Package Appendix Package In-house Sub-contractor L

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Package Appendix Package In-house Sub-contractor L

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Package Capabilities
Package
Appendix
Package
In-house Sub-contractor
LQFP Package 0707 1010 1212 1420 1414 2020 2024 2828 TQFP 1212 1414 1420 Pitch 0.065
most current package availability capability obtained from your local Samsung Technology Design Centers.
Lead Inductance 12nH
Lead Count
17nH 17nH 10nH
PQFP (PQ2 Thermally Enhanced) Package 1420 Pitch P(°C/W) P(°C/W) P(°C/W) P(°C/W) P(°C/W) P(°C/W) Lead Count Remarks P(°C/W) P(°C/W)
0.65 2828 0.65 3232 4040 (with Heat Spreader) 0.65 1420 2828 0.65 3232 4040
STDL130
Samsung ASIC
Appendix
Package
In-house Sub-contractor
PLCC Package 7.37 12.35 11.53 11.53 11.44 13.98 16.61 16.61 19.10 19.10 24.23 24.23 29.31 29.31 PBGA (2L) Package Pitch 1422 1.27 1515 2323 1.27 2727 1.27 3131 1.27 3535 1.27 4242 1.27 PBGA (ML) 1515 2323 1.27 2727 1.27 3131 1.27 3535 1.27 Lead Lead Count Inductance Lp/g Lsig <13nH <18nH <21nH <21nH <13nH <14nH <13nH <18nH <21nH <13nH <14nH Pitch Lead Inductance 1.27 13nH Lead Count Remarks
SBGA Package 2727 3131 3535 42.5 47.5 4545 47.5 47.5 Pitch Lead Inductance Lp/g Lsig <9nH <9nH Lead Count Remarks P(°C/W) 12.3 P(°C/W) 10.8 P(°C/W) P(°C/W) P(°C/W) P(°C/W)
1.27
Samsung ASIC
STDL130
Package
Appendix
In-house Sub-contractor FBGA (Tape)
Package 1212 1313 1515 1616 FBGA (PCB) 0607 0909 1010 1212 1313 1515 1717 Pitch 0.75 48(36) 64(56) Lead Count
Package 8.34 20.30 TSOP1 1014 PLCC 24.33 24.23mm 1420 FBGA 0909 0911 1717 Pitch 1.27 1.27 0.65 0.75 1.00 64(56) Lead Count
PBGA Thermal Resistance
Package Type PBGA (2L) PBGA (ML) FBGA (Tape) FBGA (PCB)
(°C/W) 15.5 (°C/W) (°C/W) 38.8 (°C/W)
STDL130
Samsung ASIC

Package Appendix Package In-house Sub-contractor L

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