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order guarantee high standards reliability quality supplied Winbond, have established on-going re-liability quality monitoring program. Monitor testing performed across product lines regular basis. Test results individuals with expertise design memory ICs, microcomputer peripherals ICs, communications ICs, many other product areas. This wide range expertise enables Win-bond's team develop more than twenty products each year.
subsequently made available quarterly report. This re-port details test results performed previous quarter, outlining reliability data associated with Winbond strives continuously improve quality reliability products conducting failure analysis failed parts identified reliability tests customers discover failure modes propose corrective action. this Since founded September 1987, Winbond stressed product research development (R&D), investing average annual revenues R&D. staff includes end, sophisticated failure analysis laboratory been Winbond headquarters. Detailed information failure analysis procedures will presented this report.
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