MC74ACT241 octal buffer line driver designed employed memory address d

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MC74ACT241 octal buffer line driver designed employed memory address d

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MC74ACT241 Octal Buffer/Line Driver with 3-State Outputs
MC74ACT241 octal buffer line driver designed employed memory address driver, clock driver oriented transmitter receiver which provides improved board density.
PDIP-20 SUFFIX CASE
3-State Outputs Drive Lines Buffer Memory Address
Registers
Outputs Source/Sink Compatible Inputs These devices available Pb-free package(s). Specifications herein
apply both standard Pb-free devices. Please website www.onsemi.com specific Pb-free orderable part numbers, contact your local Semiconductor sales office representative.
SO-20 SUFFIX CASE TSSOP-20 SUFFIX CASE 948E EIAJ-20 SUFFIX CASE
ORDERING INFORMATION
Device MC74ACT241N MC74ACT241DW Package PDIP-20 SOIC-20 Shipping Units/Rail Units/Rail
Figure Pinout: 20-Lead Packages Conductors (Top View) TRUTH TABLE
Inputs Outputs (Pins
MC74ACT241DWR2 MC74ACT241DT MC74ACT241DTR2 MC74ACT241M MC74ACT241MEL
SOIC-20 1000 Tape Reel TSSOP-20 Units/Rail
TSSOP-20 2500 Tape Reel EIAJ-20 EIAJ-20 Units/Rail 2000 Tape Reel
HIGH Voltage Level Voltage Level Immaterial High Impedance
DEVICE MARKING INFORMATION
general marking information device marking section page this data sheet.
TRUTH TABLE
Inputs Outputs (Pins
HIGH Voltage Level Voltage Level Immaterial High Impedance
Semiconductor Components Industries, LLC, 2006
March, 2006 Rev.
Publication Order Number: MC74ACT241/D
MC74ACT241
MAXIMUM RATINGS (Note
Symbol IGND TSTG Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink/Source Current Supply Current Output Ground Current Output Storage Temperature Range Lead temperature, from Case Seconds Junction temperature under Bias Thermal resistance PDIP SOIC TSSOP PDIP SOIC TSSOP (Note Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 $100 )150 )150 Level Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 85_C (Note UL-94-VO (0.125 2000 1000 $100 Unit _C/W
Power Dissipation Still 85_C
VESD
Moisture Sensitivity Flammability Rating Withstand Voltage
ILatch-Up
Latch-Up Performance
Absolute maximum continuous ratings those values beyond which damage device occur. Extended exposure these conditions conditions beyond those indicated adversely affect device reliability. Functional operation under absolute maximum-rated conditions implied. absolute maximum rating must observed. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Vin, Vout Parameter Input Voltage (Referenced GND) Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Note Junction Temperature (PDIP) Output Current High Output Current Unit ns/V
Unused Inputs left open. inputs must tied high voltage level logic voltage level. from refer individual Data Sheets devices that differ from typical input rise fall times.
MC74ACT241
CHARACTERISTICS
+255C Symbol Parameter Minimum High Level Input Voltage Maximum Level Output Voltage DICCT Maximum Input Leakage Current Additional Maximum ICC/Input Maximum 3-State Current ±0.5 0.001 0.001 4.49 5.49 3.86 4.86 0.36 0.36 ±0.1 -405C +855C Unit Conditions VOUT VOUT IOUT *VIN IOUT *VIN VCC, (OE) VIL, VCC, VCC, VOLD 1.65 VOHD 3.85
Guaranteed Limits 3.76 4.76 0.44 0.44 ±1.0 ±5.0
Maximum Level Input Voltage
Minimum High Level Output Voltage
IOLD IOHD
Minimum Dynamic Output Current Maximum Quiescent Supply Current
*All outputs loaded; thresholds input associated with output under test. Maximum test duration output loaded time.
CHARACTERISTICS (For Figures Waveforms, Figures
+255C Symbol tPLH tPHL tPZH tPZL tPHZ tPLZ Parameter Propagation Delay Data Output Propagation Delay Data Output Output Enable Time Output Enable Time Output Disable Time Output Disable Time VCC* 10.0 10.5 10.5 -405C +855C 10.0 10.0 10.0 11.0 11.5 11.5 Unit
*Voltage Range ±0.5
CAPACITANCE
Symbol Input Capacitance Power Dissipation Capacitance Parameter Value Unit Test Conditions
MC74ACT241
SWITCHING WAVEFORMS
INPUT DATA 1/fmax tPLH OUTPUT OUTPUT tPHL OUTPUT (12, tPZL tPLZ tPZH tPHZ HIGH IMPEDANCE HIGH IMPEDANCE
Figure
Figure
INPUT
OUTPUT DEVICE UNDER TEST
SCOPE TEST POINT
*Includes probe capacitance
Figure Test Circuit
MC74ACT241
MARKING DIAGRAMS
PDIP-20 SO-20 TSSOP-20 EIAJ-20
MC74ACT241N AWLYYWW
ACT241 AWLYYWW
ALYW
74ACT241 AWLYWW
Assembly Location Wafer Year Work Week
PACKAGE DIMENSIONS
PDIP-20 SUFFIX PLASTIC PACKAGE CASE 738-03 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION CENTER LEAD WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. INCHES 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 0.050 0.070 0.100 0.008 0.015 0.110 0.140 0.300 0.020 0.040 MILLIMETERS 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 1.27 1.77 2.54 0.21 0.38 2.80 3.55 7.62 0.51 1.01
SEATING PLANE
0.25 (0.010)
0.25 (0.010)
MC74ACT241
PACKAGE DIMENSIONS
SO-20 SUFFIX PLASTIC SOIC PACKAGE CASE 751D-05 ISSUE
NOTES: DIMENSIONS MILLIMETERS. INTERPRET DIMENSIONS TOLERANCES ASME Y14.5M, 1994. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL 0.13 TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. MILLIMETERS 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 10.05 10.55 0.25 0.75 0.50 0.90
0.25
0.25
SEATING PLANE
TSSOP-20 SUFFIX PLASTIC TSSOP PACKAGE CASE 948E-02 ISSUE
0.15 (0.006)
0.10 (0.004)
IDENT
SECTION 0.25 (0.010)
0.15 (0.006)
0.100 (0.004) SEATING
PLANE
DETAIL
DETAIL
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 6.40 6.60 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.252 0.260 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252
MC74ACT241
PACKAGE DIMENSIONS
EIAJ-20 SUFFIX PLASTIC EIAJ PACKAGE CASE 967-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD FLASH PROTRUSIONS MEASURED PARTING LINE. MOLD FLASH PROTRUSIONS SHALL EXCEED 0.15 (0.006) SIDE. TERMINAL NUMBERS SHOWN REFERENCE ONLY. LEAD WIDTH DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS LEAD WIDTH DIMENSION MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT LOCATED LOWER RADIUS FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS ADJACENT LEAD 0.46 0.018). MILLIMETERS 2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 7.40 8.20 0.50 0.85 1.10 1.50 0.70 0.90 0.81 INCHES 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 0.291 0.323 0.020 0.033 0.043 0.059 0.028 0.035 0.032
DETAIL
VIEW
0.13 (0.005)
0.10 (0.004)
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MC74ACT241/D

MC74ACT241 octal buffer line driver designed employed memory address d

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