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This document intended describe functional differences electrical spec


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PIC12C50(X) PIC12C50(X)A Migration
This document intended describe functional differences electrical specification differences that present when migrating from device next. Note: Even though compatible devices specified tested same electrical specification, characteristics devices different from each other (due process difference). systems that were designed device specifications, these process differences should cause issues application. systems that tightly meet electrical specifications, process differences cause device behave differently application.
Table shows considerations that must taken into account when migrating from PIC12C50(X) PIC12C50(X)A.
TABLE
PIC12C50(X) PIC12C50(X)A DIFFERENCES
Functional Differences Difference Prog.
OSCCAL register changed.
Note: change from device another device, please verify oscillator characteristics your application.
1999 Microchip Technology Inc.
DS41133A-page
Electrical Specification Differences Parm. PIC12C50(X) Data Sheet Sym. Characteristic Supply Voltage Supply Current EXTRC options INTRC option Option Option Option Power Down Current Extended Commercial Industrial Extended Input Voltage Ports with Schmitt Trigger MCLR, GP2, T0CKI OSC1 (EXTRC) Input High Voltage Ports with Schmitt Trigger MCLR, GP2, T0CKI OSC1 (EXTRC mode) Input Leakage Current Ports MCLR, GP2, T0CKI OSC1 Note 0.78 3.75 3.75 3.75 Com., Industrial Extended Note Note Note Note Note VDD=3.0V disabled VDD=3.0V VDD=3.0V VDD=3.0V PIC12C50(X)A Data Sheet Units Conditions
IWDT
0.15 0.15 0.15
0.85 0.85 0.85
0.85 0.85
VPIN VDD, hi-impedance VPIN=VSS 0.25V VPIN VPIN
FOSC=4.0MHz, VDD=5.5V FOSC=20MHz, VDD=5.5V FOSC=32kHz, VDD=3.0V, disabled, Commercial Temperature FOSC=32kHz, VDD=3.0V, disabled, Industrial Temperature FOSC=32kHz, VDD=3.0V, disabled, Extended Temperature
DS41133A-page
1999 Microchip Technology Inc.
NOTES:
1999 Microchip Technology Inc.
DS41133A-page
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Microchip Technology Inc. 18201 Karman, Suite 1090 Irvine, 92612 Tel: 949-263-1888 Fax: 949-263-1338
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Arizona Microchip Technology Centro Direzionale Colleoni Palazzo Taurus Colleoni 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
11/23/99
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Microchip Technology Unit B701, East International Plaza, 317, Xianxia Road Shanghai, 200051 P.R.C Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
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Microchip Technology Inc. Motor Parkway, Suite Hauppauge, 11788 Tel: 631-273-5305 Fax: 631-273-5335
Jose
Microchip Technology Inc. 2107 North First Street, Suite Jose, 95131 Tel: 408-436-7950 Fax: 408-436-7955
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs microperipheral products. addition, Microchip's quality system design manufacture development systems 9001 certified.
rights reserved. 1999 Microchip Technology Incorporated. Printed USA. 12/99
Printed recycled paper.
Information contained this publication regarding device applications like intended suggestion only superseded updates. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights. Microchip logo name registered trademarks Microchip Technology Inc. U.S.A. other countries. rights reserved. other trademarks mentioned herein property their respective companies.
DS41133A-page
1999 Microchip Technology Inc.

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