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MC74HC174A identical pinout LS174. device inputs compatible with stand


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MC74HC174A Flip-Flop with Common Clock Reset
MC74HC174A identical pinout LS174. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. This device consists flip-flops with common Clock Reset inputs. Each flip-flop loaded with low-to-high transition Clock input. Reset asynchronous active-low.
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PDIP-16 SUFFIX CASE SOIC-16 SUFFIX CASE 751B TSSOP-16 SUFFIX CASE 948F SOEIAJ-16 SUFFIX CASE 74HC174A ALYWG 174A ALYWG HC174AG AWLYWW MC74HC174AN AWLYYWWG
Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs 40.5 Equivalent Gates Pb-Free Packages Available*
Assembly Location Wafer Year Work Week Pb-Free Package Pb-Free Package (Note: Microdot either location)
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2005
June, 2005 Rev.
Publication Order Number: MC74HC174A/D
MC74HC174A
RESET CLOCK RESET DATA INPUTS CLOCK NONINVERTING OUTPUTS
Figure Assignment
Figure Logic Diagram
FUNCTION TABLE
Inputs Reset Clock Output Change Change
DESIGN/VALUE TABLE
Design Criteria Internal Gate Count* Internal Gate Propagation Delay Internal Gate Power Dissipation Speed Power Product *Equivalent two-input NAND gate. Value 40.5 0.0075 Units
ORDERING INFORMATION
Device MC74HC174AN MC74HC174ANG MC74HC174AD MC74HC174ADG MC74HC174ADR2 MC74HC174ADR2G MC74HC174ADTR2 MC74HC174ADTR2G MC74HC174AFEL MC74HC174AFELG Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* SOEIAJ-16 SOEIAJ-16 (Pb-Free) Shipping Units Rail Units Rail Units Rail Units Rail 2500 Units Reel 2500 Units Reel 2500 Units Reel 2500 Units Reel 2000 Units Reel 2000 Units Reel
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D. *This package inherently Pb-Free.
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MC74HC174A
MAXIMUM RATINGS
Symbol VOUT IOUT TSTG Supply Voltage Input Voltage Output Voltage Input Current, Output Current, Supply Current, Pins Storage Temperature Range Lead Temperature, from Case Seconds Junction Temperature Under Bias Thermal Resistance PDIP SOIC TSSOP PDIP SOIC TSSOP PDIP, SOIC, TSSOP Parameter (Referenced GND) (Referenced GND) (Referenced GND) (Note Value *0.5 )7.0 *1.5 )1.5 *0.5 )0.5 )150 )150 Level Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note 0.125 u2000 u100 u500 $300 Unit _C/W
Power Dissipation Still 85_C
VESD
Moisture Sensitivity Flammability Rating Withstand Voltage
ILATCHUP
Latchup Performance
Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78. high frequency heavy load considerations, Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol Supply Voltage Parameter (Referenced GND) Unit
VIN, VOUT Input Voltage, Output Voltage (Referenced GND) (Note Operating Temperature, Package Types Input Rise Fall Time (Figure )125 1000 Unused inputs left open. inputs must tied high- low-logic input voltage level.
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MC74HC174A
ELECTRICAL CHARACTERISTICS (Voltages Referenced GND)
Symbol Parameter Minimum High-Level Input Voltage Test Conditions VOUT |IOUT| VOUT |IOUT| |IOUT| Guaranteed Limit *55_C 25_C 3.15 1.35 v85_C 3.15 1.35 v125_C 3.15 1.35 Unit
Maximum Low-Level Input Voltage Minimum High-Level Output Voltage |IOUT| |IOUT| |IOUT| 3.98 5.48 3.84 5.34 Maximum Low-Level Output Voltage |IOUT| |IOUT| 0.26 0.26 0.33 0.33 Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) $0.1 $1.0 $1.0 IOUT Information typical parametric values, along with high frequency heavy load considerations, found Semiconductor High-Speed CMOS Data Book (DL129/D).
ELECTRICAL CHARACTERISTICS Input
Symbol fmax Parameter Maximum Clock Frequency (50% Duty Cycle) (Figures Maximum Propagation Delay, Clock (Figures
Guaranteed Limit *55_C 25_C v85_C v125_C Unit
tPLH tPHL tPLH tPHL tTLH tTHL Maximum Propagation Delay, Reset (Figures Maximum Output Transition Time, Output (Figures Maximum Input Capacitance propagation delays with loads other than information typical parametric values, Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25_C, Power Dissipation Capacitance, Enabled Output (Note Used determine no-load dynamic power consumption: load considerations, Semiconductor High-Speed CMOS Data Book (DL129/D).
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TIMING REQUIREMENTS Input
Symbol trec Maximum Input Rise Fall Times Minimum Pulse Width, Reset Minimum Pulse Width, Clock Minimum Recovery Time, Reset Inactive Clock Minimum Hold Time, Clock Data Minimum Setup Time, Data Clock Parameter
CLOCK
RESET
Figure Expanded Logic Diagram
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MC74HC174A
Figure
*55_C 25_C 1000 Guaranteed Limit v85_C 1000 v125_C 1000 Unit
MC74HC174A
CLOCK 1/fmax tPLH tTLH
RESET
tPHL tPHL trec tTHL CLOCK
Figure Switching Waveform
Figure Switching Waveform
VALID DATA CLOCK DEVICE UNDER TEST
TEST POINT OUTPUT
*Includes probe capacitance
Figure Switching Waveform
Figure Test Circuit
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MC74HC174A
PACKAGE DIMENSIONS
PDIP-16 SUFFIX CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL.
SEATING PLANE
0.25 (0.010)
INCHES 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 0.050 0.008 0.015 0.110 0.130 0.295 0.305 0.020 0.040
MILLIMETERS 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 1.27 0.21 0.38 2.80 3.30 7.50 7.74 0.51 1.01
SOIC-16 SUFFIX CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
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MC74HC174A
PACKAGE DIMENSIONS
TSSOP-16 SUFFIX CASE 948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
IDENT.
0.15 (0.006)
0.25 (0.010)
DETAIL
0.10 (0.004) SEATING
PLANE
DETAIL
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SECTION
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
MC74HC174A
PACKAGE DIMENSIONS
SOEIAJ-16 SUFFIX CASE 966-01 ISSUE
DETAIL
VIEW
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.78 INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.031
0.13 (0.005)
0.10 (0.004)
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MC74HC174A
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: American Technical Support: 800-282-9855 Toll Free Literature Distribution Center Semiconductor USA/Canada P.O. 61312, Phoenix, Arizona 85082-1312 Phone: 480-829-7710 800-344-3860 Toll Free USA/Canada Japan: Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder additional information, please contact your local Sales Representative.
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MC74HC174A/D

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