These n-channel enhancement mode power field effect transistors produc

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These n-channel enhancement mode power field effect transistors produc

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NDP408A NDP408AE NDP408B NDP408BE NDB408A NDB408AE NDB408B NDB408BE N-Channel Enhancement Mode Field Effect Transistor
These n-channel enhancement mode power field effect transistors produced using National's proprietary, high cell density, DMOS technology. This very high density process been especially tailored minimize on-state resistance, provide superior switching performance, withstand high energy pulses avalanche commutation modes. These devices particularly suited voltage applications such automotive, DC/DC converters, motor controls, other battery powered circuits where fast switching, in-line power loss, resistance transients needed.
1994
Features
11A, 80V. RDS(ON) 0.16 0.20. Critical electrical parameters specified elevated temperature. Rugged internal source-drain diode eliminate need external Zener diode transient suppressor. 175°C maximum junction temperature rating. High density cell design extremely RDS(ON). TO-220 TO-263 (D2PAK) package both through hole surface mount applications.
Absolute Maximum Ratings
Symbol Parameter VDSS VDGR VGSS TJ,TSTG Drain-Source Voltage Drain-Gate Voltage (RGS Gate-Source Voltage Continuous Nonrepetitive Drain Current Continuous Pulsed Total Power Dissipation 25°C Derate above 25°C
25°C unless otherwise noted
NDP408A NDP408AE NDB408A NDB408AE 0.33
NDP408B NDP408BE NDB408B NDB408BE
Units
W/°C
Operating Storage Temperature Range Maximum lead temperature soldering purposes, 1/8" from case seconds
NDP408.SAM
Electrical Characteristics
Symbol Parameter Single Pulse Drain-Source Avalanche Energy
25°C unless otherwise noted)
Conditions
Type NDP408AE NDP408BE NDB408AE NDB408BE
Units
DRAIN-SOURCE AVALANCHE RATINGS (Note
Maximum Drain-Source Avalanche Current
CHARACTERISTICS BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage, Forward Gate Body Leakage, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance VGS, 125°C 125°C NDP408A NDP408AE NDB408A 125°C NDB408AE NDP408B NDP408BE NDB408B 125°C NDB408BE NDP408A NDP408AE NDB408A NDB408AE NDP408B NDP408BE NDB408B NDB408BE Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance DYNAMIC CHARACTERISTICS 0.11 0.19 -100 0.16 0.32
CHARACTERISTICS (Note
ID(on)
On-State Drain Current
Ciss Coss Crss
NDP408.SAM
Electrical Characteristics
Symbol tD(ON) tD(OFF) Parameter Turn Delay Time Turn Rise Time Turn Delay Time Turn Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
25°C unless otherwise noted)
Conditions RGEN
Type
Units
SWITCHING CHARACTERISTICS (Note
NDP408A NDP408AE NDB408A NDB408AE NDP408B NDP408BE NDB408B NDB408BE
DRAIN-SOURCE DIODE CHARACTERISTICS Maximum Continuos Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
NDP408A NDP408AE NDB408A NDB408AE NDP408B NDP408BE NDB408B NDB408BE
(Note
Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Current
dIS/dt A/µs
125°C
0.87 0.74
THERMAL CHARACTERISTICS Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 62.5 °C/W °C/W
Notes: NDP408A/408B NDB408A/408B rated operation avalanche mode. Pulse Test: Pulse Width Duty Cycle 2.0%.
NDP408.SAM
Typical Electrical Characteristics
DRAIN-SOURCE CURRENT
DS(on) NORMALIZED DRAIN-SOURCE ON-RESISTANCE
DRAIN-SOURCE VOLTAGE
DRAIN CURRENT
Figure On-Region Characteristics.
Figure On-Resistance Variation with Gate Voltage Drain Current.
DRAIN-SOURCE ON-RESISTANCE
DS(on), NORMALIZED
DRAIN-SOURCE ON-RESISTANCE
125°C
DS(ON) NORMALIZED
25°C
-55°C
JUNCTION TEMPERATURE (°C)
DRAIN CURRENT
Figure On-Resistance Variation with Temperature.
Figure On-Resistance Variation with Drain Current Temperature.
GATE-SOURCE THRESHOLD VOLTAGE
DRAIN CURRENT
-55°C
NORMALIZED
250µA
GATE SOURCE VOLTAGE
JUNCTION TEMPERATURE (°C)
Figure Transfer Characteristics.
Figure Gate Threshold Variation with Temperature.
NDP408.SAM
Typical Electrical Characteristics (continued)
1.15 UDRAIN-SOURCE BREAKDOWN VOLTAGE
250µA
125°C 25°C -55°C
REVERSE DRAIN CURRENT
JUNCTION TEMPERATURE (°C)
NORMALIZED
1.05
0.95
0.01
BODY DIODE FORWARD VOLTAGE
Figure Breakdown Voltage Variation with Temperature.
Figure Body Diode Forward Voltage Variation with Current Temperature.
GATE-SOURCE VOLTAGE
1000
CAPACITANCE (pF)
DRAIN SOURCE VOLTAGE
GATE CHARGE (nC)
Figure Capacitance Characteristics.
Figure Gate Charge Characteristics.
d(on)
d(off)
Output,
Inverted
Input,
Pulse Width
Figure Switching Test Circuit.
Figure Switching Waveforms.
NDP408.SAM
Typical Electrical Characteristics (continued)
TRANSCONDUCTANCE (SIEMENS)
-55°C
125°C
25°C
adjusted reach desired peak inductive current,
DRAIN CURRENT
Figure Transconductance Variation with Drain Current Temperature.
Figure Unclamped Inductive Load Circuit Waveforms.
DRAIN CURRENT
SINGLE PULSE 25°C
DRAIN-SOURCE VOLTAGE
Figure Maximum Safe Operating Area.
TRANSIENT THERMAL RESISTANCE
r(t), NORMALIZED EFFECTIVE
r(t) °C/W
0.05 P(pk)
0.05 0.03 0.02
0.02 0.01 Single Pulse
Duty Cycle, 0.05 ,TIME (ms) 1000
0.01 0.01
0.02
Figure Transient Thermal Response Curve.
NDP408.SAM

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