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MDC3105 Integrated Relay, Inductive Load Driver

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MDC3105 Integrated Relay, Inductive Load Driver
This device is intended to replace an array of three to six discrete components with an integrated SMT part. It is available in a SOT-23 package. It can be used to switch 3 to 6 Vdc inductive loads such as relays, solenoids, incandescent lamps, and small DC motors without the need of a free-wheeling diode.
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· Provides a Robust Driver Interface between DC Relay Coil and · · · · · · · · · ·
Sensitive Logic Circuits Optimized to Switch Relays from a 3.0 V to 5.0 V Rail Capable of Driving Relay Coils Rated up to 2.5 W at 5.0 V Features Low Input Drive Current and Good Back-to-Front Transient Isolation Internal Zener Eliminates Need for Free-Wheeling Diode Internal Zener Clamp Routes Induced Current to Ground for Quieter System Operation Guaranteed Off State with No Input Connection Supports Large Systems with Minimal Off-State Leakage ESD Resistant in Accordance with the Class 1C Human Body Model Low Sat Voltage Reduces System Current Drain by Allowing Use of Higher Resistance Relay Coils Pb-Free Packages are Available
Relay, Inductive Load Driver Silicon SMALLBLOCKt Integrated Circuit
MARKING DIAGRAMS
SOT-23 CASE 318 STYLE 6 1
SC-74 CASE 318F STYLE 8 1 1
Applications
· Telecom: Line Cards, Modems, Answering Machines, FAX · Computer and Office: Photocopiers, Printers, Desktop Computers · Consumer: TVs and VCRs, Stereo Receivers, CD Players, Cassette · Industrial: Small Appliances, White Goods, Security Systems, · Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches,
Lamp Drivers Automated Test Equipment, Garage Door Openers Recorders, TV Set Top Boxes Machines, Feature Phone Electronic Hook Switch
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
INTERNAL CIRCUIT DIAGRAMS
Vout (3) Vout (6) Vout (3)
Vin (1)
1.0 k 6.6 V 33 k GND (2)
Vin (5)
1.0 k 6.6 V 6.6 V 33 k GND (1) GND (4)
Vin (2)
CASE 318
CASE 318F
December, 2005 - Rev. 5
Publication Order Number: MDC3105 / D
MDC3105
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
ORDERING INFORMATION
Device MDC3105LT1 MDC3105LT1G MDC3105DMT1 MDC3105DMT1G Package SOT-23 SOT-23 (Pb-Free) 3000 / Tape & Reel SC-74 SC-74 (Pb-Free) Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011 / D.
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MDC3105
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE
SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High to Low Propagation Delay Figure 1 (5.0 V 74HC04) Low to High Propagation Delay Figure 1 (5.0 V 74HC04) High to Low Propagation Delay Figures 1, 13 (3.0 V 74HC04) Low to High Propagation Delay Figures 1, 13 (3.0 V 74HC04) High to Low Propagation Delay Figures 1, 14 (5.0 V 74LS04) Low to High Propagation Delay Figures 1, 14 (5.0 V 74LS04) Transition Times: Fall Time Figure 1 (5.0 V 74HC04) Rise Time Figure 1 (5.0 V 74HC04) Fall Time Figures 1, 13 (3.0 V 74HC04) Rise Time Figures 1, 13 (3.0 V 74HC04) Fall Time Figures 1, 14 (5.0 V 74LS04) Rise Time Figures 1, 14 (5.0 V 74LS04) Symbol tPHL tPLH tPHL tPLH tPHL tPLH tf tr tf tr tf tr Min - - - - - - - - - - - - Typ 55 430 85 315 55 2.4 45 160 70 195 45 2.4 Max - - - - - - - - - - - - mS mS nS Units nS
Figure 1. Switching Waveforms
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MDC3105
TYPICAL PERFORMANCE CHARACTERISTICS
(ON CHARACTERISTICS)
INPUT CURRENT (mA)
Figure 2. Transistor DC Current Gain
Figure 3. Input V-I Requirement Compared to Possible Source Logic Outputs
VO, OUTPUT VOLTAGE (Vdc)
Figure 4. Threshold Effects
Figure 5. Transistor Output V-I Characteristic
Vout , OUTPUT VOLTAGE (Vdc)
IZ, ZENER CURRENT (mA)
Figure 6. Output Saturation Voltage versus Iout / Iin
Figure 7. Zener Clamp Voltage versus Zener Current
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MDC3105
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
-15 5.0 45 25 TJ, JUNCTION TEMPERATURE (°C)
2.0 3.0 4.0 5.0 VCC, SUPPLY VOLTAGE (Vdc)
Figure 8. Output Leakage Current versus Temperature
Figure 9. Output Leakage Current versus Supply Voltage
RCE(sat)
232 ms
375 ms
TYPICAL IZ vs VZ 10
Figure 10. Safe Operating Area for MDC3105LT1
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MDC3105
MAX L / R TIME CONSTANT (ms)
10 0.001 0.01 Izpk (AMPS) 0.1 1.0
Figure 11. Zener Repetitive Pulse Energy Limit on L / R Time Constant for MDC3105LT1
1.0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.1 0.05 0.02 0.01 Pd(pk)
0.01 SINGLE PULSE 0.001 0.01 0.1 1.0 10 100 t1, PULSE WIDTH (ms) 1000
PERIOD
Figure 12. Transient Thermal Response for MDC3105LT1
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MDC3105
Using TTR Designing for Pulsed Operation
Also note that these calculations assume a rectangular pulse shape for which the rise and fall times are insignificant compared to the pulse width. If this is not the case in a specific application, then the VO and IO waveforms should be multiplied together and the resulting power waveform integrated to find the total dissipation across the device. This then would be the number that has to be less than or equal to the Pd(pk) calculated above. A circuit simulator having a waveform calculator may prove very useful for this purpose.
Notes on SOA and Time Constant Limitations
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MDC3105
Designing with this Data Sheet
Determine the maximum inductive load current (at max VCC, min coil resistance and usually minimum temperature) that the MDC3105 will have to drive and make sure it is less than the max rated current. For pulsed operation, use the Transient Thermal Response of Figure 12 and the instructions with it to determine the maximum limit on transistor power dissipation for the desired duty cycle and temperature range. Use Figures 10 and 11 with the SOA notes above to insure that instantaneous operation does not push the device beyond the limits of the SOA plot. While keeping any VO(sat) requirements in mind, determine the max input current needed to achieve that output current from Figures 2 and 6. For levels of input current below 100 mA, use the input threshold curves of Figure 4 to verify that
there will be adequate input current available to turn on the MDC3105 at all temperatures. For levels of input current above 100 mA, enter Figure 3 using that max input current and determine the input voltage required to drive the MDC3105 from the solid Vin versus Iin line. Select a suitable drive source family from those whose dotted lines cross the solid input characteristic line to the right of the Iin, Vin point. Using the max output current calculated in step 1, check Figure 7 to insure that the range of Zener clamp voltage over temperature will satisfy all system and EMI requirements. Using Figures 8 and 9, insure that "OFF" state leakage over temperature and voltage extremes does not violate any system requirements. Review circuit operation and insure none of the device max ratings are being exceeded.
APPLICATIONS DIAGRAMS
+3.0 VDD +3.75 Vdc +4.5 VCC +5.5 Vdc
+ + AROMAT TX2-L2-5 V
Vout (6) MDC3105DMT1 Vin (5)
Vout (3)
74HC04 OR EQUIVALENT
Vin (2)
74HC04 OR EQUIVALENT
GND (1)
GND (4)
Figure 13. A 200 mW, 5.0 V Dual Coil Latching Relay Application with 3.0 V-HCMOS Level Translating Interface
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MDC3105
Vin (1) GND (2)
Figure 14. A 140 mW, 5.0 V Relay with TTL Interface
Figure 15. A Quad 5.0 V, 360 mW Coil Relay Bank
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MDC3105
TYPICAL OPERATING WAVEFORMS
3.5 V in (VOLTS) IC (mA) 10 30 50 TIME (ms) 70 90
25 10 30 50 TIME (ms) 70 90
Figure 16. 20 Hz Square Wave Input
Figure 17. 20 Hz Square Wave Response
7 Vout (VOLTS) IZ (mA) 10 30 50 TIME (ms) 70 90
12 10 30 50 TIME (ms) 70 90
Figure 18. 20 Hz Square Wave Response
Figure 19. 20 Hz Square Wave Response
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MDC3105
PACKAGE DIMENSIONS
SOT-23 (TO-236) CASE 318-08 ISSUE AN
3 SEE VIEW C
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318-01 THRU -07 AND -09 OBSOLETE, NEW STANDARD 318-08. MILLIMETERS NOM MAX 1.00 1.11 0.06 0.10 0.44 0.50 0.13 0.18 2.90 3.04 1.30 1.40 1.90 2.04 0.20 0.30 0.54 0.69 2.40 2.64 INCHES NOM 0.040 0.002 0.018 0.005 0.114 0.051 0.075 0.008 0.021 0.094
MIN 0.89 0.01 0.37 0.09 2.80 1.20 1.78 0.10 0.35 2.10
MIN 0.035 0.001 0.015 0.003 0.110 0.047 0.070 0.004 0.014 0.083
MAX 0.044 0.004 0.020 0.007 0.120 0.055 0.081 0.012 0.029 0.104
STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR
SOLDERING FOOTPRINT
SCALE 10:1
mm inches
For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM / D.
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MDC3105
PACKAGE DIMENSIONS
SC-74 CASE 318F-05 ISSUE L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318F-01, -02, -03 OBSOLETE. NEW STANDARD 318F-04. DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0° MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.37 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10° - MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0° INCHES NOM 0.039 0.002 0.015 0.007 0.118 0.059 0.037 0.016 0.108 - MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10°
0.05 (0.002) A1
STYLE 8: PIN 1. EMITTER 1 2. BASE 2 3. COLLECTOR 2 4. EMITTER 2 5. BASE 1 6. COLLECTOR 1
SOLDERING FOOTPRINT
SCALE 10:1
mm inches
For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM / D.
SMALLBLOCK is a trademark of Semiconductor Components Industries, LLC (SCILLC).
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA / Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA / Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA / Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com / litorder For additional information, please contact your local Sales Representative.
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MDC3105 / D