20V/2.8A RDS(ON)=45m(typ.) VGS=4.5V RDS(ON)=55m(typ.) VGS=2.5V Super H

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20V/2.8A RDS(ON)=45m(typ.) VGS=4.5V RDS(ON)=55m(typ.) VGS=2.5V Super H

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APM2314
20V/2.8A RDS(ON)=45m(typ.) VGS=4.5V RDS(ON)=55m(typ.) VGS=2.5V Super High Dense Cell Design Extremely RDS(ON) Reliable Rugged SOT-23 Package
Description
View SOT-23
Applications
Power Management Notebook Computer Portable Equipment Battery Powered Systems.
Ordering Marking Information
andling Package Code
N-Channel MOSFET
Package Code perating Junction ange andling
2314
Absolute Maximum Ratings
Symbol VDSS VGSS Drain-Source Voltage Gate-Source Voltage Parameter
25°C unless otherwise noted)
Rating Unit
Maximum Drain Current Continuous Maximum Drain Current Pulsed
ANPEC reserves right make changes improve reliability manufacturability without notice, advise customers obtain latest version relevant information verify before placing orders. Copyright ANPEC Electronics Corp. Rev. Jun., 2003 www.anpec.com.tw
Surface Mounted Board, sec.
APM2314
Absolute Maximum Ratings (Cont.)
Symbol Parameter Maximum Power Dissipation TA=25°C TA=100°C TSTG Maximum Junction Temperature Storage Temperature Range Thermal Resistance Junction Ambient
25°C unless otherwise noted)
Rating 1.25 Unit °C/W
Electrical Characteristics
Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa Dynamic td(ON) td(OFF) Ciss Coss Crss
25°C unless otherwise noted)
APM2314 Min. Typ. Max.
Parameter
Test Condition
Unit
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance
VGS=0V IDS=250µA VDS=16V VGS=0V VDS=VGS IDS=250µA VGS=±10V VDS=0V VGS=4.5V IDS=1.2A VGS=2.5V IDS=0.8A ISD=0.5A VGS=0V VDS=10V IDS= VGS=4.5V VDD=10V IDS=1A, VGEN=4.5V RG=6, RL=10 VGS=0V
0.75 ±100
VDS=15V Reverse Transfer Capacitance Frequency=1.0MHz
Notes
Pulse test pulse width 300µs, duty cycle Guaranteed design, subject production testing
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Typical Characteristics
Output Characteristics
VGS=2,3,4,5,6,7,8,9,10V
Transfer Characteristics
ID-Drain Current
ID-Drain Current
TJ=125°C TJ=-55°C
VGS=1V
TJ=25°C
Drain-to-Source Voltage
Gate-to-Source Voltage
Threshold Voltage Junction Temperature
1.75
IDS=250µA
On-Resistance Drain Current
0.09 0.08
VGS(th)-Threshold Voltage (Normalized)
RDS(ON)-On-Resistance
1.50 1.25 1.00 0.75 0.50 0.25 0.00
0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00
VGS=4.5V VGS=2.5V
Junction Temperature (°C)
Drain Current
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Typical Characteristics (Cont.)
On-Resistance Gate-to-Source Voltage
0.070
ID=1.2A
On-Resistance Junction Temperature
VGS=4.5V ID=1.2A
RDS(ON)-On-Resistance
RDS(ON)-On-Resistance (Normalized)
0.065 0.060 0.055 0.050 0.045 0.040 0.035 0.030
Gate-to-Source Voltage
Junction Temperature (°C)
Gate Charge
VDS=10V ID=3A
Capacitance
Frequency=1MHz Ciss
VGS-Gate-Source Voltage
Capacitance (pF)
Coss
Crss
Gate Charge (nC)
Drain-to-Source Voltage
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Typical Characteristics (Cont.)
Source-Drain Diode Forward Voltage
Single Pulse Power
IS-Source Current
TJ=150°C TJ=25°C
Power
0.01
-Source-to-Drain Voltage
Time (sec)
Normalized Thermal Transient Impedence, Junction Ambient
Normalized Effective Transient Thermal Impedance
Duty Cycle=0.5
D=0.2 D=0.1
D=0.05 D=0.02 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=100°C/W 3.TJM-TA=PDMZthJA D=0.01 SINGLE PULSE
0.01 1E-4
1E-3
0.01
Square Wave Pulse Duration (sec)
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Packaging Information
SOT-23
illim
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material 90/10 63/37 SnPb) Meets Specification RSI86-91, ANSI/J-STD-002 Category
Reflow Condition
(IR/Convection Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
temperature
Peak temperature
183°C Pre-heat temperature
Time
Classification Reflow Profiles
Convection Convection Average ramp-up rate(183°C Peak) 3°C/second max. seconds Preheat temperature 25°C) seconds Temperature maintained above 183°C Time within actual peak temperature seconds Peak temperature range +5/-0°C +5/-0°C Ramp-down rate /second max. minutes max. Time 25°C peak temperature /second max. seconds 215-219°C +5/-0°C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm bgas Convection +5/-0 215-219 IR/Convection +5/-0 pkg. thickness 2.5mm pkg. volume pkg. thickness 2.5mm pkg. volume Convection +5/-0 +5/-0 IR/Convection +5/-0
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Copyright ANPEC Electronics Corp. Rev. Jun., 2003
APM2314
Reliability test program
Test item SOLDERABILITY HOLT Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245°C,5 1000 Bias 125°C Hrs, 100% 121°C -65°C 150°C, Cycles
Carrier Tape
Application
178±1
+0.1
1.5±
13.0 0.15 +0.1
8.0+ 3.2±
1.4±
1.75± 0.2±0.03
SOT-23
0.05
3.15
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw
APM2314
Cover Tape Dimensions
Application SOT- Carrier Width Cover Tape Width Devices Reel 3000
Customer Service
Anpec Electronics Corp. Head Office Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. 886-3-5642000 886-3-5642050 Taipei Branch 137, Lane 235, Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, 886-2-89191368 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. Jun., 2003
www.anpec.com.tw

20V/2.8A RDS(ON)=45m(typ.) VGS=4.5V RDS(ON)=55m(typ.) VGS=2.5V Super H

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