March 1994 Aero Analog Surface Mount Products National Semic
|
|
|
Top Searches for this datasheet
Aero Analog Surface Mount Products
March 1994
Aero Analog Surface Mount Products
National Semiconductor's Aero Analog Group offers large range military qualified linear devices surface mount configurations Hardware available small hermetically sealed outlines Leadless Chip Carrier (LCC) Ceramic Flatpak Both rugged packages meet rigorous screening requirements MIL-STD-883 MIL-M-38510 These packages ideal applications where space limitations require extremely small light weight devices addition their profiles take less total volume than traditional insertion devices while lowering board cost because plated through holes eliminated savings volume possible additional performance cost benefits Since does have leads component preparation prior assembly required system performance will reflect compensation parasitic capacitances inductances leaded devices Multilayer boards used
Features
Amps Buffers Comparators Voltage References Filters Linear Regulators available surface mount configurations Same guaranteed performance traditional leaded packages Substantial space weight system cost savings Available either Slash Sheet depending model
Applications
Avionics Missiles Torpedos Sonobuoys Phased Array Radars Portable Communications Airborne Electronic Counter Measures
11305
11305
20-Lead Chip Carrier
10-Lead Ceramic Flatpak Package
11305
11305
14-Lead Flatpak Package
16-Lead Ceramic Flatpak Package
11305
11305
44-Pin Leadless Chip Carrier
44-Pin Ceramic Flatpak
C1995 National Semiconductor Corporation
11305
RRD-B30M115 Printed
Outlines Dimensions Leadless Chip Carrier (LCC)
PACKAGE (E20A) MIL-M-38510 Package Code MIL-STD-883 Package Code
Ceramic Flatpak 10-Pin
Package (W10A) MIL-STD-883 Package Code
Outlines Dimensions (Continued) Ceramic Flatpak 14-Pin
Package (W14B) MIL-M-38510 Package Code MIL-STD-883 Package Code
Ceramic Flatpak 16-Pin
Package (F16B) MIL-M-38510 Package Code MIL-STD-883 Package Code
Outlines Dimensions (Continued) Leadless Chip Carrier (LCC) 44-Pin
Package (EL44A)
Ceramic Flatpak 44-Pin
Package (WA44A)
Aero Surface Mount Package Types
Base LH0002 LH2111 LM101 LM108 LM111 LM117 LM118 LM119 LM124 LM139 LM148 LM185B LM1882 LM6118 LM613AM LM6161 LM6162 LM6164 LM6165 LM709 LM710AM LM711AM LM723 LM741 LM747 LMF100A LP2951 LM12458M
Package Types Glass Metal Small Multi-Lead Metal TO-99 TO-100 Ceramic Large Multi-Lead Metal TO-3 Ceramic Quad J-bend
Description Current Amplifier Dual Voltage Comparator Uncompensated Precision Voltage Comparator Adjustable Positive Regulator High Speed High Speed Dual Comparator Power Quad Power Quad Comparator Quad Precision Voltage Reference Video Generator Dual Precision Super-BlockAmp Comparator High Speed High Speed High Speed High Speed General Purpose Differential Comparator Dual Differential Comparator Voltage Regulator Compensated Dual Compensated Switched-Capacitor Filter Micro-power Voltage Regulator 12-bit Self-Calibrated Data
Leadless Chip Carrier 20-Lead
Flatpak
Other Aero Packages
20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead
16-Pin 10-Pin 10-Pin 10-Pin 10-Pin 10-Pin 14-Pin 14-Pin 14-Pin
10-Pin 10-Pin 10-Pin 10-Pin 10-Pin 10-Pin 10-Pin 10-Pin 14-Pin
20-Lead
20-Lead 20-Lead 44-Lead
44-Pin
Super-Blockis trademark National Semiconductor Corporation
Thermal Data
Power dissipation surface mount packages dependent many design factors Board material thickness area proximity other heat generating components Base LH0002 LH2111 LM101 LM108 LM111 LM117 LM118 LM119 LH124 LM139 LM148 LM185B LM1882 LM6118 LM613AM LM6161 LM6162 LM6164 LM6165 LM709 LM709A LM710AM LM711AM LM723 LM741 LM747 LMF100A LP2951 LM12458 20-Lead 20-Lead 44-Lead 44-Pin 20-Lead 10-Lead 14-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 20-Lead 10-Lead 10-Lead 10-Lead 10-Lead 10-Lead 10-Lead 10-Lead 10-Lead 20-Lead 20-Lead 10-Lead 10-Lead 14-Lead 14-Lead 14-Lead Leadless Chip Carrier 20-Lead contribute devices dissipation capabilities design following thermal information provided
Flatpak
14-Lead 10-Lead 10-Lead 10-Lead
Geometries Leadless Chip Carrier
Unit (inch)
11305
Dimension leads
Inches
Leadless Chip Carriers (LCC) Pinout Diagrams
LH0002E 20-Lead View LM111E 20-Lead View
11305
11305
LM117E 20-Lead View
LM119E 86014012A 20-Lead View
11305
11305
Leadless Chip Carriers (LCC) Pinout Diagrams (Continued)
LM124E LM124AE 20-Lead View LM139E LM139AE 20-Lead View
11305-10
11305
LM148E 20-Lead View
LM185E-1 LM185E-2 LM185BE 20-Lead View
11305-12
11305
LM1882E 20-Lead View
LM6118E 5962-9156501M2A 20-Lead View
11305 11305-14
Leadless Chip Carriers (LCC) Pinout Diagrams (Continued)
LM613AME 20-Lead View LM6161E LM6162E LM6164E LM6165E 5962-89621012X 5962-92165012X 5962-89624012X 5962-89625012X 20-Lead View
11305
11305
LM723E 20-Lead View
LMF100AE 20-Lead View
11305
11305
LP2951E 20-Lead View
11305
Flatpak Pinout Diagrams
LH2111F 16-Lead Flatpak View LM101AW JM38510 10103BHA (JL101BHA) LM101W 10-Lead Flatpak View
11305
11305
LM108W LM108AW JM38510 10104BHA (JL108BHA) 10-Lead Flatpak View
LM111W JM38510 10304BHA (JL111BHA) 10-Lead Flatpak View
11305
11305
JM38510 10107BHA (JL118BHA) (LM118AW) 10-Lead Flatpak View
LM119W 8601401HX 10-Lead Flatpak View
11305 11305
LM124W JM38510 11005BDA (JL124BDA) LM124AW JM38510 11006BDA 14-Lead Flatpak View
LM139W JM38510 11201BDA (JL139BDA) 14-Lead Flatpak View
11305
11305
Flatpak Pinout Diagrams (Continued)
JM38510 11001BDA (JL148BDA) 14-Lead Flatpak View LM6161W LM6162W LM6164W LM6165W 5962-8962101HX 5962-9216501HX 5962-8962401HX 5962-8962501HX 10-Lead Flatpak View
11305 11305
LM709W LM709AW 10-Lead Flatpak View
LM710AMW JM38510 10301BHA (JL710BHA) 10-Lead Flatpak View
11305 11305
LM711AMW 10-Lead Flatpak View
LM741W JM38510 10101BHA (JL741BHA) 10-Lead Flatpak View
11305
11305
JM38510 10102BDA (JL747BDA) 14-Lead Flatpak View
11305
Aero Analog Surface Mount Products
110500
LIFE SUPPORT POLICY NATIONAL'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL PRESIDENT NATIONAL SEMICONDUCTOR CORPORATION used herein Life support devices systems devices systems which intended surgical implant into body support sustain life whose failure perform when properly used accordance with instructions provided labeling reasonably expected result significant injury user
National Semiconductor Corporation 1111 West Bardin Road Arlington 76017 1(800) 272-9959 1(800) 737-7018
critical component component life support device system whose failure perform reasonably expected cause failure life support device system affect safety effectiveness
National Semiconductor Europe (a49) 0-180-530 Email cnjwge tevm2 Deutsch (a49) 0-180-530 English (a49) 0-180-532 Fran (a49) 0-180-532 Italiano (a49) 0-180-534
National Semiconductor Hong Kong 13th Floor Straight Block Ocean Centre Canton Tsimshatsui Kowloon Hong Kong (852) 2737-1600 (852) 2736-9960
National Semiconductor Japan 81-043-299-2309 81-043-299-2408
National does assume responsibility circuitry described circuit patent licenses implied National reserves right time without notice change said circuitry specifications
Other recent searches
THS8083A95 - THS8083A95 THS8083A95 Datasheet
SN74LS651 - SN74LS651 SN74LS651 Datasheet
SN74LS653 - SN74LS653 SN74LS653 Datasheet
SN54LS651 - SN54LS651 SN54LS651 Datasheet
SN54LS653 - SN54LS653 SN54LS653 Datasheet
MPC506A - MPC506A MPC506A Datasheet
MPC507A - MPC507A MPC507A Datasheet
GSWX-26 - GSWX-26 GSWX-26 Datasheet
ENA1433 - ENA1433 ENA1433 Datasheet
2SC4562G - 2SC4562G 2SC4562G Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
