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MC74AC4040 consists master-slave flip-flops. output each flip-flop fee


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MC74AC4040 12-Stage Binary Ripple Counter
MC74AC4040 consists master-slave flip-flops. output each flip-flop feeds next frequency each output half that preceding one. state counter advances negative-going edge Clock input. Reset asynchronous active-high. State changes outputs occur simultaneously because internal ripple delays. Therefore, decoded output signals subject decoding spikes have gated with Clock MC74AC4040 some designs.
DIP-16 SUFFIX CASE
Typ. Clock Outputs Source/Sink Operating Voltage Range: High Noise Immunity
These devices available Pb-free package(s). Specifications herein apply both standard Pb-free devices. Please website www.onsemi.com specific Pb-free orderable part numbers, contact your local Semiconductor sales office representative.
RESET
SO-16 SUFFIX CASE 751B
TSSOP-16 SUFFIX CASE 948F
EIAJ-16 SUFFIX CASE
Figure Pinout: 16-Lead Packages Conductors (Top View) FUNCTION TABLE
Clock Reset Output State Change Advance next state Outputs
ORDERING INFORMATION
Device MC74AC4040N MC74AC4040D MC74AC4040DR2 MC74AC4040DT Package PDIP-16 SOIC-16 SOIC-16 TSSOP-16 Shipping Units/Rail Units/Rail 2500 Tape Reel Units/Rail
MC74AC4040DTR2 TSSOP-16 2500 Tape Reel MC74AC4040M EIAJ-16 Units/Rail
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
Semiconductor Components Industries, LLC, 2006
March, 2006 Rev.
Publication Order Number: MC74AC4040/D
MC74AC4040
CLOCK RESET
Figure Logic Diagram
MAXIMUM RATINGS*
Symbol VOUT IOUT Parameter Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Output Voltage (Referenced GND) Input Current, Output Current, Current Output Power Dissipation Still Plastic{ SOIC Package{ Storage Temperature Lead Temperature, from Case seconds (Plastic SOIC Package) Value -0.5 +7.0 -0.5 +0.5 -0.5 +0.5 +150 Unit
Tstg
*Maximum Ratings those values beyond which damage device occur. Derating: Plastic DIP: 10mW/°C from 65°C 125°C SOIC Package: -7.0 mW/°C from 65°C 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol VIN/VOUT tr/tf Parameter Supply Voltage (Referenced GND) Input Voltage, Output Voltage (Ref. GND) Operating Temperature, Package Types Input Rise/Fall Time (Figure Unit ns/V
MC74AC4040
CHARACTERISTICS (unless otherwise specified)
Symbol Parameter Maximum Quiescent Supply Voltage Value Unit Worst Case 25°C
Maximum Quiescent Supply Current
CHARACTERISTICS
74AC Symbol Parameter +25°C Minimum High Level Input Voltage Maximum Level Input Voltage Minimum High Level Output Voltage Maximum Level Output Voltage IOLD IOHD Maximum Input Leakage Current Minimum Dynamic Output Current{ 2.99 4.49 5.49 0.002 0.001 0.001 74AC -40°C +85°C Unit Conditions
Guaranteed Limits 3.15 3.85 1.35 1.65 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 3.15 3.85 1.35 1.65 2.46 3.76 4.76 0.44 0.44 0.44 ±1.0 VOUT VOUT IOUT
*VIN IOUT
*VIN VCC, VOLD 1.65 VOHD 3.85
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
MC74AC4040
CHARACTERISTICS (For Figures Waveforms Section Semiconductor FACT Data Book, DL138/D)
74AC Symbol Parameter VCC* fmax trec Maximum Clock Frequency Propagation Delay Propagation Delay Propagation Delay Recovery Time Minimum Pulse Width Clock Minimum Pulse Width Master Reset +25°C -2.5 -1.5 74AC -40°C +85°C Unit Fig.
*Voltage Range ±0.3 *Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
MARKING DIAGRAMS
DIP-16 MC74AC4040N AWLYYWW SO-16 AC4040 AWLYWW TSSOP-16 EIAJ-16 74AC4040 ALYW
4040 ALYW
Assembly Location Wafer Year Work Week
MC74AC4040
PACKAGE DIMENSIONS
PDIP-16 SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 0.050 0.008 0.015 0.110 0.130 0.295 0.305 0.020 0.040 MILLIMETERS 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 1.27 0.21 0.38 2.80 3.30 7.50 7.74 0.51 1.01
SEATING PLANE
0.25 (0.010)
SO-16 SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.229 0.244 0.010 0.019
0.25 (0.010)
SEATING PLANE
0.25 (0.010)
MC74AC4040
PACKAGE DIMENSIONS
TSSOP-16 SUFFIX PLASTIC TSSOP PACKAGE CASE948F-01 ISSUE
0.10 (0.004) 0.15 (0.006)
IDENT.
SECTION
0.15 (0.006)
0.25 (0.010)
DETAIL
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH. PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
0.10 (0.004) SEATING
PLANE
DETAIL
EIAJ-16 SUFFIX PLASTIC EIAJ PACKAGE CASE966-01 ISSUE
DETAIL
VIEW
0.13 (0.005)
0.10 (0.004)
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.78 INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.031
MC74AC4040
Notes
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center Semiconductor P.O. 61312, Phoenix, Arizona 85082-1312 Phone: 480-829-7710 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder additional information, please contact your local Sales Representative.
MC74AC4040/D

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