Thermal Resistance Analysis Update PKG. TYPE FRM. NUMBER 185

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Thermal Resistance Analysis Update PKG. TYPE FRM. NUMBER 185

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9/5/01
Thermal Resistance Analysis Update
PKG. TYPE
FRM. NUMBER 18543
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67401
EXT. NUMBER AMC67401
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 21248
(mW)
81.0
(°C/W)
64.0 53.0 47.0 85.0 69.0 61.0 74.0 65.0 58.0 53.0 57.0 19.0 41.0 37.0 35.0 33.0 68.0 53.0 44.0 40.0 35.0 66.0 20.0 53.0 43.0 38.0 73.0 12.0 57.0 47.0 41.0 37.0 76.0 13.0 64.0 54.0 45.0 42.0 71.0 22.0 65.0 57.0 51.0 47.0 61.0 14.0
SPD. (LFPM)
TEST DATE 09/91
TEST CODE SO,M
474015A
AM7940-125
14400
02/90
SO,M
67401
67401N
21248
09/91
SO,M
67713A
PAL16V8Z
8282
09/91
SO,M
67711C
PALCE16V8-10
6580
10/90
SO,M
67714A
PALCE16V8H-7
7695
01/92
SO,M
67353
PAL16R8
11970
10/90
SO,M
18550
67920
PAL16L8
12508
02/92
7411Y
PAL18P8BPC
13728
07/91
SO,M
4196B
AM7996
17024
07/89
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21011
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67350E
EXT. NUMBER PAL16R8DC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 11970
(mW)
77.0
(°C/W)
68.0 61.0 55.0 51.0 24.0 73.0 78.0 70.0 64.0 58.0 55.0 24.0 80.0 70.0 61.0 56.0 53.0 31.0 71.0 61.0 55.0 51.0 47.0 25.0 74.0 65.0 61.0 54.0 50.0 27.0 87.0 70.0 29.0 64.0 58.0 53.0 65.0 58.0 51.0 47.0 44.0 20.0
SPD. (LFPM)
TEST DATE 07/91
TEST CODE SO,M
21011 21011
67320A 67320V
PAL16R8D PAL16R8ACN
12075 12508
04/90 07/92
SO,M SO,M
21080
67711B
PALCE16V8H-15PC/4
6370
07/91
SO,M
21080
67711C
PALCE16V8-10
6580
10/90
SO,M
21080
6711A
PAL16V8Q-15JC4
7029
03/92
SO,M
21080
67111D
PALCE16V8Q-15
7029
06/94
SO,M
21080
67713A
PALCE16V8Z-25PC
8282
06/92
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21080
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67718b
EXT. NUMBER 67718b
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 10340
(mW) 1012 1020 1025 1027 1058
90.0
(°C/W)
81.0 72.0 67.0 31.0 89.0 79.0 72.0 66.0 61.0 27.0 71.0 72.0 71.0 64.0 58.0 54.0 49.0 17.0 64.0 47.0 54.0 49.0 45.0 63.0 63.0 55.0 49.0 46.0 43.0 20.0 111.0 77.0 56.0 47.0 43.0 58.0 49.0 44.0 41.0 38.0
SPD. (LFPM)
TEST DATE 06/94
TEST CODE SO,M
21080
67716b
67716b
10340
06/94
SO,M
21080 21098 21314
67350E 67922H 74364A
PAL16R8-7 PAL16R68 PAL16L8-5PC
11466 12508 11739
04/90 04/90 10/90
SO,M SO,M SO,M
21314
4797B
AM7997
19560
08/90
SO,M
21045/46
74364A
PAL16L8-7
11739
10/90
SM,M
21045/46 21045/46
74364A 74364A
PAL16L8-7 PAL16L8-5JC
11739 11739
10/90 08/92
SM,M SM,M
21045/46
4789A
AM79866
21420
01/91
SO,M
21045/46
4789A
AM79866
21420
12/90
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21049/50
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67711C
EXT. NUMBER PALCE16V8-10
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 6580
(mW)
64.0
(°C/W)
45.0 47.0 51.0 55.0 22.0 64.0 55.0 50.0 46.0 40.0 23.0 61.0 53.0 47.0 44.0 23.0 57.0 19.0 41.0 37.0 35.0 33.0 81.0 67.0 60.0 54.0 51.0 24.0 82.0 68.0 60.0 54.0 50.0 24.0 21.0 51.0 45.0 41.0 38.0 37.0 96.0 70.0 52.0 45.0 40.0
SPD. (LFPM)
TEST DATE 11/90
TEST CODE SM,M
21049/50
67111A
PAL16V8Q-15JC/4
7029
03/92
SM,M
21049/50
67714A
PALCE16V8H-7
7695
01/92
SM,M
21049/50
67713A
PALCE16V8Z
101.2
8298.4
08/91
SM,M
21049
67718b
67718b
10340
06/94
SM,M
21049
67716b
67716b
10340
06/94
SM,M
21049/50 21049/50
74165 4788A
PAL16R8-7JC AM7966
11466 13200
09/92 12/90
SM,M SM,M
21049/50
4788A
AM7966
13200
01/91
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21755 24452
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 74164 67715A
EXT. NUMBER PAL16R8-7JC PALCE16V8H-5JC/5
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 11466 10235
(mW)
(°C/W) 21.0
SPD. (LFPM)
TEST DATE 11/91 05/93
TEST CODE SM,M
64.0 53.0 48.0 45.0 42.0 22.0 91.0 82.0 72.0 65.0 61.0 26.0 109.8 102.2 90.7 79.5 72.7 23.0 110.5 102.6 90.8 79.3 73.8 26.0 87.0 77.0 68.0 62.0 57.0 20.0 140.3 23.0 124.5 113.2 104.2 98.2 169.5 152.7 136.5 125.5 116.3 20.1 97.0 67.0
67711
PALCE16V8H-10SC/4
6300
07/92
SM,M
21755
67714B
PALCE16V8H-7
6885
10/94
21755
67711L
PALCE16V8H
7695
10/94
24491
6715A
PALCE16V8H-5
9775
08/93
SM,M
08/93
SM,M
33742
67711L
PALCE16V8H-10
5248
09/94
33742
67714B
PALCE16V8H-7
7695
09/94
5533D 5533D
AM29C833A-BLA AM29C833A
14508 14508
05/90 10/90
SO,M SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 4167B
EXT. NUMBER AM29827A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 14800
(mW) 1413 1413 1413 1413 1416 1415 1412
61.0
(°C/W) 12.0
SPD. (LFPM)
TEST DATE 06/87
TEST CODE
59.0 11.0 64.0 46.0 66.0 56.0 48.0 41.0 38.0 13.0 65.0 56.0 45.0 39.0 36.0 56.0 46.0 40.0 32.0 30.0 55.0 46.0 39.0 35.0 32.0 31.0 65.0 69.0 60.0 54.0 50.0 18.0 73.0 61.0 53.0 50.0 47.0 19.0 04/93 SO,M 1000 02/87 09/92 01/90 SO,M 10/93 SO,M 03/92 SO,M 06/89 SO,M
4193C
AM7992B
15008
67882
PAL20X8ACJS
18676
03/92
SO,M
67670
PAL20RA10CJS
18768
67741A
PALCE67741A
17876
67916A
PAL10H20EV8-6
19430
23850
4173 67724A
AM29823A AM67724A
7740 8772
23850
67721
CE20V8H-10/4
7524
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 23850
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67983A
EXT. NUMBER PALCE20RA10H-20PL
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 8848
(mW)
70.0
(°C/W)
61.0 53.0 49.0 47.0 93.2 86.3 76.9 69.3 63.5 32.3 65.0 53.0 39.0 63.0 64.0 67.0 72.0 67.0 60.0 53.0 67.0 67.0 67.0 61.0 56.0 51.0 17.0 72.0 64.0 60.0 55.0 49.0 21.0 70.0 65.0 60.0 56.0 53.0 22.0 65.0
SPD. (LFPM)
TEST DATE 06/93
TEST CODE SO,M
06/93 11/94
SO,M SO,M
24404
67158F
PALCE22V10H-15
8253
74220
PAL22V10-10
18928
08/90
SO,M
21020
57158B
PALCE22V10-4
11856
05/91
SO,M
21020 21020 21020
7998 7998 74120C
AM7998 AM79C98PC PAL22V10-15PC
17010 17010 16463
08/90 08/90 05/91
SO,M SO,M SO,M
21020
67770B
PALCE610H-15PC
17640
05/92
SO,M
21022
67712A
PALCE16V8HD-15PC
9900
04/92
SO,M
21022
74264A
AM74264
11400
08/89
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21022
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 74265
EXT. NUMBER PAL20R8-7PC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 11400
(mW)
75.0
(°C/W)
70.0 64.0 59.0 56.0 24.0 72.0 67.0 61.0 55.0 52.0 21.0 56.0 69.0 64.0 58.0 54.0 50.0 21.0 71.0 19.0 61.0 56.0 52.0 63.0 60.0 52.0 43.0 39.0 74.0 69.0 63.0 58.0 54.0 23.0 73.0 66.0 61.0 55.0 52.0 20.0 66.0 59.0 53.0 47.0 43.0 14.0
SPD. (LFPM)
TEST DATE 02/92
TEST CODE SO,M
21022
74465A
PAL20R8-5
13728
03/92
SO,M
21022 21022
5533D 4193C
AM29C833APC AM7992BPC
14508 15008
08/90 04/92
SO,M SO,M
21022
7921A
79C98
17010
03/91
SO,M
23718
67126
PALCE29M16H 25PC/4
23836
10/90
SO,M
23850
67841A
PAL20R4-10JC
12882
05/92
SO,M
23851
67167A
PALCE22V10H-10PC/5
15134
04/92
SO,M
23852
74220
PAL22V10-10PC
11400
02/92
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24398
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67741A
EXT. NUMBER PALCE67741A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 17876
(mW)
71.0
(°C/W)
64.0 58.0 52.0 48.0 17.0 86.0 72.0 65.0 60.0 55.0 26.0 73.0 68.0 61.0 56.0 53.0 26.0 97.0 86.0 86.0 79.0 71.0 63.0 58.0 48.0 12.0 45.0 56.0 25.0 36.0 41.0 48.0 46.0 37.0 32.0 46.0 36.0 31.0 45.0
SPD. (LFPM)
TEST DATE 09/93
TEST CODE SO,M
24404
67269A
PALLV22V10-10
6720
06/94
SO,M
25151
67984B
CEZORA10H-7
12288
05/94
SM,M
21100
5533D
AM29C833ASC
14508
05/90
SM,M
23375
67167B
Palce22V10H-10
14812
10/93
SM,M
97567A
Am27C256
14523
02/92
SO,M
97567A
AM27C256
14523
02/92
SO,M
97286A
AM27C128-125DC
15867
01/90
SO,M
97566G
AM27C256-170DC
21033
01/90
SO,M
97124D
AM27C512-255DC
34944
01/90
SO,M
99323A
AM99323A
47092
06/92
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 9910BM
EXT. NUMBER AM99C10A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 54290
(mW) 1060
72.0
(°C/W)
63.0 56.0 51.0 47.0 61.0 54.0 58.0 56.0 87.0 72.0 79.0 61.0 58.0 51.0 46.0 56.0 94.0 81.0 68.0 45.0 103.0 91.0 84.0 76.0 65.0 59.0 54.0 50.0 48.0 19.0 62.0 56.0 52.0 48.0 45.0 58.0 49.0 44.0 41.0 38.0
SPD. (LFPM)
TEST DATE 09/90
TEST CODE SO,M
15358
4544
AM29CPL-S4H
52414
05/91
SO,M
97124EX
AM27X512PC
34944
08/90 08/90 08/90 08/90 01/90
SO,M SO,M SO,M SO,M SO,M
15153
97566GX
AM27X256PC
21033
15153
7566R
AM27C256-200PC
21033
15421
97281AX
AM27X128PC
15867
08/90
SO,M
18457
9910C
Am99C10A
54290
10/93
SO,M
9013 18457
1023 9910BM
AM7957JC AM9910A-10A
40803 54290
04/88 09/90
SM,M SO,M
21026
67531
PALCE26V12H-15PC/4
167.7
94.5
15847.65
02/92
SO,M
21027
67530B
PALCE26V12
201.18
19514.46
05/91
SO,M
21045/46
4789A
AM79866
21420
12/90
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21061/62
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67721
EXT. NUMBER CE20V8H-10/4
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 7524
(mW)
55.0
(°C/W)
45.0 41.0 38.0 35.0 19.0 51.0 42.0 37.0 36.0 16.0 56.0 46.0 39.0 36.0 33.0 55.0 47.0 42.0 38.0 36.0 17.0 56.0 50.0 46.0 42.0 39.0 19.0 54.0 49.0 44.0 40.0 38.0 19.0 15.3 54.0 48.0 44.0 42.0 39.0 54.0 49.0 43.0 37.0
SPD. (LFPM)
TEST DATE 04/93
TEST CODE SM,M
21061/62
67724A
AM67724A
8772
09/92
SM,M
21061/62
67983A
PALCE20RA10H-20JC
8848
06/93
SM,M
21061/62
67712A
PALCE16V8HD-15JC
9900
04/92
SM,M
21061/62.
74265
PAL20R8-7JC
10767
02/92
SM,M
21061/62.
74264B
PAL20L8-7JC
10767
04/92
SM,M
21061/62. 21061/62
74365A 74364A
PAL6R8-4 PAL16L8-5
11739 11739
01/91 10/90
SM,M SM,M
21061/62
57158B
PALCE22V10-4
11856
05/91
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21061/62
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67725A
EXT. NUMBER AM67725A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 12096
(mW)
51.0
(°C/W)
42.0 38.0 35.0 15.0 52.0 45.0 40.0 37.0 34.0 16.0 54.0 49.0 43.0 40.0 37.0 18.0 56.0 55.0 48.0 43.0 40.0 37.0 18.0 55.0 48.2 43.5 29.3 36.5 18.0 56.0 48.0 43.0 40.0 17.0 52.0 45.0 41.0 39.0 53.0 68.0 54.0 47.0 41.0
SPD. (LFPM)
TEST DATE 09/92
TEST CODE SM,M
21061/62
67841
PAL20R4-10JC
12882
05/92
SM,M
21061/62
74465A
PAL20R8-5JC
13728
03/92
SM,M
21061/62 21061/62
5533D 6717A
AM29C833A AM6717A
14508 15134
10/90 04/92
SM,M SM,M
21061/62 21061/62
6717A 67531
AM6717A PALCE26V12H-15JC/4
167.7
94.5
15134 15847.65
04/92 02/92
SM,M SM,M
21061/62
74120C
PAL22V10-15JC
16463
05/91
SM,M
21061/62
7924A
Am79C100A1
16875
09/91
SM,M
21061/62
7921A
AM79C98JC
17010
04/91
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21061/62
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 7921A
EXT. NUMBER AM79C98JC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 17010
(mW)
70.0
(°C/W)
56.0 48.0 41.0 57.0 47.0 44.0 39.0 36.0 20.0 49.0 43.0 38.0 34.0 52.0 46.0 41.0 37.0 52.0 41.0 69.0 59.0 49.0 45.0 41.0 53.0 46.0 38.0 52.0 44.0 39.0 36.0 33.0 16.0 51.0 46.0 40.0 37.0 34.0 51.0 43.0 38.0 34.0
SPD. (LFPM)
TEST DATE 04/91
TEST CODE SO,M
26061/62
67770B
PALCE610H-15PC
17280
05/92
SM,M
21061/62
6760A
AM79168
18620
11/91
SM,M
21061/62
57950A
Am67950A
19511
01/92
SM,M
21061/62 21061/62 21063\64
4797B 4797B 74220
AM7997 AM7997 22V10-10JC
19560 19560 11400
08/90 08/90 10/92
SM,M SM,M SO,M
21063/64
74220
PAL22V10-10
18928
08/90
SM,M
21063/64
67530B-C
PALCE26V12
96.85
201.18
19484.283
05/91
SM,M
21063/64
74220
PAL22V10-10
19690
02/92 10/91
SM,M
21063/64
67126
PAL29M16
23836
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21063/64
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 7435
EXT. NUMBER 30S16
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 31671
(mW) 1000 1435 1435 1442 1442 1442 1300 1300
50.0
(°C/W)
43.0 39.0 85.8 51.9 46.0 44.0 35.0 18.5 67.0 51.0 43.0 34.0 48.0 43.0 38.0 36.0 33.0 52.0 12.0 58.0 60.0 52.0 97.0 40.0 34.0 30.0 26.0 69.0 58.0 52.0 47.0 45.0 20.0 66.0 56.0 50.0 45.0 44.0 19.0
SPD. (LFPM)
TEST DATE 10/90
TEST CODE SM,M
21063/64 21063/64
79987A 79987A
Am79C987 Am79C987
32025 32025
11/92 11/92
SO,M SM,M
21063/64
79987A
Am79C987
32025
03/93
SO,M
21063/64
6765B
79169
36472
07/92
SM,M
21063/64
4769B
AM7969-125JC
36652
07/89
SM,M
21077 23420
7435
AM7905AJC AM30S16
50347 31671
04/89 10/90
SM,M SO,M
23428
6760A
AM79168
18620
11/91
SM,M
24399
67269A
PALLV22V10-10
6720
06/94
SO,M
24399
67269B
67269B
10790
02/94
SM,M
24399
67269B
67269B
10790
02/94
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24393
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 67725A
EXT. NUMBER PALCE20V8H-5/5
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 11232
(mW) 1292 1305 1317 1297 1310 1306 1298 1308
56.0
(°C/W)
46.0 41.0 37.0 19.0 64.0 54.0 48.0 43.0 40.0 19.0 50.0 41.0 35.0 33.0 15.0 59.0 48.0 43.0 39.0 36.0 15.0 52.0 44.0 40.0 36.0 34.0 42.0 36.0 32.0 28.0 27.0 56.0 46.0 33.0 39.0 36.0 31.0 27.0 26.0 55.0 50.0 44.0 42.0
SPD. (LFPM)
TEST DATE 12/92
TEST CODE SM,M
24399
67984B
CEZORA10H-7
12288
05/94
SO,M
24399
67168A
PALCE22V10H-7/5
15624
06/93
SM,M
24399
67741A
PALCE67741A
17876
09/93
SM,M
24399
67368A
18480
08/93
SM,M
23428
6760B
AM79168
19737
07/92
SM,M
24426
6765B
79165-275
36472
03/92
SO,M
24426
6765B
79165-275
36472
03/92
SM,M
03/92 04/91
SO,M SM,M
21421
5576AY
AM29C676SC
10902
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21280
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 97286A
EXT. NUMBER AM27C64-255LC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 15867
(mW) 1019 1022 1029 1032 1013 1026 1031 1034 1034
55.0
(°C/W)
47.0 44.0 11.0 52.0 45.0 41.0 47.0 40.0 37.0 49.0 44.0 39.0 42.0 43.0 61.0 51.0 50.0 37.0 39.0 35.0 29.0 25.0 44.0 49.7 37.1 33.6 31.6 30.1 35.3 29.5 28.0 27.0 26.3 64.0 55.0 51.0 11.4 11.8
SPD. (LFPM)
TEST DATE 01/90
TEST CODE SM,M
21280
97566F
AM27C256-155LC
21033
01/90
SM,M
21280
97124
AM27C512-300LC
38064
01/90
SM,M
21280
97101B
AM27C010-200LC
60192
01/90
SM,M
21683 21683 21683 21683 23400 15050
97102A 97102A 97101CX 97101CX 97201BR 97102A
AM27C010 AM27C010 AM27X010PC AM27X010PC AM27C020 AM27C010
37648 37648 60192 60192 87500 37648
10/90 10/90 08/90 08/90 02/91 10/90
SO,M SO,M SO,M SO,M SO,M SO,M
15050
9101AN
AM27C010-200DC
60192
01/90
SO,M
15050 15584
97402B PAETC
Am27040 Thermal Test
72352 44096
05/92 03/96
SO,M 1S0P
15584
PAETC
Thermal Test
44096
03/96
2S2P
18514
97286A
AM27C128-305JC
15867
01/90
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 18514
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 97566GX
EXT. NUMBER AM27X256JC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 21033
(mW) 1831 3146 3219 3254 3285 3312 1384 2410 2495 2544 2588 2623
59.0 58.0 59.0
(°C/W)
SPD. (LFPM)
TEST DATE 09/90
TEST CODE SM,M
18514
97566R
AM27C256-205JC
21033
01/90
SM,M
50.0 47.0 63.0 58.0 78.0 69.0 61.0 59.0 66.0 62.0 32.3 31.5 30.8 27.2 25.6 24.3 23.1 46.7 44.7 43.0 35.9 32.4 29.2 26.9 75.0 50.0 45.0 39.0 38.0 35.0 80.0 76.0 71.0 65.0 61.0 113.0 15.0 10.7 11.4 11.7
18514 18514 18514 18514 21468
97124EX 97124EX 97124EX 97124EX 97101CX
AM27X512 AM27X512 AM27X512 AM27X512 AM27x010
34944 34944 34944 34944 60192
09/90 09/90 09/90 09/90 09/90 09/90 09/90
SM,M SM,M SM,M SM,M SM,M SM,M SM,M
21630
9910BM
AM99C10A
54290
23993
PAETC
Thermal Test
44096
06/97
2S2P
97118
23993
PAETC
Thermal Test
44096
08/97
1S0P
97119
24148 24493
97282AR 29F040
27C128 Am29F040
11433 77814
06/94 10/93
SM,M SM,M
24026
97566GR
AM27C256
21033
05/91
SM,M
24026
98104AT
Am28F010
64625
06/94
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24341E
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 98104AT
EXT. NUMBER 28F010
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 47124
(mW) 1143 1193 1270 1007 1306 1338 1359 1365 1364
94.0
(°C/W)
84.0 75.0 70.0 65.0 95.0 83.0 75.0 70.0 66.0 33.0 32.0 27.0 24.0 45.0 13.0 50.0 45.0 38.0 29.0 81.7 78.7 65.7 58.4 54.6 51.9 49.9 48.8 45.3 43.0 41.5 39.8 91.1 74.7 65.9 61.0 53.9 52.1 46.6 41.7 39.0 36.0 12.5 15.0 12.9
SPD. (LFPM)
TEST DATE 01/93
TEST CODE SM,M
24478E
29F040
Am29F040
77814
10/93
SM,M
8151A
AM8151A
30240
4/90
SO,M
97244D
AM27C1024-95DC
63503
01/90
SO,M
9428BS 9568 97244EX
AM79C302PC AM9568 AM27X1024
50688 56000 63503
12/90 12/90
SO,M SO,M SO,M
09/90
21038
5987BS
AM80C287
75000
10/90
SM,M
25288
PAETC
66568
04/96
1S0P
25288
PAETC
66568
04/96
2S2P
x25680
PAETC
Thermal Test
44096
04/99
1s0p
S98027
x25680
PAETC
Thermal Test
44096
04/99
2s2p
S98028
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25680
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 66568
(mW) 1637 1646 1662 1676 1676 1212 1211 1211 1210 1210 1394 1418 1419 1449 1449 1637 1646 1662 1676 1676 1508 1554 1553 1552 1577
41.3
(°C/W)
37.4 35.0 33.8 32.6 96.6 79.1 69.8 64.7 60.5 56.9 52.4 49.2 46.3 44.3 76.8 63.7 58.4 53.8 51.8 48.6 42.9 40.9 38.0 37.4 76.1 60.8 53.4 48.8 43.6 41.4 36.3 33.7 32.4 31.8 79.6 65.3 55.7 51.3 46.9 45.0 40.1 37.4 36.0 34.1 12.3 26.4 17.8 14.1 11.0 16.0
SPD. (LFPM)
TEST DATE 04/99
TEST CODE 2s2p
S98034
x25807
PAETC
Thermal Test
44096
03/99
1s0p
S98029
x25807
PAETC
Thermal Test
44096
03/99
2s2p
S98030
x25808
PAETC
Thermal Test
44096
03/99
1s0p
S98031
x25808
PAETC
Thermal Test
44096
03/99
2s2p
S98032
25288
PAETC
Thermal Test
32028
02/00
1s0p
S98035
25288
PAETC
Thermal Test
32028
02/00
2s2p
S98036
25288
PAETC
Thermal Test
89040
06/00
1s0p
S98037
25288
PAETC
Thermal Test
89040
06/00
2s2p
S98038
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER x25730
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 1161 1159 1187 1186 1183 1237 1269 1283 1306 1306 1240 1260 1282 1281 1295
57.7
(°C/W)
12.7
51.7 48.0 46.7 43.8 70.8 57.7 50.4 46.8 46.9 53.2 46.6 42.6 40.1 36.1 74.3 61.4 54.5 51.0 48.1 53.3 47.3 43.6 41.6 40.4 52.0 47.0 42.0 37.0 34.0 40.0 39.0 33.0 30.0 27.0 25.0 24.4 17.5 16.7 15.5 14.7 12.5 14.6 11.4 15.6
SPD. (LFPM) 1000
TEST DATE 03/00
TEST CODE 2s2p
S98040
x25730
PAETC
Thermal Test
66568
02/00
1s0p
S98041
x25730
PAETC
Thermal Test
66568
02/00
2s2p
S98042
x25730
PAETC
Thermal Test
66976
03/00
2s2p
S98025
x25807
PAETC
Thermal Test
66976
03/00
2s2p
S98026
9009
9430D
AM79C30AJC/D
77568
09/90
SM,M
9009 9017
5987BS 68110
AM80C287 MACH 110-15JC
82500 16383
10/90 02/91
SM,M SM,M
9017
68112A
MACH 111-5/7
21160
11/95
SM,6
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 9017
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 68211A
EXT. NUMBER 68214A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 23652
(mW)
30.4
(°C/W)
18.5 15.9 13.5 12.8 12.2 40.0 12.0 35.0 32.0 29.0 26.0 42.0 36.0 14.0 32.0 30.0 28.0 69.0 40.0 36.0 33.0 31.0 29.0 15.0 15.0 37.0 33.0 31.0 31.0 43.0 22.0 40.0 36.0 35.0 34.0 49.0 18.0 43.0 14.0 60.0 51.0 41.0 39.0
SPD. (LFPM) 1000
TEST DATE 06/95
TEST CODE 1S0P
9017
68110
MACH
24500
10/91
SM,M
9017
68110
MACH110-15
25413
09/91
SM,M
9017 9017
68210A 68110
MACH 110-15JC MACH 210-15JC
35260 41961
06/94 02/91
SO,M SM,M
9017
68210
MACH210-15JC
41961
09/91 01/92 10/91
SM,M
17605
66110
MASC
17052
SM,M
17605
66210A
MASC
20008
SM,M
17605
66210
MASC
20008
01/92
SM,M
17605
4787Z
AM7985AJC
23409
08/90
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 19001
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 2044 2060 2073 2092 2091 1010 1030 1035 1041 1049 1351 1324 1336 1334 1340
30.2
(°C/W)
12.1
26.2 25.0 23.4 22.3 44.6 33.1 30.0 28.1 27.0 31.4 26.5 25.0 24.2 23.6 34.0 31.0 28.0 43.0 36.0 33.0 31.0 29.0 40.0 35.0 33.0 30.0 28.0 37.3 32.6 30.8 29.1 29.1 40.7 34.2 33.4 31.8 30.6 39.6 34.7 32.9 32.5 31.3 10.9 12.9
SPD. (LFPM)
TEST DATE 03/98
TEST CODE 2S2P
97151
21743
PAETC
44096
03/96
1S0P
21743
PAETC
44096
03/96
2S2P
14626
9244D
AM27C1024-250LE
63503
02/90
SM,M
23961
68110A
MACH110-20ES
23400
09/91 09/91 01/96
SM,M
23961
68210A
MACH210-20ES
34850
SM,M
25365
68112A
MACH 111-5
21160
2S2P
25365
68111A
MACH 111(bp pattern)
28296
06/95
2S2P
25365
68111A
MACH 111(be pattern)
28296
06/95
2S2P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25365
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 68211A
EXT. NUMBER MACH210A
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 55696
(mW) 1033 1062 1075 1083 1086 1070 1087 1094 1097 1099 0.418 0.427 0.431 0.434 0.436 0.495 0.506 0.512 0.516 0.517 1417 1437 1445 1453 1456
41.0
(°C/W)
35.0 33.7 32.6 32.0 11.3 55.7 47.1 42.7 40.1 38.4 38.4 35.0 33.1 31.8 31.1 88.0 160.6 139.2 129.1 122.5 118.7 137.5 119.2 110.6 104.5 101.5 95.8 81.6 71.0 65.8 62.3 49.2 45.5 43.6 42.2 41.4 89.0 74.0 65.2 59.8 56.9 10.5 14.1 16.6 18.1
SPD. (LFPM)
TEST DATE 06/95
TEST CODE 2S2P
25365
PAETC
Thermal Test
21624
02/00
1s0p
99060
25365
PAETC
Thermal Test
21624
02/00
2s2p
99061
25185 E001
98962A PAETC
Am29F400 Thermal Test
82992 10404
07/94 04/01
1S0P 1s2p 21066
BCC+
E001
PAETC
Thermal Test
10404
04/01
1s2p
21067
26661
PAETC
Thermal Test
21216
05/00
1s0p
99030
26661
PAETC
Thermal Test
21216
05/00
2s2p
99031
26086
PAETC
Thermal Test
21216
05/00
1s0p
99028
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26086
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 21216
(mW) 1439 1461 1469 1476 1480 2010 2044 2057 2069 2077 2412 1134 1153 1165 1186 1202 1214 1224 2012 2054 2074 2088 2100
46.0
(°C/W)
42.0 40.3 39.0 38.1 78.8 65.4 56.9 51.9 48.7 35.7 32.2 30.6 29.4 28.5 89.2 74.0 63.1 56.4 53.9 42.5 91.0 57.0 94.7 91.4 89.2 76.4 69.4 63.9 60.2 75.5 70.5 66.6 64.0 61.9 52.6 52.0 51.4 46.6 44.4 42.8 41.7 16.6 16.8 17.0 25.2 23.9 24.3 24.9
SPD. (LFPM)
TEST DATE 05/00
TEST CODE 2s2p
99029
26084
PAETC
Thermal Test
44096
05/00
1s0p
99026
26084
PAETC
Thermal Test
44096
05/00
2s2p
99027
x26085
PAETC
Thermal Test
44096
02/99
1S0P
98052
25967 25967 21365 25571
PAETC PAETC 7990 PAETC
Thermal Test Thermal Test AM79C90 Thermal Test
21624 21624 41412 10404
02/98 02/98 10/92 02/97
2S2P 1S0P SO,M 1S0P
98006 98005
97076
25571
PAETC
Thermal Test
10404
02/97
2S1P
97069
25571
PAETC
Thermal Test
10404
02/97
2S2P
97077
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25504
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 32028
(mW) 1038 1038 1573 1599 1598 1626 1625 1495 1494 1536 1536 1536 1249 1288 1288 1288 1288 1442 1483 1483 1482 1516
83.6
(°C/W)
16.6
69.0 62.5 57.7 54.4 81.0 45.5 38.9 37.0 35.5 34.4 44.9 86.0 70.6 61.3 54.6 48.3 43.3 37.6 35.9 33.4 31.1 84.2 69.2 61.3 58.9 55.9 44.8 41.5 38.1 36.8 35.0 94.5 76.8 70.5 66.2 63.4 55.2 49.4 47.0 45.3 44.7 46.1 40.8 38.6 37.6 35.1 12.3 10.9 16.8 21.8 14.8 14.5 11.9
SPD. (LFPM)
TEST DATE 03/96
TEST CODE 1S0P
25504
PAETC
Thermal Test
32028
03/96
2S2P
25534
PAETC
Thermal Test
10404
06/00
1s0p
S98011
25534
PAETC
Thermal Test
10404
04/00
2s2p
S98012
25616
PAETC
Thermal Test
10404
07/00
1s0p
S98003
25616
PAETC
Thermal Test
21216
04/99
2s2p
S98018
x25854
PAETC
Thermal Test
21216
03/99
1s0p
S98013
x25854
PAETC
Thermal Test
21216
03/99
2s2p
S98014
x25854
PAETC
Thermal Test
21216
01/00
2s2p
S98024
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25855
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 21216
(mW) 1233 1292 1337 1328 1351 1827 1861 1895 1903 1912 1061 1087 1108 1113 1113 1782 1817 1816 1837 1851 1547 1584 1583 1615 1614 1836 1873 1895 1900 1918 1364 1396 1424 1452 1452 1443 1467 1478 1484 1495 1716 1783 1810 1837 1858
82.8
(°C/W)
22.9
69.2 59.7 55.9 52.5 55.0 47.8 43.5 41.5 40.2 62.5 53.5 48.3 44.5 42.7 38.2 34.0 32.6 31.2 30.1 44.1 39.4 37.3 35.1 34.0 44.3 37.9 35.5 34.2 33.0 71.7 59.3 53.3 48.6 46.3 52.1 45.2 42.8 41.2 39.7 62.3 50.1 44.8 40.6 37.9 14.9 11.7 17.9 10.4 13.0
SPD. (LFPM)
TEST DATE 05/98
TEST CODE 1s0p
S98001
25855
PAETC
Thermal Test
21216
05/98
2S2P
S98002
25855
PAETC
Thermal Test
32844
04/99
1s0p
S98015
25855
PAETC
Thermal Test
32844
04/99
2s2p
S98016
25900
PAETC
Thermal Test
44096
06/00
2s2p
S98022
X26239
PAETC
Thermal Test
66976
07/98
2S2P
98017
X26239
PAETC
Thermal Test
44096
07/98
1s0p
98023
X26239
PAETC
Thermal Test
44096
07/98
2s2p
98024
X26239
PAETC
Thermal Test
66976
07/98
1s0p
98025
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26083
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 89040
(mW) 1042 1073 1090 1101 1109 2680 2729 2751 2769 2777 1585 1641 1679 1710 1716 1637 1668 1666 1708 1708 1601 1659 1692 1714 1731 1879 1733 1770 1781 1789 1794 1743 1146 1169 1177 1171 1153 1153 1718 1831 1323 1664
64.5
(°C/W)
51.5 44.2 39.8 37.1 26.7 23.7 22.2 21.1 20.5 63.8 54.0 47.7 43.2 41.1 40.9 35.1 32.8 30.7 30.0 64.2 53.8 48.1 44.2 41.7 14.7 36.3 32.6 30.8 29.6 28.9 33.0 29.0 27.0 24.0 23.0 10.0 38.0 10.0 41.0 11.0 12.3 17.2
SPD. (LFPM)
TEST DATE 05/00
TEST CODE 1s0p
99032
26083
PAETC
Thermal Test
89040
05/00
2s2p
99033
x25668
PAETC
Thermal Test
44096
03/99
1s0p
98043
x25668
PAETC
Thermal Test
44096
02/99
2s2p
98044
25668
PAETC
Thermal Test
44096
09/99
1s0p
99051
25668
PAETC
Thermal Test
44096
09/99
2s2p
99047
9001
68220
MACH220-15JC
76792
05/92
SM,M
14904
5989AR
AMN80C286
49275
01/92
SO,M
14904
5989AR
AMN80C286
49275
01/92
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 17586
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 68120
EXT. NUMBER MACH120-15JC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 40200
(mW) 1000 1000 1000 1000 1500 1500 1500 1500 2000 2000 2000 2000 1067 1101 1119 1133 1138 1147 1167 1176 1178 1182
37.0
(°C/W)
33.0 30.0 28.0 25.0 13.0 50.7 16.0 50.0 47.0 46.0 45.0 48.0 46.0 45.0 43.0 46.0 44.0 43.0 43.0 45.0 43.0 42.0 41.0 53.0 44.0 40.0 37.0 35.0 68.0 52.0 47.0 44.0 40.0 67.4 58.5 53.1 48.5 46.7 40.0 37.6 35.8 34.8 34.0
SPD. (LFPM)
TEST DATE 05/92
TEST CODE SM,M
24162
7990
Am79C90
41412
10/92
SM,M
21699
5986B
AM80C286
101386
07/90
21699
5986B
AM80C286
101386
07/90
SM,M
21699
5986B
AM80C286
101386
07/90
SM,M
21699
5986B
AM80C286
101386
07/90
SM,M
24432
5887BR
5887BR
39732
10/93
24475
79940A
AM79C940VC
43979
05/94
SM,M
26702
PAETC
Thermal Test
10404
07/99
1s0p
99016
26702
PAETC
Thermal Test
10404
07/99
1s0p
99017
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26728
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 66976
(mW) 2117 2217 2263 2294 2302 1815 2922 2993 3022 3040 3051 3101 1048 1061 1079 1076 1105 1255 1033 1033 1039 1047 1053 1033 1001 1003 1006 1832 1070 1035 1036 1042 1048 1012 1015 1012 1015 1018 2142 1173
48.4
(°C/W)
39.7 34.9 31.2 29.2 26.7 23.5 21.9 20.9 20.3 28.0 24.0 20.0 19.0 17.0 34.7 27.1 24.6 21.9 20.4 28.3 22.5 21.4 20.4 19.5 27.6 31.9 23.9 21.6 19.2 17.3 25.6 20.0 18.4 16.9 16.2 24.9 34.0 39.0 26.0
SPD. (LFPM)
TEST DATE 09/99
TEST CODE 1s0p
99050
26728
PAETC
Thermal Test
66976
09/99
2s2p
99049
24069
68130A
AM68130A
46968
07/92
SM,M
15224
PAETC
44096
10/96
1S0P
15224
PAETC
44096
10/96
2S2P
15224
PAETC
101108
10/96
1S0P
15224
PAETC
101108
10/96
2S2P
15224 15224 15224
79900A 79900A 79900A
AM79900A AM79900A AM79900A
150902 150902 150902
05/90 08/90 05/90
SM,M SO,M SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 15380
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 1040 1003 1006 1053 1048 1052 1055 1058 1945 2309 2378 2447 2503 2903 2945 3018 3054 3081 2651 2706 2781 2807 2838 3230 1040 1022 1024 1020 1008 1013 1014 1015 1901 1039 1007 1017 1023 1026
35.4
(°C/W)
11.2
28.3 25.9 22.5 21.6 29.2 22.9 21.7 20.6 18.8 28.5 34.0 30.0 26.0 23.0 30.0 28.0 26.0 24.0 23.0 29.0 25.0 23.0 21.0 19.0 32.4 25.2 22.8 20.3 19.1 26.3 20.3 18.5 18.1 17.8 25.7 37.0 27.0 12.0 37.4 29.9 26.9 24.1 23.0 11.5
SPD. (LFPM)
TEST DATE 10/96
TEST CODE 1S0P
15380
PAETC
44096
10/96
2S2P
15380
4786Z
AM7984A
99200
08/90
SO,M
15380
4790A
AM7984
99200
02/92
SM,M
15380
4786A
AM7984A
99200
02/90
SM,M
PL084
15380
PAETC
101108
10/96
1S0P
15380
PAETC
101108
10/96
2S2P
23743
79940A
79C940
43979
11/92
1S0P
23743
PAETC
44096
10/96
1S0P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 23743
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 1019 1006 1008 1903 1049 1074 1063 1064 1067 1610 1670 1732 1731 1731
31.3
(°C/W)
26.7 25.7 23.4 22.5 30.1 28.1 22.2 41.7 29.4 25.7 23.7 22.3 33.8 27.8 26.4 24.6 23.6 30.0 24.9 23.8 22.4 21.3 32.0 13.0 34.0 31.0 28.0 26.0 25.0 18.8 15.1 14.2 13.4 12.5 28.3 23.5 42.6 34.8 31.3 29.3 28.3 10.0 10.4
SPD. (LFPM)
TEST DATE 10/96
TEST CODE 2S2P
23743
68130
MACH
46968
06/96
2S2P
23743
79984AR
Am79C984JC
53382
02/96
23743
79984AR
Am79C984JC
53382
02/96
2S2P
23743
68131A
MACH
61254
06/96
2S2P
23747
68130A
MACH 130-20JC
46968
11/91 11/91 05/92
SM,M SM,M SM,M
23747
68130
MACH130-15JC
46968
23747
68233A
Mach231-JC/1
49580
11/95
2S1P
25538
68130
MACH
46968
06/96
2S2P
25538
PAETC
Thermal Test
10404
15.4
03/00
2s2p
S98085
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25538
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 10404
(mW) 1912 1924 1937 1990 1990 1872 1985 1984 2019 2018 2142 2176 2212 2211 2247 2804 3313 2989 3018 3080 3120 3153 1808 1772 1700 1817 1753 1685 1743 1771 1779 1786 2878 3451
35.8
(°C/W)
15.8
32.3 30.5 28.3 27.9 35.5 32.5 31.3 28.5 26.5 31.4 27.9 25.9 24.5 23.5 15.9 15.0 20.0 17.0 14.0 12.0 10.0 19.0 18.0 15.0 14.0 12.0 18.0 15.0 13.0 11.0 10.0 20.0 18.0 15.0 14.0 13.0 14.6 13.6 10.7 11.9
SPD. (LFPM)
TEST DATE 02/00
TEST CODE 2s2p
S98086
25538
PAETC
Thermal Test
44096
03/00
2s2p
S98083
25538
PAETC
Thermal Test
44096
02/00
2s2p
S98084
Vendor Vendor 24046
PAETC PAETC 68231
Thermal Test Thermal Test MACH230-20JC
101108 101108 46968
06/96 06/96 07/91
2S2P 2S2P SM,M
24046
4790A
AM7984
99200
02/92
SM,M
24142
68230A
MACH68230
81757
10/91
24389
68335A
Mach 435-15JC
117600
03/93
25105 25105
PAETC PAETC
Thermal Test Thermal Test
44096 101108
06/96 06/96
2S2P 2S2P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26757
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 3882 4009 4104 4169 4212 3873 3970 4016 4056 4083 4307 4193 4268 4324 4351 4340 4436 4486 4531 4553 1199 1096 1104 1119 1109 1098
20.1
(°C/W)
15.9 13.6 11.7 10.4 16.8 14.2 12.6 11.4 10.5 18.9 15.1 12.3 10.3 15.0 12.6 11.0 25.0 60.0 46.0 44.0 40.0 37.0 49.0 39.0 38.0 35.0 30.0 37.0 28.0 22.0 20.0 19.0 49.0 57.0 54.0 50.0 48.0 47.0
SPD. (LFPM)
TEST DATE 09/99
TEST CODE 1s0p
99020
26757
PAETC
Thermal Test
101108
09/99
2s2p
99021
26758
PAETC
Thermal Test
181440
09/99
1s0p
99022
26758
PAETC
Thermal Test
181440
09/99
2s2p
99023
17541 23704
1182A 5982
AM81C458 AM386(TM/SX)
71400 74715
07/88 02/91
SO,M SO,M
23704
46505B
Therm Test
111834
09/91
SM,M
23704
Am29205
29205AR
116265
08/92
SO,M
24372 25122
5984AR 18602AN
Am386-SX40 Am186X2-40
11433 48024
07/94 08/94
SM,M SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25122
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 4653
EXT. NUMBER 5883
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 49500
(mW) 2472 2551 2549 2548 2548
48.0
(°C/W)
38.0 33.0 30.0 25.0 41.6 36.9 35.6 34.1 32.5 57.0 11.0 46.0 41.0 38.0 37.0 55.0 53.0 11.9
SPD. (LFPM)
TEST DATE 12/93
TEST CODE SM,M
S98062
25163
PAETC
Thermal Test
10404
07/98
2s2p
25163
8580F
Am85C80
36842
01/94
SM,M
25163 25163
8580F 8580F
Am85C80 Am85C80
36842 36842
01/94 01/94
SM,M SM,M
25163
PAETC
Thermal Test
10404
1119 1118 1169 1168 1168 1547 2616 2694 2734 2774 2799 2148 3603 3708 3789 3818 3849 1316 1353 1387 1386 1419
59.8 50.3 44.2 42.4 39.0 40.2 39.2 31.4 28.6 26.3 24.6 29.6 28.7 25.1 23.2 21.8 20.7 51.1 40.7 35.3 33.4 29.9
14.4
05/00
1s0p
S98061
25222
PAETC
Thermal Test
101108
09/98
1s0p
S98067
25222
PAETC
Thermal Test
101108
09/98
2s2p
S98068
25569
PAETC
Thermal Test
44096
11.3
05/00
1s0p
S98057
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25569
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 1336 1501 1527 1566 1606 1290 1355 1342 1369 1397 1844 1875 1908 1907 1907 1376 1433 1451 1448 1433 2307 2382 2380 2404 2430 1056 1077 1084 1089 1087 1151 1400 1437 1470 1470 1504 3017 3126 3132 3181 3194 2911 2971 3031 3052 3090
50.3
(°C/W)
12.8
36.7 31.9 28.0 25.5 52.2 40.9 36.0 30.9 28.3 36.5 32.2 29.5 28.5 27.5 48.2 38.2 33.2 31.0 28.0 28.7 24.9 23.1 22.1 21.3 52.0 40.0 37.0 32.0 29.0 47.9 39.3 33.7 32.0 28.7 33.3 28.7 27.0 25.8 24.7 34.5 30.3 27.6 26.0 24.8 14.3 13.6 13.8 14.1
SPD. (LFPM)
TEST DATE 06/00
TEST CODE 2s2p
S98058
25569
PAETC
Thermal Test
44096
05/00
1s0p
S98063
25569
PAETC
Thermal Test
44096
05/00
2s2p
S98060
25569
PAETC
Thermal Test
101108
05/00
1s0p
S98065
25569
PAETC
Thermal Test
101108
05/00
2s2p
S98066
34184
5985
Am386SX
74715
04/94
SM,M
25280
PAETC
Thermal Test
44096
04/00
1s0p
S98053
25280
PAETC
Thermal Test
44096
09/98
2s2p
S98054
25593
PAETC
Thermal Test
44096
09/98
2s2p
S98052
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25593
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 3282 3366 3396 3424 3453 1454 1521 1528 1566 1566 1972 2034 2064 2086 2116 1550 1616 1617 1651 1659 1632 1668 1667 1683 1692 1144 1166 1169 1173 1173 1277 1015 2027 2007 2018 2026 2036 1001 1992 2023 2034 2043 2053
31.1
(°C/W)
27.0 25.2 24.0 22.9 46.2 36.2 32.8 28.9 27.0 36.7 34.3 32.2 24.7 20.9 18.3 16.2 57.8 47.7 45.7 42.0 39.8 45.9 40.2 39.0 37.8 36.4 38.0 33.0 28.0 26.0 24.0 23.1 22.2 21.4 17.4 16.0 14.9 13.9 20.6 20.0 19.4 15.5 14.1 13.0 11.9 18.9 21.5 15.0
SPD. (LFPM)
TEST DATE 09/98
TEST CODE 2s2p
S98056
x25680
PAETC
Thermal Test
66568
04/00
1s0p
S98033
25827
PAETC
Thermal Test
135240
04/97
1S0P
97071
x26030
PAETC
Thermal Test
21624
09/98
1s0p
98030
x26030
PAETC
Thermal Test
21624
09/98
2s2p
98031
25114
69445
Mach
116928
03/94
1S0P
25827
PAETC
Thermal Test Chip
66568
03/97
2S2P
97070
x25827
PAETC
Thermal Test Chip
135240
03/97
2S2P
97073
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 23716
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 79960A
EXT. NUMBER AM79C960KC
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 65520
(mW) 2428 3085 2946 2593 2565
49.7
(°C/W)
41.2 37.9 34.9 33.3 32.4 12.2 43.0 38.0 32.0 29.0 26.0 25.0 45.0 39.0 35.0 33.0 32.0 31.0 13.0 22.0 19.0 17.0 16.0 14.0 41.0 32.0 30.0 27.0 49.0 38.0 35.0 32.0 29.0 10.0 45.0 39.0 34.0 30.0 27.0 10.0 29.0 26.0 23.0 20.0 18.0
SPD. (LFPM) 1000
TEST DATE 10/92
TEST CODE SM,M
23716
77640A
AM79C864
72624
1000 1000
08/92
SO,M
24412
79960AR
AM79C960
65520
05/93
SM,M
23936
5983A
Am386-DX
74715
01/91
SO,M
23705
5983
AM386TMDX
74715
04/93
SM,M
25108
1124AR
AM79C974
149733
02/94
SM,M
24374
79961AR
79C961KC
68900
01/94
SM,M
24081
29030A2
Am29030A2
194176
01/92
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24081
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 29030A2
EXT. NUMBER Am29030A2
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 194176
(mW) 2068 2151 2110 2063 2060 3110 3145 3128 3140 2513 2000 2000 2000 2000 2000 2000 2000 3000 3000 3000 3000 3000 3000 3000 4000 4000 4000 4000 3308 3536 3654 3695 3748 3707 2295 2372 2417 2456 2486 3439 3524 3531 3578 3616
35.0
(°C/W)
27.0 18.0 15.0 13.0 28.0 27.0 25.0 22.0 30.0 26.0 23.0 39.0 29.0 21.0 29.0 26.0 23.0 36.0 28.0 21.0 29.0 26.0 23.0 35.0 31.0 28.0 25.0 22.0 20.0 44.8 36.9 33.2 30.1 27.8 29.5 26.1 24.9 23.3 22.2
SPD. (LFPM)
TEST DATE 01/92
TEST CODE SO,M
24081
29030
29030
195360
11/92
SM,M
24181
29030DR
AM29030DR
194176
03/94
SM,M
24181
29030DR
AM29030DR
194176
03/94 03/94
SO,M
24181
29030DR
AM29030DR
194176
SM,M
24181
29030DR
AM29030DR
194176
03/94
SO,M
24181
29030DR
AM29030DR
194176
03/94
SM,M
24181 24407
29030DR 29030DR
AM29030DR 29030DR
194176 254560
03/94 09/93
SO,M SM,M
25369
PAETC
Thermal Test Chip
44096
08/98
1s0p
S98089
25369
PAETC
Thermal Test Chip
44096
09/98
2s2p
S98090
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25369
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test Chip
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 2274 2338 2379 2403 2427 3719 3804 3834 3859 3865 1196 1175 2071 2180 2166 2187 2187 2164 2231 2211 2216 2219 2000 2000 2000 2000 2000 2000 2000
45.5
(°C/W)
12.2
38.2 34.6 31.0 28.2 27.1 23.4 22.2 20.3 19.1 37.5 28.2 25.7 23.0 21.4 11.1 40.3 29.7 26.1 24.2 23.4 35.7 29.4 27.5 24.3 21.8 39.0 29.0 26.0 23.0 21.0 20.0 32.0 31.0 28.0 25.0 23.0 29.0 27.0 25.0 33.0 27.0 22.0
SPD. (LFPM)
TEST DATE 08/98
TEST CODE 1s0p
S98087
25369
PAETC
Thermal Test Chip
101108
07/98
2s2p
S98088
25228
29042AW
AM29040 (cs24)
103659
06/95
1S0P
25228
29042AW
AM29040 (cs24e)
103659
06/95
1S0P
25228
29042AW
AM29040 (cs24e)
103659
06/95
1S0P
25228
29042AW
AM29040 (cs24e)
103659
06/95
1S0P
23981
29035A1
AM29035A1
192400
09/91
SM,M
23981
29035B1
AM29035B1
194176
03/92
SM,M
24169
29030DR
AM29030DR
194176
03/94
SM,M
24169
29030DR
AM29030DR
194176
03/94
SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24169
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 29030DR
EXT. NUMBER AM29030DR
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 194176
(mW) 2022 1980 2010 2007 2025 1964 2016 3000 3000 3000 3000 3000 3000 3000 3008 2986 3010 3007 3031 3038 3013 4000 4000 4000 4000 4000 4000 4000 4008 3959 4008 4006 4011 3850 4011 1164 1090 1035 1049 1062
33.8
(°C/W)
29.8 26.3 32.0 27.2 22.2 30.0 28.0 25.0 32.0 27.0 22.0 32.3 29.1 25.8 32.2 26.7 22.2 29.0 28.0 25.0 31.0 27.0 25.0 31.0 28.8 25.6 31.1 26.6 22.0 34.1 28.0 27.0 26.0 25.0
SPD. (LFPM)
TEST DATE 09/94
TEST CODE SM,M
24169
29030DR
AM29030DR
194176
09/94
SO,M
24169
29030DR
AM29030DR
194176
03/94
SM,M
24169
29030DR
AM29030DR
194176
03/94
SO,M
24169
29030DR
AM29030DR
194176
09/94
SM,M
24169
29030DR
AM29030DR
194176
09/94
SO,M
24169
29030DR
AM29030DR
194176
03/94
SM,M
24169
29030DR
AM29030DR
194176
03/94
SO,M
24169
29030DR
AM29030DR
194176
09/94
SM,M
24169
29030DR
AM29030DR
194176
09/94
SO,M
25228
29044BQ
AM29044
66548
08/96
1S0P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25228
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 29044BQ
EXT. NUMBER AM29044
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 66548
(mW) 3626 3692 3754 3821 3853 3188 3254 3304 3354 3386 2843 2925 2952 3007 3024 3597 3700 3706 3738 3768 2585 2647 2679 2733 2756 2674 2729 2745 2768 2807 1022 1013 1016 1017 1015 1061 1092
43.0
(°C/W)
34.0 28.3 26.0 24.2 37.5 35.7 30.4 25.1 22.0 20.4 18.9 32.1 22.1 18.5 18.2 17.0 36.0 29.8 27.4 24.7 22.9 28.1 25.0 23.5 21.8 21.3 45.1 39.1 37.0 33.3 31.3 38.2 34.4 33.3 31.6 29.4 25.0 21.0 18.0 16.0 15.0 19.6 19.4 13.0 15.1 10.1 16.4
SPD. (LFPM)
TEST DATE 08/96
TEST CODE
S98049
25228 25228 25568
29042AR 29042AW PAETC
AM29040 AM29040 Thermal Test Chip
103659 103659 44096
03/95 03/95 06/98
1S0P 1S0P 1s0p S98050
25568
PAETC
Thermal Test Chip
44096
08/98
2s2p
S98047
25568
PAETC
Thermal Test Chip
101108
08/98
1s0p
S98048
25568
PAETC
Thermal Test Chip
101108
08/98
2s2p
98032
x26077
PAETC
Thermal Test Chip
44096
10/98
1s0p
98033
x26077
PAETC
Thermal Test Chip
44096
10/98
2s2p
25181
68355
MACH
111784
08/94
SM,M
25181 25181
68355 68355
MACH MACH
111784 111784
07/95 07/95
SO,M SO,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25378
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 79930AM
EXT. NUMBER AM79C930
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 99847
(mW) 3000 3000 3000 3000 3000 3000 1055 1136 1160 1169 1174 1124 1430 1510 1537 1549 1528
37.4
(°C/W)
31.0 28.5 26.9 26.6 23.0 21.0 19.0 16.0 15.0 26.4 26.8 17.8 15.4 13.1 11.7 27.0 22.0 18.0 15.0 14.0 26.0 21.0 16.0 14.0 12.0 33.0 26.0 21.0 17.0 16.0 26.0 21.0 16.0 15.0 23.7 15.9 14.1 13.2 12.5
SPD. (LFPM)
TEST DATE 06/95
TEST CODE 2S1P
23992
29030AP
AM29030
194176
06/91
SO,M
25229 25539
29042AW 29044BQ
AM29040 Am29044
103659 66548
02/95 05/96
15444
77184F
AM77184F
99538
06/92
SO,M
15444
77220EX
AM77220EX
99538
06/92
SO,M
15444
77200EX
AM77200EX
99538
06/92
SO,M
15444
77200E
Am79C82B
99538
11/92
SO,M
25539
PAETC
Thermal Test Chip
44096
08/96
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25578
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 5937C
EXT. NUMBER slug
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 84632
(mW) 2776 3149 3164 3134 3141 2828 2885 2940 3028 3085 1329 1301 1317 1334 1336 1271 1309 1338 1351 1380 1326 1420 1433 1444 1344 1345 2035
12.9
(°C/W)
36.0 33.0 27.0 24.0 22.0 10.0 37.0 32.0 26.0 23.0 21.0 10.0 37.0 33.0 27.0 24.0 22.0 10.0 26.0 23.0 20.0 18.0 17.0 39.0 34.0 32.0 29.0 28.0 11.0 37.0 33.0 31.0 28.0 27.0 10.0 36.0 32.0 29.0 27.0
SPD. (LFPM)
TEST DATE 03/96
TEST CODE 2S2P
24134
77184F
99538
09/92
SO,M
24134
77220E
99538
09/92
SO,M
24134
77200E
99538
09/92
SO,M
24134
29000
Am29000
104972
01/92
SM,M
24134
29001AP
Am29001AP
104972
03/92
SM,M
24134
29001AP
AM29001AP
104972
05/92
SM,M
24134
29200AR
29200AR
116265
11/91
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24154
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 29000
EXT. NUMBER AM29000
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 104972
(mW) 1339 1382 1413 1414 2823 2930 2977 2970 2979 3429 3548 3585 3617 3634
31.0
(°C/W)
25.0 22.0 21.0 40.0 36.0 33.0 29.0 27.0 26.0 40.0 35.0 33.0 30.0 28.0 12.0 43.0 34.0 30.0 26.0 25.0 41.0 38.0 35.0 34.0 31.0 40.8 31.5 10.6 41.0 37.0 31.0 29.0 25.0 36.4 30.5 27.4 25.3 23.9 29.5 25.1 23.3 22.0 21.1
SPD. (LFPM)
TEST DATE 10/90
TEST CODE SM,M
23006
77100A
AM79C82A
162722
09/90
SM,M
24338
79965A
AM79965A
86122
12/93
1S0P
1S0P 11/93 SO,M
24338
79965A
AM79965A
86122
24584
79965A
AM79965A
86122
10/93
1S0P
24584
79965A
AM79965A
86122
07/95
1S0P
24584
79965A
AM79965A
86122
09/93
SO,M
S98069
25264
PAETC
Thermal Test
101108
08/98
1s0p
S98070
25264
PAETC
Thermal Test
101108
08/98
2s2p
98014
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25264
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 44096
(mW) 1223 1258 1263 1281 1286 2374 2414 2430 2454 2470 3179 3265 3313 3371 3371 2088 2163 2185 2232 2254 3350 3423 3452 3495 3532 3251 3350 3407 3470 3491 3179 3265 3313 3371 3371 1578 3952 6734 7034 7119 7221 7281 3099 3190 3251 3309 3338
44.8
(°C/W)
12.6
37.0 35.3 31.9 29.6 36.7 33.1 31.9 30.4 28.7 32.0 26.3 23.0 20.5 19.4 31.4 26.4 23.9 20.3 17.8 30.2 26.3 24.7 23.3 21.7 31.4 25.8 22.7 19.7 18.1 32.0 26.3 23.0 20.5 19.4 16.0 15.3 15.1 12.3 11.1 32.9 27.8 24.0 21.7 20.3 13.4
SPD. (LFPM)
TEST DATE 04/98
TEST CODE 1s0p
98010
25264
PAETC
Thermal Test
44096
04/98
2s2p
S98071
25497
PAETC
Thermal Test
181440
08/98
1s0p
S98074
25497
PAETC
Thermal Test
101108
06/00
1s0p
S98073
25497
PAETC
Thermal Test
101108
10/98
2s2p
S98075
25497
PAETC
Thermal Test
181440
11/98
1s0p
S98076
25497
PAETC
Thermal Test
181440
06/00
2s2p
S98072
25524
PAETC
Thermal Test
181440
05/98
2S2P
S98077
25524
PAETC
Thermal Test
101108
12/98
1s0p
S98078
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25524
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 4756 4866 4921 4955 5031 2582 2661 2659 2730 2768 2649 2713 2728 2759 2783 1215 2883 4845 5043 5158 5296 2367 1686 3839 6474 6706 6816 6933 6993 1191 2885 4969 5157 5271 5398 5465 1830 4231 7096 7324 7447 7591 7664
21.7
(°C/W)
18.8 17.3 16.1 14.8 25.4 20.9 18.9 17.4 15.8 46.5 40.5 39.0 35.3 32.3 40.2 36.1 35.0 32.9 31.1 24.2 22.5 21.4 17.2 15.0 12.6 11.5 17.8 16.9 13.5 13.5 12.2 11.0 10.4 24.1 22.1 20.9 16.6 14.3 12.0 10.8 16.0 15.2 14.7 12.2 11.0 13.5 16.1
SPD. (LFPM)
TEST DATE 12/98
TEST CODE 2s2p
96054
25524
79971AR
AM79C971
190095
09/96
2S2P
98034
x26029
PAETC
Thermal Test
44096
10/98
1s0p
98035
x26029
PAETC
Thermal Test
44096
10/98
2s2p
25874
PAETC
Thermal Test
44096
05/97
1S0P
97106
25874
PAETC
Thermal Test
44096
05/97
2S2P
97107
25874
PAETC
Thermal Test
101108
05/97
1S0P
97108
25874
PAETC
Thermal Test
101108
05/97
2S2P
97109
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25873
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 135648
(mW) 1214 2938 5033 5229 5367 5485 5549 1767 4179 7086 7318 7446 7567 7632 1171 2816 4762 4935 5050 5168 5230 1232 2953 5043 5323 5345 5442 5487 1666 3880 6500 6693 6798 6896 6945 1785 4175 7072 7240 7377 7428 7481 3122 3187 3208 3236 3269
23.1 21.5 20.5
(°C/W)
16.2 13.6 11.5 10.5 16.1 15.2 14.6 12.1 10.8 24.0 22.4 21.6 17.5 15.0 12.7 11.5 23.3 21.6 20.6 16.6 13.7 11.8 10.8 17.4 16.5 16.0 13.3 11.9 10.7 10.1 15.8 15.2 14.6 12.2 10.8 25.5 23.0 21.9 20.6 19.1
SPD. (LFPM)
TEST DATE 05/97
TEST CODE 1S0P
97110
25873
PAETC
Thermal Test
135648
05/97
2S2P
97111
25873
PAETC
Thermal Test
181440
05/97
1S0P
97111a
25873
PAETC
Thermal Test
181440
05/97
1S0P
97112
25873
PAETC
Thermal Test
181440
05/97
2S2P
97112a
25873
PAETC
Thermal Test
181440
05/97
2S2P
98042
26093
PAETC
Thermal Test
44096
10/98
2s2p
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 21792
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 29000
EXT. NUMBER AM29000
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 195750
(mW) 2778 2866 3001 3090 2506 1609 1699 1247 1341 1434 1404 1377 1301 1243 1457 1481 1483 1290 2118 2225 2311 2374 2603 2424 2532 2627 2701 2765 3354 2745 2718 2635 2800 2706
26.0
(°C/W)
24.0 21.0 19.0 20.0 19.0 14.0 11.0 17.0 16.0 13.0 11.0 33.0 30.0 28.0 27.0 26.0 36.0 31.0 29.0 28.0 26.0 11.0 37.0 33.0 31.0 29.0 28.0 12.0 38.0 35.0 32.0 29.0 27.0 35.0 32.0 27.0 24.0 23.0
SPD. (LFPM)
TEST DATE 07/90
TEST CODE SM,M
24361
5972B
Am486
136800
03/94
SM,M
24361
5973A
Am486
138240
12/93
SM,M
24361
5970
AM486 DX-50
138240
08/92
SO,M
21792
29005
AM29005
195750
08/90
SM,M
23703 24134
2900E 77184F
AM29000E
193600 99538
04/91 07/92
SM,M SM,M
24134
77200E
99538
07/92
SM,M
24134
29000GIR
AM29000F
104972
08/93
SM,M
24134
29000GIR
AM29000F
104972
08/93
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 46520
EXT. NUMBER AM46520
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 111834
(mW) 2043 2022 2008 1797 1873 1901 1939 3428 3573 3645 3703 3740 6458 6575 6684 6765 6825 2345 2401 2408 2414 2436 1560 1594 1617 1629 1640 1000 1263 1264 1271 3608
(°C/W)
36.0 33.0 31.0
SPD. (LFPM)
TEST DATE 10/90
TEST CODE SM,M
23997
29000FP
AM29000FP
104972
22.0 18.0 16.0 14.0 21.8 17.5 15.1 13.0 11.9 13.1 11.1 10.1 27.9 24.0 22.8 22.0 21.2 40.4 33.4 30.6 28.5 27.2 61.4 51.7 45.0 41.4 37.6 60.9 47.8 38.7 34.7 31.7 38.5 37.1 38.1 14.3 30.5 31.4 11.3
10/91
SO,M
26222
PAETC
Thermal Test
44096
05/99
1s0p
99008
26222
PAETC
Thermal Test
44096
05/99
2s2p
99009
x25960
PAETC
Thermal Test
44096
08/98
2s2p
98011
x25960
PAETC
Thermal Test
44096
08/98
1s0p
98015
24199
79950B
CURIO
118674
03/96
24199
79950B
CURIO
118674
04/96
24192 24192
29240bo 29240B3
29240bo Am29240
141360 141360
08/94 11/94
SM,M SM,M
24192 25336
29240B3 6137CY
Am29240
141360 84632
11/94 03/96
SO,M 2S2P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25560
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 5937C
EXT. NUMBER
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 209764
(mW) 2832 1976 1961 1986 2009 2.614 2.899 2.944 2.956 2.936 2165 2607 2571 2475 2470 2.554 2.231 2.238 2.263 2.228 2.557 3.048 3.022 2.994 2.981 4116 4253 4310 4330 4347 4119 4301 4346 4368 4385 5342 5547 5681 5785 5872 5609 5791 5881 5942 5967
14.2
(°C/W)
13.6 13.3 13.2 13.3 15.6 11.2 14.1 17.6 13.9 11.7 12.0
SPD. (LFPM)
TEST DATE 03/96
TEST CODE 2S2P
25559
5937C
209764
03/96
2S2P
25559
5937C
209764
03/96
2S2P
25559
5937C
209764
03/96
2S2P
25559
5937C
209764
01/96
2S2P
98002
25650
PAETC
Thermal Test
181440
03/98
2S4P
98009
25650
PAETC
Thermal Test
181440
03/98
2S4P
99014
26669
PAETC
Thermal Test
101108
04/99
1s0p
99015
26669
PAETC
Thermal Test
101108
04/99
2s2p
98001a
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER Unknown
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 5415 5825 5901 5958 5989 5412 5654 5754 5821 5891 5422 5682 5817 5986 6087 7343 7679 7808 7954 8088 3444 3597 3649 3725 3748 4855 5043 5137 5198 5227 5188 5327 5388 5464 5517 1031 1042 1060 1048 1035 1010
11.6
(°C/W)
12.9 18.9 14.8 12.4 10.1 13.8 10.7 19.1 14.3 12.3 13.6 11.0 20.3 17.8 16.6 15.0 14.0 29.0 25.0 23.0 22.0 20.0 27.9 22.5 20.3 18.8 17.6
SPD. (LFPM)
TEST DATE 03/98
TEST CODE 2S2P
98008
Unknown
PAETC
Thermal Test
101108
03/98
2S2P
S98079
25573
PAETC
Thermal Test
44096
10/98
1s0p
S98080
25573
PAETC
Thermal Test
44096
10/98
2s2p
98054
25573
PAETC
Thermal Test
135240
05/00
1s0p
S98081
25573
PAETC
Thermal Test
135240
06/00
2s2p
S98082
x26213
PAETC
Thermal Test
101108
03/99
2s2p
24192
5970
138240
10/92
SM,M
24505
77400AR
AM79C850
174624
06/95
1S0P
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 24505
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 77400AR
EXT. NUMBER AM79C850
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 174624
(mW) 1115 1025 1050 1059 1062 1518 1370 1394 1406 1389 1384 1413 2195 2281 2267 2280 2308 2502 2367 2405 2426 2338 2637 2469 2572 5367 5529 5604 5676 5730 1332 1230 1242 1325 1243 1270
34.7
(°C/W)
26.3 21.5 19.3 18.3 22.9 36.0 32.0 29.0 27.0 26.0 36.5 34.0 32.6 31.4 29.6 32.5 26.4 24.8 22.8 21.8 16.1 12.4 11.6 10.3 20.6 17.7 22.5 18.0 19.8 16.4 20.4 16.5 16.5 14.2 12.8 11.5 10.7 32.0 24.0 21.0 20.0 18.0
SPD. (LFPM)
TEST DATE 06/95
TEST CODE
24585 24700
68465A 5977B
MACH 486XL
184900 143964
12/94 04/94
SO,M SM,M
25501
29248
Am29240eh
64714
01/96
SM,6lyr
25501
29248
Am29240EH
64714
05/96
2S2P
24585
68465A
MACH
184900
04/95
2S2P
25699
PAETC
Heat Sink
44096
10/96 10/96 10/96 10/96 10/96 10/96 10/96 10/96 03/99
1S0P 2S2P 1S0P 2S2P 1S0P 2S2P 1S0P 2S2P 2s2p
96062 96074 96064 96076 96063 96075 96065 96077 98053
25699
PAETC
Heat Sink
101108
26212
PAETC
Thermal Test
101108
23735
5961BX
AM286BX
247434
09/91
SM,M
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 23735
DIM. (MILS)
DIM. (MILS)
INT. NUMBER 5961BX
EXT. NUMBER AM286BX
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 247434
(mW) 1825 1844 1786 1796 1835 3005 2995 3020 3027 3008 1057 2594 3784 2594 3218 3229 3175 3203 1492 4326 4468 4521 4563 4587 4003 4095 4130 4160 4174 3979 4063 4097 4122 4136
30.0
(°C/W)
24.0 21.0 19.0 18.0 28.0 27.0 23.0 18.0 17.0 33.0 31.0 28.0 26.0 24.0 11.5 11.5 41.1 17.5 14.0 12.8 11.8 11.3 21.1 18.1 16.9 16.0 15.5 16.3 13.8 12.6 11.9 11.5
SPD. (LFPM)
TEST DATE 09/91
TEST CODE SM,M
23735
5961AX
AM286LX
247434
05/91
SM,M
24505
46505
46505
111834
11/93
SM,M
25579
5937C
slug
84632
04/96
2S2P
25579
5937C
slug
84632
03/96
2S2P
96068
25646 26074
PAETC PAETC
Thermal Test
101108 44096
08/96 03/01
2S2P 2S2P 21061
27118
PAETC
Thermal Test
101108
02/01
2s2p
21060
27120
PAETC
Thermal Test
101108
12/00
2s2p
20020
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 27120
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 4337 4446 4490 4509 4527 4200 4295 4345 4377 4392 1152 1924 1939 1965 1995 2016 1181 1955 1983 2021 2052 2067 3497 3592 3627 3650 3667 12000 12000 12000 12000 12000 12000 12000 12000 12000 14000 14000 14000 14000 14000 14000
14.0
(°C/W)
11.5 10.4 15.6 12.7 11.5 10.6 10.2 58.0 55.5 53.8 48.1 41.3 34.9 32.2 58.6 55.9 54.1 48.7 41.5 36.1 33.2 21.5 18.2 17.0 16.2 15.6 13.7 10.4 10.2
SPD. (LFPM)
TEST DATE 12/00
TEST CODE 2s2p
20021
27119
PAETC
Thermal Test
101108
02/01
2s2p
21047
25675
PAETC
181440
04/97
97078
25675
PAETC
181440
04/97
97079
26739
PAETC
101108
08/01
2s2p
21097
25415
NCRTTD
Thermal Test
337500
06/96
95141
25242
NCRTTD
Thermal Test
337500
06/96
95140
25423
NCRTTD
Thermal Test
337500
06/96
95139
25415
NCRTTD
Thermal Test
337500
06/96
96082
25242
NCRTTD
Thermal Test
337500
06/96
96098
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 25423
DIM. (MILS)
DIM. (MILS)
INT. NUMBER NCRTTD
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 337500
(mW) 14000 14000 14000 14664 15671 10137 14856 15040 15037 13847 4117 3713 3674 3591 3666 2469 5997 10162 6983 7076 7166 7218 3962 3950 4021 4018 4043 4066 4051 4057 4089 4116 4140 4048 8792 9090 9239 9343 9414
(°C/W)
10.0 11.6 11.0 10.4 10.0 12.4 11.4 10.8
SPD. (LFPM)
TEST DATE 06/96
TEST CODE
96082
25676
PAETC
Thermal Test
273840
97114 10/96 12/96 10/96 07/97 02/98 12/98 06/96 2s2p 2S2P 98045 98003
25676 25676 25755 25755 25755 25581
PAETC PAETC PAETC PAETC PAETC
Thermal Test Thermal Test Thermal Test Thermal Test Thermal Test Thermal Test
273840 273840 273840 101108 273840 101108
PAETC
26006
PAETC
Thermal Test
101108
03/98
2S2P
98036
x25811
PAETC
Thermal Test
44096
03/97
2S2P
x25811
PAETC
Thermal Test
101108
03/97
2S2P
97152
26094
PAETC
Thermal Test
181440
06/98
2s1p
97153
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26001
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 2219 5180 8730 4936 4998 5032 5069 6228 6396 6466 6519 6546 7539 7592 7727 7797 7837 7864 8275 1569 1624 1635 1654 1660 1355 1393 1408 1416 1436 1582 1603 1611 1616 1621 1610 1629 1666 1689 1702 4909 5024 5070 5102 5129
12.6 12.5 12.8
(°C/W)
11.8 41.5 34.6 31.2 28.8 27.5 30.7 21.9 19.2 17.7 17.0 26.6 23.0 21.7 20.9 20.3 41.6 39.1 33.1 29.2 27.3 14.5 11.6 10.6 13.2 13.9 13.0
SPD. (LFPM)
TEST DATE 03/98
TEST CODE 2S2P
97154
26812
PAETC
Thermal Test
101108
04/00
2s2p
99063
27017
PAETC
Thermal Test
181440
11/00
2s2p
20013
PAETC
Thermal Test
44096
10/98
1s0p
98038
PAETC
Thermal Test
44096
10/98
1s0p
98037
PAETC
Thermal Test
44096
10/98
2s2p
98039
PAETC
Thermal Test
44096
11/98
SO,1s0p
98041
26358
PAETC
Thermal Test
101108
10/98
2s2p
98049
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26358-I
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 101108
(mW) 4913 5026 5024 5045 5065 4303 4399 4445 4472 4487 4497 4554 4701 4823 4889 5446 5591 5657 5693 5717 7706 7913 8017 8092 8131 3584 3708 3804 3826 3804 3858 3953 3993 4016 4026
13.8
(°C/W)
11.8 10.8 10.1 16.6 14.7 13.6 12.9 12.5 26.3 24.7 20.6 17.7 16.2 12.1 10.4 12.2 10.6 15.8 11.7
SPD. (LFPM)
TEST DATE 12/98
TEST CODE 2s2p
99004
ase-ibhf
PAETC
Thermal Test
66976
03/99
2s2p
99005
ase-ibhf
PAETC
Thermal Test
66976
03/99
2s2p,SO
98048
x26281
PAETC
Thermal Test
101108
02/99
2s2p
99006
x26408
PAETC
Thermal Test
101108
02/99
2s2p
97139
26679
PAETC
Thermal Test
181440
11/99
1s0p
99052
26679
PAETC
Thermal Test
181440
11/99
2s2p
99053
26981
PAETC
Thermal Test
101108
5368 5473 5573 5571 5594 5624
12.5 10.8
10/00
2s2p
20011
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26981
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 181440
(mW) 6074 6171 6224 6264 6283 7926 5180 5253 5288 5323 5322 5253 1622 3821 6412 6554 6648 6735 6772 3695 3764 3808 3833 3851 6107 6213 6262 6299 6318 5942 6072 6132 6177 6210 6008 6191 6263 6290 6335 5435 5517 5563 5592 5610
10.7
(°C/W)
16.6 16.2 15.9 14.1 13.0 12.0 11.6 20.2 17.7 16.4 15.6 15.3 12.9 10.6 14.8 13.0 11.9 11.2 10.8 12.4 10.6 13.6 11.5 10.5
SPD. (LFPM)
TEST DATE 10/00
TEST CODE 2s2p
20012
26981
PAETC
Thermal Test
181440
01/01
2s2p
s29949
25911
PAETC
Thermal Test
101108
10/97
2S2P
97140
25911
PAETC
Thermal Test
44096
03/98
2S2P
99001
27072
PAETC
Thermal Test
181440
03/01
2S2P
21062
ase-ibfic
PAETC
Thermal Test
135648
03/99
2S2P
99002
ase-ibfic
PAETC
Thermal Test
135648
03/99
2S2P
26740
PAETC
Thermal Test
181440
04/00
2s2p
99059
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization
9/5/01
Thermal Resistance Analysis Update
Page
PKG. TYPE
FRM. NUMBER 26650
DIM. (MILS)
DIM. (MILS)
INT. NUMBER PAETC
EXT. NUMBER Thermal Test
DIM. (MILS)
DIM. (MILS)
AREA (mil2) 285092
(mW) 4329 4377 4420 4440 4454 4846 4855 4884 4895 4908
17.5
(°C/W)
14.4 11.5 10.1 12.9 10.6
SPD. (LFPM)
TEST DATE 03/00
TEST CODE 1s0p
20004
26650
PAETC
Thermal Test
285092
03/00
2s2p
20006
KEY:
SOCKETED SURFACE MOUNTED (SOLDERED) ATTACHED HEAT SINK information provided requestor MOST (CMOS Therm. Imp. Analysis System) 1S0P (one signal, zero plane) 2S1P (two signal, plane) 2S2P (two signal, plane) wired directly leads Trimmed Formed Vertical position Wind Tunnel
Advanced Assembly Technology
Advanced Micro Devices
Thermal Characterization

Thermal Resistance Analysis Update PKG. TYPE FRM. NUMBER 185

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