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Quad 3-State Flip-Flop with Common Clock Reset MC74HC173 identica
Top Searches for this datasheetQuad 3-State Flip-Flop with Common Clock Reset MC74HC173 identical pinout LS173. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. Data, when enabled, clocked into four flip-flops with rising edge common Clock. When either both Output Enable Controls high, outputs high-impedance state. This feature allows HC173 used bus-oriented systems. Reset feature asynchronous active high. Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity FETs Equivalent Gates LOGIC DIAGRAM MC74HC173 SUFFIX PLASTIC PACKAGE CASE 648-08 SUFFIX SOIC PACKAGE CASE 751B-05 ORDERING INFORMATION MC74HCXXXN MC74HCXXXD Plastic SOIC ASSIGNMENT RESET DATA INPUTS 3-STATE NONINVERTING OUTPUTS CLOCK CLOCK RESET OUTPUT ENABLES DATA- ENABLES FUNCTION TABLE Inputs Output Enables Reset Clock Data Enables Data Output Change Change Change Change Change High Impedance High Impedance High Impedance 10/95 Motorola, Inc. 1995 Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Motorola High-Speed CMOS Data Book (DL129/D). NOTE: Information typical parametric values found Chapter Motorola High-Speed CMOS Data Book (DL129/D). MAXIMUM RATINGS* ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) RECOMMENDED OPERATING CONDITIONS MC74HC173 Symbol Vin, Vout Symbol Symbol Vout Tstg Iout Lead Temperature, from Case Seconds (Plastic SOIC Package) Storage Temperature Power Dissipation Still Supply Current, Pins Output Current, Input Current, Output Voltage (Referenced GND) Input Voltage (Referenced GND) Supply Voltage (Referenced GND) Input Rise Fall Time (Figure Operating Temperature, Package Types Input Voltage, Output Voltage (Referenced GND) Supply Voltage (Referenced GND) Maximum Quiescent Supply Current (per Package) Maximum Three-State Leakage Current Maximum Input Leakage Current Maximum Low-Level Output Voltage Minimum High-Level Output Voltage Maximum Low-Level Input Voltage Minimum High-Level Input Voltage Parameter Parameter Parameter Plastic SOIC Package Output High-Impedance State Vout |Iout| |Iout| Iout |Iout| |Iout| |Iout| |Iout| Vout |Iout| Vout |Iout| Test Conditions Value 1000 Unit Unit 25_C 3.15 0.26 0.26 3.98 5.48 This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Guaranteed Limit 85_C 125_C High-Speed CMOS Logic Data DL129 3.15 0.33 0.33 3.84 5.34 3.15 0.40 0.40 3.70 5.20 Unit NOTE: Information typical parametric values found Chapter Motorola High-Speed CMOS Data Book (DL129/D). Used determine no-load dynamic power consumption: load considerations, Chapter Motorola High-Speed CMOS Data Book (DL129/D). NOTES: propagation delays with loads other than Chapter Motorola High-Speed CMOS Data Book (DL129/D). Information typical parametric values found Chapter Motorola High-Speed CMOS Data Book (DL129/D). ELECTRICAL CHARACTERISTICS Input Symbol tPLH, tPHL tTLH, tTHL tPZL, tPZH tPLZ, tPHZ tPHL fmax Cout Maximum Three-State Output Capacitance (Output High-Impedance State) Maximum Input Capacitance Maximum Output Transition Time, Output (Figures Maximum Propagation Delay, Output Enable (Figures Maximum Propagation Delay, Output Enable (Figures Maximum Propagation Delay, Reset (Figures Maximum Propagation Delay, Clock (Figures Maximum Clock Frequency (50% Duty Cycle) (Figures Parameter 25_C Guaranteed Limit High-Speed CMOS Logic Data DL129 TIMING REQUIREMENTS (Input Symbol trec Power Dissipation Capacitance (Per Flip-Flop)* Maximum Input Rise Fall Times (Figure Minimum Pulse Width, Reset (Figure Minimum Pulse Width, Clock (Figure Minimum Recovery Time, Reset Inactive Clock (Figure Minimum Hold Time, Clock Input (Figure Minimum Setup Time, Input Clock (Figure Parameter 25_C Typical 25°C, 1000 Guaranteed Limit 1000 1000 85_C 125_C 85_C 125_C MC74HC173 MOTOROLA Unit Unit MC74HC173 DESCRIPTIONS INPUTS (Pins 4-bit data inputs. Data these pins, when enabled Data-Enable Controls, entered into flip-flops rising edge clock. CLOCK (Pin Clock input. OUTPUTS (Pins 3-state register outputs. During normal operation device, outputs flip-flops appear these pins. During 3-state operation, these outputs assume high- impedance state. CONTROL INPUT Reset (Pin Asynchronous reset input. high level this resets flip-flops forces outputs low, they already high-impedance state. DE1, (Pins Active-low Data Enable Control inputs. When both Data Enable Controls low, data inputs loaded into flip-flops with rising edge Clock input. When either both these controls high, there change state flip-flops, regardless changes Clock inputs. OE1, (Pins Output Enable Control inputs. When either both Output Enable Controls high, outputs device high-impedance state. When both controls low, device outputs display data flip-flops. SWITCHING WAVEFORMS CLOCK 1/fmax tPLH tTLH tTHL tPHL tPHL trec CLOCK RESET Figure Figure tPZL tPZH tPHZ HIGH IMPEDANCE CLOCK tPLZ HIGH IMPEDANCE VALID INPUT Figure Figure High-Speed CMOS Logic Data DL129 MC74HC173 TEST CIRCUITS TEST POINT OUTPUT DEVICE UNDER TEST TEST POINT OUTPUT CONNECT WHEN TESTING tPLZ tPZL. CONNECT WHEN TESTING tPHZ tPZH. DEVICE UNDER TEST Includes probe capacitance Includes probe capacitance Figure Figure LOGIC DETAIL DATA INPUTS DATA- ENABLES RESET CLOCK OUTPUT ENABLES High-Speed CMOS Logic Data DL129 MC74HC173 OUTLINE DIMENSIONS SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES MILLIMETERS 0.740 0.770 18.80 19.55 6.35 0.250 0.270 6.85 3.69 0.145 0.175 4.44 0.39 0.015 0.021 0.53 1.02 0.040 0.070 1.77 0.100 2.54 0.050 1.27 0.21 0.008 0.015 0.38 2.80 0.110 0.130 3.30 7.50 0.295 0.305 7.74 0.020 0.040 0.51 1.01 0.25 (0.010) SEATING PLANE SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE 0.25 (0.010) NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.25 0.19 0.10 0.25 6.20 5.80 0.50 0.25 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019 SEATING PLANE 0.25 (0.010) Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters vary different applications. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part. Motorola registered trademarks Motorola, Inc. Motorola, Inc. Equal Opportunity/Affirmative Action Employer. reach USA/EUROPE: Motorola Literature Distribution; P.O. 20912; Phoenix, Arizona 85036. 1-800-441-2447 MFAX: RMFAX0@email.sps.mot.com -TOUCHTONE (602) 244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, Toshikatsu Otsuki, Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-3521-8315 HONG KONG: Motorola Semiconductors H.K. Ltd.; Ping Industrial Park, Ting Road, N.T., Hong Kong. 852-26629298 CODELINE *MC74HC173/D* MC74HC173/D High-Speed CMOS Logic Data DL129 Other recent searchesV23990-P483-A - V23990-P483-A V23990-P483-A Datasheet SAA7212 - SAA7212 SAA7212 Datasheet MA4ZD14 - MA4ZD14 MA4ZD14 Datasheet HLMP-CB15 - HLMP-CB15 HLMP-CB15 Datasheet HLMP-CM15 - HLMP-CM15 HLMP-CM15 Datasheet HLMP-CB16 - HLMP-CB16 HLMP-CB16 Datasheet HLMP-CM16 - HLMP-CM16 HLMP-CM16 Datasheet HLMP-CB30 - HLMP-CB30 HLMP-CB30 Datasheet HLMP-CM30 - HLMP-CM30 HLMP-CM30 Datasheet HLMP-CB31 - HLMP-CB31 HLMP-CB31 Datasheet HLMP-CM31 - HLMP-CM31 HLMP-CM31 Datasheet GCB108 - GCB108 GCB108 Datasheet CM42-00326-1E - CM42-00326-1E CM42-00326-1E Datasheet AM0912-080 - AM0912-080 AM0912-080 Datasheet 2SB0819 - 2SB0819 2SB0819 Datasheet 2SB819 - 2SB819 2SB819 Datasheet 2SD1051 - 2SD1051 2SD1051 Datasheet
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