Quality Management tain high standards rigid specification contro

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Quality Management tain high standards rigid specification contro

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Quality Management
tain high standards rigid specification control throughout steps manufacturing process. Through continuous research development activities process improvement, strive establish maintain increasingly higher standards quality reliability.
Quality Policy
become world class company offering products/services that best satisfy customers, establishing Total Quality Management Quality Comes First corporate culture through process continuous improvement.
Built-in Quality
Winbond, recognize that every phase development manufacturing process inevitably affects quality reliability final products, concentrate building quality reliability into products from start. commitment quality funda-
Quality Certificate
verify that committed maintain world-class quality standards realized practice, Winbond obtained certification from world's leading quality control promotion organizations. 1993, were proud certified approved manufacturer under both IECQ 9002 systems, 1994 were certified under 9001 system.
mental long-term success, employees Winbond participate quality reliability assurance activities part their basic responsibilities. Every function every
Quality Management Program
purpose Quality Management Program Winbond establish controls needed assure that quality reliability VLSI
individual accountable defect-free operation.
Commitment Quality Reliability
Winbond committed manufacturing VLSIs with superior quality reliability. main-
products fully satisfy customers. strive deliver competitive products free from defects provide customers with prompt, professional service. Quality Management
Program focuses three major areas: quality control, reliability assurance, failure analysis. Figure shows Winbond quality assurance system flow chart.
Reliability Assurance
Winbond, reliability assurance testing assure high-level product performance throughout intended life products. Each manufacturing phase subject
Quality Control
Winbond implemented series quality control functions that cover steps manufacturing process. main steps this quality control procedure are: Incoming materials inspection Wafer processing Electrical characteristics testing Chip assembly
continuous review, analysis, evaluation, with modifications introduced further improve quality reliability. reliability
system based three important sources reliability data: Release qualification tests Real time monitor conformity tests Field failure information
Failure Analysis
Constant monitoring steps manufacturing process information feedback levels allow fast efficient detection problems, evaluation analysis, corrective measures. emphasize that each step manufacturing process should undertaken with right first time" attitude must produce defect-free output. over-all result line high-quality, reliable products. Failure analysis, which determines cause product failures proposes corrective action, important part reliability assurance. Winbond, scanning electron microscopes, diagnostic probe stations, optical microscopes, many other precision instruments used perform failure analysis devices submitted from various sources. Defective logged into laboratory inspection preparation corrective action reports.
PROCESS Materials
QUALITY CONTROL
METHOD
Materails Quality Conformance
Inspection Materials VLSI
Acceptance Test
Manufacturing
Equipment, Sub-materials, Environment, Cleanliness Discipline
Monitor
Screening
Process Parameters, Semifinished Product Inspection
Monitor
Test Visual Inspection
Appearance Electrical Characteristics
Monitor
Finished Product Quality Conformance
Sampling Inspection Appearance Electrical Characteristics
Acceptance Test
Storage Reliability Assurance Test Shipment Conformation Reliability Level Monitor
Customer
Field Quality Information
Feedback Information
Figure Winbond Quality Assurance System Flow Chart

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