Copper Interconnects Altera Devices Semiconductor companies const

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Copper Interconnects Altera Devices
Semiconductor companies constantly striving improve device performance order meet electronic communication industries' high-bandwidth high-performance requirements. Using copper instead aluminum metal interconnect metal layers helps address these increased speed density requirements. past, most semiconductor manufacturers have used aluminum interconnects their devices. Although aluminum good conductor, becomes less practical because size limitations semiconductor processes shrink 0.15 0.13 Some semiconductor manufacturers copper interconnects layers containing power distribution connections other critical signals like clock fast lines, aluminum remaining metal layers. However, since programmable logic device (PLD) system performance driven interconnect delays, every interconnect critical design. gain full advantages copper interconnects, metal layers must copper. APEX20KC devices all-layer copper devices that meet high-performance requirements complex designs. Figure shows cross section APEX 20KC device. Figure APEX 20KC Device Cross Section
Power Plane
Interconnects
APEX 20KC Devices
Altera® APEX 20KC devices industry's first all-layer copper interconnect devices. These devices based feature-rich APEX 20KE devices manufactured 0.15-µm all-layer copper interconnect process. copper interconnects allow APEX 20KC devices offer performance improvements approximately over equivalent 0.18-µm APEX 20KE devices. Visit Altera site (http://www.altera.com) detailed information these devices. Figure compares performance Altera devices.
M-WP-COPPER-01
April 2001, ver.
Copper Interconnects Altera Devices
Altera Corporation
Figure Altera Device Performance
APEX 20KC All-Layer Copper
Performance APEX Aluminum FLEX 10KE Aluminum
APEX 20KE Aluminum
0.25-µm, 5-Layer Metal
0.22-µm, 7-Layer Metal
0.18-µm, 8-Layer Metal
0.15-µm, 8-Layer Metal
Process Metal Layers
Copper Advantages
Copper lower resistance better electro-migration scaling properties than aluminum. These properties discussed below.
Resistance
Copper much less resistance than aluminum, resulting smaller time delay factor equation lower resistance found copper results smaller delays. Typically, using copper instead aluminum reduces interconnect resistance (see Figure resulting better signal integrity, smaller propagation delays, lower power dissipation, higher performance. With shrinking device geometries, interconnect resistance becomes major factor determining device performance.
Altera Corporation
Copper Interconnects Altera Devices
Figure Aluminum Copper Resistance
Relative Delays
Aluminum Interconnect Material Copper
Electro-Migration Characteristics
electro-migration properties copper also better than those aluminum. Electro-migration currentinduced transportation conducting material. presence high current stresses, electron momentum transferred atoms metal, yielding atomic flux. This flux causes metal deplete some areas accumulate others (see Figure Figure Hills Voids Caused Flux
Unaffected Interconnect Interconnect after Flux
Hills Voids
Direction electron flow
Direction electron flow
Regions where metal structure depleted form void, leading interconnect failure formation open circuit. Likewise, interconnect material accumulate extrude make electrical contact with neighboring interconnect segments, potentially leading circuit failure formation short circuit. Over time, either outcome contribute gradual deterioration current-stressed interconnect, causing reliability concerns. While aluminum reliable down 0.18 these potential failures limit minumum thickness width aluminum interconnects, making copper better metal choice dimensions smaller than 0.18
Copper Interconnects Altera Devices
Altera Corporation
Scaling Properties
Copper more suitable than aluminum drawing scaling into smaller dimensions. Copper wires also packed closer together than aluminum wires device. Since size greatly influenced interconnects used, copper interconnects make smaller sizes possible.
Conclusion
Copper offers various advantages such lower interconnect delays better electro-migration characteristics. These properties make copper metal choice layer interconnects dimensions smaller than 0.18 Altera APEX 20KC devices feature all-layer copper metal interconnect structure that offers these benefits.
Innovation Drive Jose, 95134 (408) 544-7000 http://www.altera.com
Copyright 2001 Altera Corporation. Altera, APEX, APEX 20KC, APEX 20KE, FLEX, FLEX 10K, FLEX 10KE trademarks and/or service marks Altera Corporation United States other countries. Altera acknowledges trademarks other organizations their respective products services mentioned this document. Altera products protected under numerous U.S. foreign patents pending applications, maskwork rights, copyrights. Altera warrants performance semiconductor products current specifications accordance with Altera's standard warranty, reserves right make changes products services time without notice. Altera assumes responsibility liability arising application information, product, service described herein except expressly agreed writing Altera Corporation. Altera customers advised obtain latest version device specifications before relying published information before placing orders products services. rights reserved.

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