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LC2MOS SPST Switches ADG451/ADG452/ADG453
resistance resistance flatness (0.2 supply maximum ratings analog signal range Fully specified Ultralow power dissipation Continuous current (100 Fast switching times tOFF TTL/CMOS-compatible Pin-compatible upgrade ADG411/ADG412/ADG413 ADG431/ADG432/ADG433
FUNCTIONAL BLOCK DIAGRAMS
ADG451
ADG452
ADG453
APPLICATIONS
Relay replacement Audio video switching Automatic test equipment Precision data acquisition Battery-powered systems Sample-and-hold systems Communication systems PBX, PABX systems Avionics
05239-001
SWITCHES SHOWN LOGIC INPUT
Figure
GENERAL DESCRIPTION
ADG451/ADG452/ADG453 monolithic CMOS devices comprising four independently selectable switches. They designed enhanced LC2MOS process that provides power dissipation gives high switching speed resistance. resistance profile very flat over full analog input range, ensuring excellent linearity distortion when switching audio signals. Fast switching speed, coupled with high signal bandwidth, makes parts suitable video signal switching. CMOS construction ensures ultralow power dissipation, making parts ideally suited portable battery-powered instruments. ADG451/ADG452/ADG453 contain four independent single-pole/single-throw (SPST) switches. ADG451
Rev.
Information furnished Analog Devices believed accurate reliable. However, responsibility assumed Analog Devices use, infringements patents other rights third parties that result from use. Specifications subject change without notice. license granted implication otherwise under patent patent rights Analog Devices. Trademarks registered trademarks property their respective owners.
ADG452 differ only that digital control logic inverted. ADG451 switches turned with logic appropriate control input, while logic high required ADG452. ADG453 switches with digital control logic similar that ADG451, while logic inverted other switches. Each switch conducts equally well both directions when input signal range that extends supplies. condition, signal levels supplies blocked. ADG453 exhibits break-before-make switching action multiplexer applications. Inherent design charge injection minimum transients when switching digital inputs.
Technology Way, P.O. 9106, Norwood, 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 2004 Analog Devices, Inc. rights reserved.
ADG451/ADG452/ADG453 TABLE CONTENTS
Product Highlights Specifications. Dual Supply Absolute Maximum Ratings. Caution. Configuration Function Descriptions. Terminology Typical Performance Characteristics Applications. Test Circuits. Outline Dimensions Ordering Guide
REVISION HISTORY
12/04-Rev. Rev. Updated Format.Universal Changes Specifications Section. Changes Absolute Maximum Ratings Section Changes Configuration Function Descriptions Section Updated Outline Dimensions Changes Ordering Guide 2/98-Rev. Rev. 10/97-Revision Initial Version
Rev. Page
ADG451/ADG452/ADG453 PRODUCT HIGHLIGHTS
maximum) Ultralow Power Dissipation Extended Signal Range ADG451/ADG452/ADG453 fabricated enhanced LC2MOS process, giving increased signal range that fully extends supply rails. Break-Before-Make Switching This prevents channel shorting when switches configured multiplexer (ADG453 only.) Single-Supply Operation applications which analog signal unipolar, ADG451/ADG452/ADG453 operated from single rail power supply. parts fully specified with single power supply remain functional with single supplies Dual-Supply Operation applications where analog signal bipolar, ADG451/ADG452/ADG453 operated from dual power supply ranging from ±4.5
Rev. Page
ADG451/ADG452/ADG453 SPECIFICATIONS
DUAL SUPPLY
specifications TMIN TMAX, unless otherwise noted. Table
Parameter ANALOG SWITCH Analog Signal Range Resistance (RON) Resistance Match Between Channels (RON) Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS2 Source Leakage, (Off) Drain Leakage, (Off) Channel Leakage, (On) DIGITAL INPUTS Input High Voltage, VINH Input Voltage, VINL Input Current, IINL IINH DYNAMIC CHARACTERISTICS3 tOFF Break-Before-Make Time Delay, (ADG453 Only) Charge Injection Isolation Channel-to-Channel Crosstalk (Off) (Off) (On) POWER REQUIREMENTS Version1 25°C TMIN TMAX ±0.02 ±0.5 ±0.02 ±0.5 ±0.04 Unit Test Conditions/Comments
Figure Figure Figure
±2.5 ±2.5
0.005 ±0.5 0.0001
VINL VINH; others respectively
Figure Figure Figure
Figure MHz; Figure MHz; Figure +16.5 -16.5 digital inputs
Rev. Page
ADG451/ADG452/ADG453
Parameter IGND
Version1 25°C TMIN TMAX 0.0001 0.0001 0.0001
Unit
Test Conditions/Comments
Temperature range Version -40°C +85°C. TMAX 70°C. Guaranteed design, subject production test.
specifications TMIN TMAX, unless otherwise noted. Table
Parameter ANALOG SWITCH Analog Signal Range Resistance (RON) Resistance Match Between Channels (RON) Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS2, Source Leakage, (Off) Drain Leakage, (Off) Channel Leakage, (On) DIGITAL INPUTS Input High Voltage, VINH Input Voltage, VINL Input Current, IINL IINH DYNAMIC CHARACTERISTICS4 tOFF Break-Before-Make Time Delay, (ADG453 Only) Charge Injection Channel-to-Channel Crosstalk (Off) (Off) (On) 25°C Version1 TMIN TMAX ±0.02 ±0.5 ±0.02 ±0.5 ±0.04 Unit Test Conditions/Comments
Figure Figure Figure
±2.5 ±2.5
0.005 ±0.5
VINL VINH
Figure Figure Figure
Figure MHz; Figure
Rev. Page
ADG451/ADG452/ADG453
Parameter POWER REQUIREMENTS IGND4 25°C 0.0001 0.0001 0.0001 Version1 TMIN TMAX Unit Test Conditions/Comments 13.2 digital inputs
Temperature range Version -40°C +85°C. TMAX 70°C. Tested with dual supplies. Guaranteed design, subject production test.
specifications TMIN TMAX, unless otherwise noted. Table
Parameter ANALOG SWITCH Analog Signal Range Resistance (RON) Resistance Match Between Channels (RON) LEAKAGE CURRENTS2, Source Leakage, (Off) Drain Leakage, (Off) Channel Leakage, (On) DIGITAL INPUTS Input High Voltage, VINH Input Voltage, VINL Input Current, IINL IINH DYNAMIC CHARACTERISTICS4 tOFF Break-Before-Make Time Delay, (ADG453 Only) Charge Injection Isolation Channel-to-Channel Crosstalk (Off) (Off) (On) 25°C Version1 TMIN TMAX ±0.02 ±0.5 ±0.02 ±0.5 ±0.04 Unit ±4.5, ±4.5; Figure Figure Figure Test Conditions/Comments
-3.5 +3.5
±2.5 ±2.5
0.005 ±0.5
VINL VINH
Figure Figure Figure
Figure MHz; Figure MHz; Figure
Rev. Page
ADG451/ADG452/ADG453
Parameter POWER REQUIREMENTS IGND4 25°C 0.0001 0.0001 0.0001 0.0001 Version1 TMIN TMAX Unit Test Conditions/Comments digital inputs
Temperature range Version -40°C +85°C. TMAX 70°C. Tested with dual supplies. Guaranteed design, subject production test.
Rev. Page
ADG451/ADG452/ADG453 ABSOLUTE MAXIMUM RATINGS
25°C, unless otherwise noted. Table
Parameters Analog, Digital Inputs1 Ratings -0.3 +0.3 -0.3 whichever occurs first
Stresses above those listed under Absolute Maximum Ratings cause permanent damage device. This stress rating only; functional operation device these other conditions above those listed operational sections this specification implied. Exposure absolute maximum rating conditions extended periods affect device reliability. Only absolute maximum rating applied time. Table Truth Table (ADG451/ADG452)
ADG451 ADG452 Switch Condition
Continuous Current, Peak Current, (pulsed duty cycle max) Operating Temperature Range Industrial Version) Storage Temperature Range Junction Temperature Plastic Package, Power Dissipation Thermal Impedance Lead Temperature, Soldering SOIC Package, Power Dissipation Thermal Impedance TSSOP Package, Power Dissipation Thermal Impedance Thermal Impedance Lead Temperature, Soldering Vapor Phase Infrared
-40°C +85°C -65°C +150°C 150°C 117°C/W 260°C 77°C/W 115°C/W 35°C/W 215°C 220°C
Table Truth Table (ADG453)
Logic Switch Switch
Overvoltages clamped internal diodes. Current should limited maximum ratings given.
CAUTION
(electrostatic discharge) sensitive device. Electrostatic charges high 4000 readily accumulate human body test equipment discharge without detection. Although this product features proprietary protection circuitry, permanent damage occur devices subjected high energy electrostatic discharges. Therefore, proper precautions recommended avoid performance degradation loss functionality.
Rev. Page
ADG451/ADG452/ADG453 CONFIGURATION FUNCTION DESCRIPTIONS
Figure Configuration (DIP, SOIC, TSSOP)
Table Function Descriptions
Mnemonic Description Logic Control Input. Drain Terminal. input output. Source Terminal. input output. Most Negative Power Supply Potential Dual Supplies. single-supply applications, connected GND. Ground Reference. Source Terminal. input output. Drain Terminal. input output. Logic Control Input. Logic Control Input. Drain Terminal. input output. Source Terminal. input output. Logic Power Supply Most Positive Power Supply Potential. Source Terminal. input output. Drain Terminal. input output. Logic Control Input.
Rev. Page
05239-002
VIEW (Not Scale)
ADG451/ ADG452/ ADG453
ADG451/ADG452/ADG453 TERMINOLOGY
Ohmic resistance between resistance match between channels, that maximum minus minimum. RFLAT(ON) Flatness defined difference between maximum minimum value resistance, measured over specified analog signal range. (Off) Source leakage current with switch off. ID(Off) Drain leakage current with switch off. (On) Channel leakage current with switch (VS) Analog voltage terminals (Off) switch source capacitance. (Off) switch drain capacitance. (On) switch capacitance. Delay between applying digital control input output switching Figure tOFF Delay between applying digital control input output switching off. time time measured between points both switches, when switching from address state another. Figure Crosstalk measure unwanted signal coupled through from channel another result parasitic capacitance. Isolation measure unwanted signal coupling through switch. Charge Injection measure glitch impulse transferred from digital input analog output during switching.
Rev. Page
ADG451/ADG452/ADG453 TYPICAL PERFORMANCE CHARACTERISTICS
25°C
10.00
+15V -15V +15V -15V
LEAKAGE CURRENT (nA)
1.00
(ON)
+13.5V -13.5V
0.10
+15V -15V +16.5V -16.5V
(OFF)
(OFF)
05239-003
TEMPERATURE (°C)
DRAIN SOURCE VOLTAGE
Figure Resistance Function (VS) Various Dual Supplies
Figure Leakage Currents Function Temperature
+85°C +15V -15V
100k
+15V -15V
+25°C
ISUPPLY (µA)
-40°C
05239-004
0.10 0.01
DRAIN SOURCE VOLTAGE
100k FREQUENCY (Hz)
Figure Resistance Function (VS) Different Temperatures with Dual Supplies
16.5V
Figure Supply Current Input Switching Frequency
25°C
+85°C
+25°C -40°C
13.5V
05239-005
DRAIN SOURCE VOLTAGE
DRAIN SOURCE VOLTAGE
Figure Resistance Function (VS) Various Single Supplies
Figure Resistance Function (VS) Different Temperatures with Single Supplies
Rev. Page
05239-008
05239-007
05239-006
-7.5
-4.5
-1.5
10.5
13.5
-16.5
-13.5
-10.5
16.5
0.01
ADG451/ADG452/ADG453
+15V -15V +25°C
+15V -15V RLOAD
LEAKAGE CURRENT (nA)
-0.1 -0.2 -0.3 -0.4
(OFF) (OFF)
CROSSTALK (dB)
(ON)
05239-009
DRAIN SOURCE VOLTAGE
100k FREQUENCY (Hz)
100M
Figure Leakage Currents Function (VS)
Figure Crosstalk Frequency
ISOLATION (dB)
+15V -15V
-0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 FREQUENCY (MHz)
+15V -15V
FREQUENCY (MHz)
05239-010
LOSS (dB)
Figure Isolation Frequency
Figure Frequency Response with Switch
Rev. Page
05239-012
05239-011
-0.5
ADG451/ADG452/ADG453 APPLICATIONS
Figure illustrates precise, fast, sample-and-hold circuit. AD845 used input buffer, output operational amplifier AD711. During track mode, closed output, VOUT, follows input signal, VIN. hold mode, opened, signal held hold capacitor,
+15V
switch capacitor leakage, voltage hold capacitor decreases with time. ADG451/ADG452/ADG453 minimize this droop their leakage specifications. droop rate further minimized polystyrene hold capacitor. droop rate circuit shown typically µV/µs. second switch, SW2, which operates parallel with SW1, included this circuit reduce pedestal error. Because both switches same potential, they have differential effect amp, AD711, which minimizes charge injection effects. Pedestal error also reduced compensation network, This compensation network reduces hold time glitch while optimizing acquisition time. Using illustrated amps component values, pedestal error maximum value over input range. Both acquisition settling times
2200pF +15V 1000pF AD711 -15V 2200pF VOUT
+15V AD845 -15V
ADG451/ ADG452/ ADG453
05239-013
-15V
Figure Fast, Accurate Sample-and-Hold Circuit
Rev. Page
ADG451/ADG452/ADG453 TEST CIRCUITS
V1/IDS
05239-014
(OFF)
(OFF)
(ON)
05239-015
05239-016
Figure Resistance
Figure Leakage
Figure Leakage
0.1µF
+15V
0.1µF
ADG451
VOUT 35pF
ADG452
0.1µF -15V VOUT
05239-017
tOFF
Figure Switching Times
0.1µF
+15V
0.1µF
ADG453
IN1, 0.1µF -15V VOUT2 35pF VOUT1 35pF
VOUT1
VOUT2
Figure Break-Before-Make Time Delay
Rev. Page
05239-018
ADG451/ADG452/ADG453
+15V VOUT 10nF
VOUT VOUT
VOUT
-15V
Figure Charge Injection
0.1µF
+15V
0.1µF
VOUT
-15V
Figure Isolation
0.1µF
+15V
0.1µF
VIN1
VIN2
VOUT
0.1µF
05239-021
-15V CHANNEL-TO-CHANNEL CROSSTALK |VS/VOUT
Figure Channel-to-Channel Crosstalk
Rev. Page
05239-020
0.1µF
05239-019
ADG451/ADG452/ADG453 OUTLINE DIMENSIONS
5.10 5.00 4.90
10.00 (0.3937) 9.80 (0.3858)
4.00 (0.1575) 3.80 (0.1496)
6.20 (0.2441) 5.80 (0.2283)
4.50 4.40 4.30
6.40
1.27 (0.0500) 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10
1.75 (0.0689) 1.35 (0.0531)
0.50 (0.0197) 0.25 (0.0098)
1.20 0.20 0.09 0.65 0.30 0.19 COPLANARITY 0.10 SEATING PLANE 0.75 0.60 0.45
0.51 (0.0201) SEATING 0.25 (0.0098) 1.27 (0.0500) PLANE 0.31 (0.0122) 0.40 (0.0157) 0.17 (0.0067)
0.15 0.05
COMPLIANT JEDEC STANDARDS MS-012AC CONTROLLING DIMENSIONS MILLIMETERS; INCH DIMENSIONS PARENTHESES) ROUNDED-OFF MILLIMETER EQUIVALENTS REFERENCE ONLY APPROPRIATE DESIGN
COMPLIANT JEDEC STANDARDS MO-153AB
Figure 16-lead Small Outline Package [SOIC] Narrow Body (R-16) Dimensions shown millimeters (inches)
Figure 16-lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown inches (millimeters)
0.800 (20.32) 0.790 (20.07) 0.780 (19.81)
0.280 (7.11) 0.250 (6.35) 0.240 (6.10) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.060 (1.52) 0.015 (0.38) 0.195 (4.95) 0.130 (3.30) 0.115 (2.92)
0.100 (2.54) 0.210 (5.33) 0.150 (3.81) 0.130 (3.30) 0.115 (2.92) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) 0.070 (1.78) 0.060 (1.52) 0.045 (1.14)
0.015 (0.38) GAUGE PLANE SEATING PLANE 0.430 (10.92)
0.014 (0.36) 0.010 (0.25) 0.008 (0.20)
0.005 (0.13)
COMPLIANT JEDEC STANDARDS MS-001-AB CONTROLLING DIMENSIONS INCHES; MILLIMETER DIMENSIONS PARENTHESES) ROUNDED-OFF INCH EQUIVALENTS REFERENCE ONLY APPROPRIATE DESIGN. CORNER LEADS CONFIGURED WHOLE HALF LEADS.
Figure 16-Lead Plastic Dual In-Line Package [PDIP] Narrow Body (N-16) Dimensions shown inches (millimeters)
Rev. Page
ADG451/ADG452/ADG453
ORDERING GUIDE
Model ADG451BN ADG451BNZ1 ADG451BR ADG451BR-REEL ADG451BR-REEL7 ADG451BRZ1 ADG451BRUZ1 ADG451BRUZ- REEL1 ADG451BRUZ- REEL71 ADG451BCHIPS ADG452BN ADG452BR ADG452BR-REEL ADG452BR-REEL7 ADG452BRZ1 ADG452BRZ-REEL1 ADG452BRZ-REEL71 ADG452BRUZ1 ADG452BRUZ-REEL1 ADG452BRUZ-REEL71 ADG453BN ADG453BR ADG453BR-REEL ADG453BR-REEL7 ADG453BRZ1 ADG453BRUZ1 ADG453BRUZ-REEL1 ADG453BRUZ-REEL71 Temperature Range -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C -40°C +85°C Package Description 16-Lead Plastic 16-Lead Plastic 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead Plastic 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP 16-Lead Plastic 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-lead SOIC 16-Lead TSSOP 16-Lead TSSOP 16-Lead TSSOP Package Options N-16 N-16 R-16 R-16 R-16 R-16 RU-16 RU-16 RU-16 N-16 R-16 R-16 R-16 R-16 R-16 R-16 RU-16 RU-16 RU-16 N-16 R-16 R-16 R-16 R-16 RU-16 RU-16 RU-16
Pb-free part.
Rev. Page
ADG451/ADG452/ADG453 NOTES
Rev. Page
ADG451/ADG452/ADG453 NOTES
Rev. Page
ADG451/ADG452/ADG453 NOTES
2004 Analog Devices, Inc. rights reserved. Trademarks registered trademarks property their respective owners. C05239-0-12/04(B)
Rev. Page
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