitch Via1 placement restricted? Via2 placement restricted?
1.35 2.15 0.75
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31.Jul.01
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Process [C06] Automotive, including standard. Printer Drivers. DC

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