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MDC3105 Integrated Relay, Inductive Load Driver
This device intended replace array three discrete components with integrated part. available SOT-23 package. used switch inductive loads such relays, solenoids, incandescent lamps, small motors without need free-wheeling diode.
Provides Robust Driver Interface between Relay Coil
Sensitive Logic Circuits Optimized Switch Relays from Rail Capable Driving Relay Coils Rated Features Input Drive Current Good Back-to-Front Transient Isolation Internal Zener Eliminates Need Free-Wheeling Diode Internal Zener Clamp Routes Induced Current Ground Quieter System Operation Guaranteed State with Input Connection Supports Large Systems with Minimal Off-State Leakage Resistant Accordance with Class Human Body Model Voltage Reduces System Current Drain Allowing Higher Resistance Relay Coils Pb-Free Packages Available
Relay, Inductive Load Driver Silicon SMALLBLOCKt Integrated Circuit
MARKING DIAGRAMS
SOT-23 CASE STYLE
SC-74 CASE 318F STYLE
Applications
Telecom: Line Cards, Modems, Answering Machines, Computer Office: Photocopiers, Printers, Desktop Computers Consumer: VCRs, Stereo Receivers, Players, Cassette Industrial: Small Appliances, White Goods, Security Systems, Automotive: Driven Relays, Motor Controls, Power Latches,
Lamp Drivers Automated Test Equipment, Garage Door Openers Recorders, Boxes Machines, Feature Phone Electronic Hook Switch
Specific Device Code Date Code* Pb-Free Package (Note: Microdot either location) *Date Code orientation and/or overbar vary depending upon manufacturing location.
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
INTERNAL CIRCUIT DIAGRAMS
Vout Vout Vout
CASE
CASE 318F
Semiconductor Components Industries, LLC, 2005
December, 2005 Rev.
Publication Order Number: MDC3105/D
MDC3105
MAXIMUM RATINGS 25°C unless otherwise noted)
Rating Power Supply Voltage Input Voltage Reverse Input Voltage Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%) Output Sink Current Continuous Junction Temperature Operating Ambient Temperature Range Storage Temperature Range SOT-23 Symbol Vin(fwd) Vin(rev) Ezpk Tstg Value -0.5 +150 Unit
Maximum ratings those values beyond which device damage occur. Maximum ratings applied device individual stress limit values (not normal operating conditions) valid simultaneously. these limits exceeded, device functional operation implied, damage occur reliability affected.
THERMAL CHARACTERISTICS
Rating Total Device Power Dissipation (Note Derate above 25°C Total Device Power Dissipation (Note Derate above 25°C Thermal Resistance Junction-to-Ambient FR-5 0.75 0.062, 25°C SOT-23 SC-74 SOT-23 SC-74 Symbol RqJA Value Unit mW/°C mW/°C °C/W
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted)
Characteristic CHARACTERISTICS Output Zener Breakdown Voltage Pulse) Output Leakage Current Input Voltage Vdc, O.C., 25°C) Vdc, O.C., 85°C) Guaranteed "OFF" State Input Voltage CHARACTERISTICS Input Bias Current (HFE Limited) 0.25 Vdc) Output Saturation Voltage Output Sink Current Continuous (VCE 0.25 Vdc, VO(sat) IO(on) 0.12 0.16 mAdc V(BRout) V(-BRout) Vin(off) -0.7 Symbol Unit
ORDERING INFORMATION
Device MDC3105LT1 MDC3105LT1G MDC3105DMT1 MDC3105DMT1G Package SOT-23 SOT-23 (Pb-Free) 3000 Tape Reel SC-74 SC-74 (Pb-Free) Shipping
information tape reel specifications, including part orientation tape sizes, please refer Tape Reel Packaging Specifications Brochure, BRD8011/D.
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MDC3105
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE
SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High Propagation Delay; Figure (5.0 74HC04) High Propagation Delay; Figure (5.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (5.0 74LS04) High Propagation Delay; Figures (5.0 74LS04) Transition Times: Fall Time; Figure (5.0 74HC04) Rise Time; Figure (5.0 74HC04) Fall Time; Figures (3.0 74HC04) Rise Time; Figures (3.0 74HC04) Fall Time; Figures (5.0 74LS04) Rise Time; Figures (5.0 74LS04) Symbol tPHL tPLH tPHL tPLH tPHL tPLH Units
tPLH tPHL
Vout
Figure Switching Waveforms
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MDC3105
TYPICAL PERFORMANCE CHARACTERISTICS
CHARACTERISTICS)
TRANSISTOR CURRENT GAIN 1000 OUTPUT SINK CURRENT (mA) 0.25 -40°C 25°C 85°C INPUT VOLTAGE (VOLTS) MC54LS04 +BAL99LT1 MC68HC05C8 MC14049B 25°C 0.25 MC74HC04 MC68HC05C8 MDC3105LT1 MC74HC04
INPUT CURRENT (mA)
Figure Transistor Current Gain
Figure Input Requirement Compared Possible Source Logic Outputs
Iout OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA) 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 INPUT CURRENT (mA) 25°C 85°C
OUTPUT VOLTAGE (Vdc)
Figure Threshold Effects
Figure Transistor Output Characteristic
0.04
ZENER CLAMP VOLTAGE (VOLTS) 25°C -40°C
Vout OUTPUT VOLTAGE (Vdc)
85°C 25°C
Iout Iin, INPUT CURRENT (mA)
1000
ZENER CURRENT (mA)
Figure Output Saturation Voltage versus Iout/Iin
Figure Zener Clamp Voltage versus Zener Current
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MDC3105
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
10,000 1000 OUTPUT LEAKAGE CURRENT (nA) 0.35 OUTPUT LEAKAGE CURRENT (nA) 25°C
0.35
JUNCTION TEMPERATURE (°C)
VCC, SUPPLY VOLTAGE (Vdc)
Figure Output Leakage Current versus Temperature
Figure Output Leakage Current versus Supply Voltage
RCE(sat)
Iout(max)
25°C TRANSISTOR THERMAL LIMIT FROM ZENER PULSED ENERGY LIMIT (REFER FIGURE
°CONTINUOUS DUTY
*232
*375
VCC(max) +6.0 0.01 Vout (VOLTS)
TYPICAL
Figure Safe Operating Area MDC3105LT1
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MDC3105
25°C Emax Emax (Vzpk Izpk)
TIME CONSTANT (ms)
0.001 0.01 Izpk (AMPS)
Figure Zener Repetitive Pulse Energy Limit Time Constant MDC3105LT1
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.05 0.02 0.01 Pd(pk)
0.01 SINGLE PULSE 0.001 0.01 PULSE WIDTH (ms) 1000
PERIOD
DUTY CYCLE t1/t2
10,000
100,000
1,000,000
Figure Transient Thermal Response MDC3105LT1
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MDC3105
Using Designing Pulsed Operation
repetitive pulse operating condition, time averaging allows increase device's peak power dissipation rating above average rating dividing duty cycle repetitive pulse train. Thus, continuous rating dissipation increased peak duty cycle pulse train. However, this only holds true pulse widths which short compared thermal time constant semiconductor device which they applied. pulse widths which significant compared thermal time constant device, peak operating condition begins look more like continuous duty operating condition over time duration pulse. these cases, peak power dissipation rating cannot merely time averaged dividing continuous power rating duty cycle pulse train. Instead, average power rating only scaled reduced amount accordance with device's transient thermal response, that device's junction temperature exceeded. Figure MDC3105 data sheet plots transient thermal resistance, r(t) function pulse width various pulse train duty cycles well single pulse illustrates this effect. short pulse widths near left side chart, r(t), factor, which continuous duty thermal resistance multiplied determine much peak power rating increased above average power rating, approaches duty cycle pulse train, which expected value. However, pulse width increased, that factor eventually approaches duty cycles indicating that pulse width sufficiently long appear continuous duty condition this device. MDC3105LT1, this pulse width about seconds. this larger pulse widths, peak power dissipation capability same continuous duty power capability. Figure determine peak power rating specific application, enter chart with worst case pulse condition, that pulse width duty cycle determine worst case r(t) your application. Then calculate peak power dissipation allowed using equation,
Pd(pk) (TJmax TAmax) (RqJA r(t)) Pd(pk) (150°C TAmax) (556°C/W r(t))
Also note that these calculations assume rectangular pulse shape which rise fall times insignificant compared pulse width. this case specific application, then waveforms should multiplied together resulting power waveform integrated find total dissipation across device. This then would number that less than equal Pd(pk) calculated above. circuit simulator having waveform calculator prove very useful this purpose.
Notes Time Constant Limitations
Figure Safe Operating Area (SOA) MDC3105. Device instantaneous operation should never pushed beyond these limits. shows Transistor "ON" condition well Zener during turn-off transient. current limited Izpk capability Zener well transistor addition input current through resistor. should exceeded temperature. power dissipation limits shown various pulse widths duty cycles ambient temperature 25°C. voltage limit that applied device. When input device switched off, "ON" current instantaneously dumped into Zener diode where begins exponential decay. Zener clamp voltage function that current level seen bowing versus curve higher currents. addition Zener's current limit impacting this device's rating, clamping diode also peak energy limit well. This energy limit measured using rectangular pulse then translated exponential equivalent using relationship between time constant exponential pulse pulse width rectangular pulse having equal energy content. These time constant limits appear along versus curve various values which lines intersect limit. time constant given load should exceed these limits their respective currents. Precise limits Zener energy intermediate current levels obtained from Figure
Thus duty cycle Figure yields r(t) when entered above equation, allowable Pd(pk) 85°C.
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MDC3105
Designing with this Data Sheet
Determine maximum inductive load current VCC, coil resistance usually minimum temperature) that MDC3105 will have drive make sure less than rated current. pulsed operation, Transient Thermal Response Figure instructions with determine maximum limit transistor power dissipation desired duty cycle temperature range. Figures with notes above insure that instantaneous operation does push device beyond limits plot. While keeping VO(sat) requirements mind, determine input current needed achieve that output current from Figures levels input current below input threshold curves Figure verify that
there will adequate input current available turn MDC3105 temperatures. levels input current above enter Figure using that input current determine input voltage required drive MDC3105 from solid versus line. Select suitable drive source family from those whose dotted lines cross solid input characteristic line right Iin, point. Using output current calculated step check Figure insure that range Zener clamp voltage over temperature will satisfy system requirements. Using Figures insure that "OFF" state leakage over temperature voltage extremes does violate system requirements. Review circuit operation insure none device ratings being exceeded.
APPLICATIONS DIAGRAMS
+3.0 +3.75 +4.5 +5.5
AROMAT TX2-L2-5
Vout MDC3105DMT1
Vout
74HC04 EQUIVALENT
74HC04 EQUIVALENT
Figure Dual Coil Latching Relay Application with V-HCMOS Level Translating Interface
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MDC3105
Continuous Current Calculation TX2-5V Relay, Nominal 25°C Assuming ±10% Make Tolerance, 25°C Annealed Copper Wire 0.4%/°C [1+(0.004) (-40°-25°)] -40°C (5.5 0.25V) /118 +4.5 +5.5 AROMAT TX2-5V Vout MDC3105LT1 74LS04 BAL99LT1 74HC04 EQUIVALENT +4.5 +5.5 AROMAT JS1E-5V Vout MDC3105LT1 AROMAT JS1E-5V AROMAT JS1E-5V AROMAT JS1E-5V
Figure Relay with Interface
Figure Quad Coil Relay Bank
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MDC3105
TYPICAL OPERATING WAVEFORMS
(VOLTS) (mA) TIME (ms)
TIME (ms)
Figure Square Wave Input
Figure Square Wave Response
Vout (VOLTS) (mA) TIME (ms)
TIME (ms)
Figure Square Wave Response
Figure Square Wave Response
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MDC3105
PACKAGE DIMENSIONS
SOT-23 (TO-236) CASE 318-08 ISSUE
VIEW
0.25
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. 318-01 THRU OBSOLETE, STANDARD 318-08. MILLIMETERS 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 INCHES 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094
VIEW
0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10
0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083
0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104
STYLE BASE EMITTER COLLECTOR
SOLDERING FOOTPRINT*
0.95 0.037 0.95 0.037
0.079 0.035
SCALE 10:1
0.031
inches
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
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MDC3105
PACKAGE DIMENSIONS
SC-74 CASE 318F-05 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. 318F-01, -02, OBSOLETE. STANDARD 318F-04. 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 MILLIMETERS 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 INCHES 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118
0.05 (0.002)
STYLE EMITTER BASE COLLECTOR EMITTER BASE COLLECTOR
SOLDERING FOOTPRINT*
0.094
0.074 0.028
0.95 0.037 0.95 0.037
0.039
SCALE 10:1
inches
*For additional information Pb-Free strategy soldering details, please download Semiconductor Soldering Mounting Techniques Reference Manual, SOLDERRM/D.
SMALLBLOCK trademark Semiconductor Components Industries, (SCILLC).
Semiconductor registered trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer. This literature subject applicable copyright laws resale manner.
PUBLICATION ORDERING INFORMATION
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MDC3105/D
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