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case outlines device types requirements appendix Change dimensions case outline Boileplate update. device types
00-06-08 00-07-26 00-09-01 01-08-14 02-03-08
Monica Poelking Thomas Hess Monica Poelking Thomas Hess Thomas Hess
SHEET SHEET SHEET SHEET SHEET STATUS SHEETS PMIC
SHEET
PREPARED Thomas Hess DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil
STANDARD MICROCIRCUIT DRAWING
THIS DRAWING AVAILABLE DEPARTMENTS AGENCIES DEPARTMENT DEFENSE
CHECKED Thomas Hess APPROVED Monica Poelking
MICROCIRCUIT, DIGITAL, CMOS, MG2, GATE ARRAY, MONOLITHIC SILICON
DRAWING APPROVAL DATE 00-04-04
REVISION LEVEL SIZE SHEET CAGE CODE
AMSC
67268
5962-00B02
DSCC FORM 2233 DISTRIBUTION STATEMENT Approved public release; distribution unlimited.
5962-E268-02
SCOPE Scope. This drawing documents product assurance class levels consisting high reliability (device classes space application (device class choice case outlines lead finishes available reflected Part Identifying Number (PIN). When available, choice Radiation Hardness Assurance (RHA) levels reflected PIN. PIN. shown following example: 5962 Federal stock class designator designator (see 1.2.1) Drawing number 1.2.1 designator. Device classes marked devices meet MIL-PRF-38535 specified levels marked with appropriate designator. Device class marked devices meet MIL-PRF-38535, appendix specified levels marked with appropriate designator. dash indicates non-RHA device. 1.2.2 Device type(s). device type(s) identify circuit function follows: Device type Generic number MG2044E MG2091E MG2140E MG2194E MG2265E MG2360E MG2480E MG2700E MG2044 MG2091 MG2140 MG2194 MG2265 MG2360 MG2480 MG2M044E MG2M091E MG2M140E MG2M194E MG2M265E MG2M360E MG2M480E MG2M044 MG2M091 MG2M140 MG2M194 MG2M265 MG2M360 MG2M480 Circuit function 44,000 MG2RT gates available 91,000 MG2RT gates available 140,000 MG2RT gates available 194,000 MG2RT gates available 265,000 MG2RT gates available 360,000 MG2RT gates available 480,000 MG2RT gates available 700,000 MG2RT gates available 44,000 gates available 91,000 gates available 140,000 gates available 194,000 gates available 265,000 gates available 360,000 gates available 480,000 gates available composite 44,000 MG2RT gates available composite 91,000 MG2RT gates available composite 140,000 MG2RT gates available composite 194,000 MG2RT gates available composite 265,000 MG2RT gates available composite 360,000 MG2RT gates available composite 480,000 MG2RT gates available composite 44,000 gates available composite 91,000 gates available composite 140,000 gates available composite 194,000 gates available composite 265,000 gates available composite 360,000 gates available composite 480,000 gates available 00B02 Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5)
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1.2.3 Device class designator. device class designator single letter identifying product assurance level follows: Device class Device requirements documentation Vendor self-certification requirements MIL-STD-883 compliant, non-JAN class level microcircuits accordance with MIL-PRF-38535, appendix Certification qualification MIL-PRF-38535
1.2.4 Case outline(s). case outline(s) designated MIL-STD-1835 follows: Outline letter Descriptive designator Figure Figure Figure Figure Figure Figure Figure CQCC2-F172 Figure Figure Figure Figure Terminals Package style Flatpack gull wing leads Flatpack gull wing leads Flatpack gull wing leads Flatpack unformed leads Quad flatpack with non-conductive Flatpack unformed leads Flatpack gull wing leads Flatpack unformed leads Flatpack unformed leads Flatpack unformed leads Flatpack unformed leads Flatpack unformed leads
1.2.5 Lead finish. lead finish specified MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class Absolute maximum ratings Supply voltage range (VDD). Input voltage range (VIN). Input current (IIN) Signal Power Output short circuit current VOUT VDD. VOUT Lead temperature (soldering, sec) Storage temperature. Maximum junction temperature (TJ) Recommended operating conditions. Supply voltage range. Ambient operating temperature (TA) -55°C 125°C Stresses above absolute maximum rating cause permanent damage device. Extended operation maximum levels degrade performance affect reliability. voltages referenced Ground unless otherwise specified. shall exceed maximum output current single output short condition maximum duration second. Duration distance less than This gate array device capable being configured with ±10% ±10%. -0.5 -0.5 300°C -65°C 150°C 175°C
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Digital logic testing device classes Fault coverage measurement manufacturing logic tests (MIL-STD-883, test method 5012) specified APPLICABLE DOCUMENTS Government specification, standards, handbooks. following specification, standards, handbooks form part this drawing extent specified herein. Unless otherwise specified, issues these documents those listed issue Department Defense Index Specifications Standards (DoDISS) supplement thereto, cited solicitation. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 MIL-STD-1835 HANDBOOKS DEPARTMENT DEFENSE MIL-HDBK-103 MIL-HDBK-780 List Standard Microcircuit Drawings (SMD's). Standard Microcircuit Drawings. Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies specification, standards, handbooks available from Standardization Document Order Desk, Robbins Avenue, Building Philadelphia, 19111-5094.) Order precedence. event conflict between text this drawing references cited herein, text this drawing takes precedence. Nothing this document, however, supersedes applicable laws regulations unless specific exemption been obtained. REQUIREMENTS Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. individual item requirements device class shall accordance with MIL-PRF-38535, appendix non-JAN class level devices specified herein. 3.1.1 Microcircuit die. requirements microcircuit die, appendix this document. Design, construction, physical dimensions. design, construction, physical dimensions shall specified MIL-PRF-38535 herein device classes MIL-PRF-38535, appendix herein device class
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requirements. AIDs written against this shall sent DSCC-VA. following items shall provided device manufacturer customer part AID. 3.3.1 Terminal connections assignments. 3.3.2 Package type (see 1.2.4). 3.3.3 Functional block diagram equivalent VHDL behavioral description). 3.3.4 Functional description terms symbols. 3.3.5 Logic diagram equivalent structural VHDL description mutually agreed list). 3.3.6 function description. 3.3.7 Design tape Design document name (i.e., list). 3.3.8 Design functional tape name. 3.3.9 Test functional tape name. 3.3.10 Timing diagram(s). 3.3.11 Fault coverage measurement manufacturing logic tests. 3.3.12 Burn-in circuit. 3.3.13 class voltage. 3.3.14 Device electrical performance characteristics (additions Table Device electrical performance characteristics shall include parametric, functional, parameters other data which would considered required design engineer. electrical performance characteristics apply over full recommended ambient operating temperature range specified test load conditions. 3.3.15 Maximum power dissipation. Maximum power dissipation shall accordance with application specific design. Electrical performance characteristics postirradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics postirradiation parameter limits specified table shall apply over full case operating temperature range. Electrical test requirements. electrical test requirements shall subgroups specified table electrical tests each subgroup defined table Marking. part shall marked with listed herein. addition, manufacturer's also marked listed MIL-HDBK-103. packages where marking entire number feasible space limitations, manufacturer option marking "5962-" device. product using this option, designator shall still marked. Marking device classes shall accordance with MIL-PRF-38535. Marking device class shall accordance with MIL-PRF-38535, appendix number shall added marking manufacturer. 3.6.1 Certification/compliance mark. certification mark device classes shall "QML" required MIL-PRF-38535. compliance mark device class shall required MIL-PRF-38535, appendix Certificate compliance. device classes certificate compliance shall required from QML-38535 listed manufacturer order supply requirements this drawing (see 6.6.1 herein). device class certificate compliance shall required from manufacturer order listed approved source supply MIL-HDBK-103 (see 6.6.2 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this drawing shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 herein device class requirements MIL-PRF-38535, appendix herein.
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Certificate conformance. certificate conformance required device classes MIL-PRF-38535 device class MIL-PRF-38535, appendix shall provided with each microcircuits delivered this drawing. Notification change device class device class notification DSCC-VA change product (see herein) involving devices acquired this drawing required change defined MIL-PRF-38535, appendix 3.10 Verification review device class device class DSCC, DSCC's agent, acquiring activity retain option review manufacturer's facility applicable required documentation. Offshore documentation shall made available onshore option reviewer. 3.11 Microcircuit group assignment device class Device class devices covered this drawing shall microcircuit group number (see MIL-PRF-38535, appendix
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TABLE Electrical performance characteristics. Conditions -55°C +125°C unless otherwise specified -300 GND, GND, GND, Outputs disabled VOUT Outputs disabled VOUT Outputs disabled VOUT Outputs disabled VOUT Functional verification
Test
Symbol
Group subgroups
Device type -1.2
Limits -0.2
Unit
Input Clamp Voltage
Level Input Current
IILPU ILLPD
IIHPU IIHPD IOZL
Level Input Current, Pull-up Level Input Current, Pull-down
High Level Input Current High Level Input Current, Pull-up High Level Input Current, Pull-down Output Leakage Current Output Leakage High Current Pull-down Output Output Leakage Current Pull-up Output Output Leakage High Current Level Input Voltage Level Output Voltage Level Output Voltage Level Output Voltage High Level Output Voltage High Level Output Voltage notes table.
-120
IOZHPD
IOZLPU IOZH VOL1 VOL2 VOL3 VOH1 VOH2
-120
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TABLE Electrical performance characteristics.- Continued. Conditions -55°C +125°C unless otherwise specified
Test
Symbol
Group subgroups
Device type
Limits
Unit
High Level Output Voltage Schmitt trigger positive threshold CMOS input input Schmitt trigger negative threshold CMOS input input High Level Input Voltage Input Capacitance Output Capacitance
VOH3
VTVIH Functional verification
notes table.
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TABLE Electrical performance characteristics. Conditions -55°C +125°C unless otherwise specified -300 GND, GND, 3.3V GND, Outputs disabled VOUT Outputs disabled VOUT Outputs disabled VOUT Outputs disabled VOUT Functional verification +1.5
Test
Symbol
Group subgroups
Device type -1.2
Limits -0.2
Unit
Input Clamp Voltage
Level Input Current
IILPU ILLPD
IIHPU IIHPD IOZL
Level Input Current, Pull-up Level Input Current, Pull-down
High Level Input Current High Level Input Current, Pull-up High Level Input Current, Pull-down Output Leakage Current Output Leakage High Current Pull-down Output Output Leakage Current Pull-up Output Output Leakage High Current Level Input Voltage Level Output Voltage Level Output Voltage Level Output Voltage High Level Output Voltage High Level Output Voltage notes table.
IOZHPD
IOZLPU
IOZH
VOL1
VOL2
VOL3
VOH1
VOH2
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TABLE Electrical performance characteristics.- Continued. Conditions -55°C +125°C unless otherwise specified
Test
Symbol
Group subgroups
Device type
Limits
Unit
High Level Output Voltage Schmitt trigger positive threshold CMOS input input Schmitt trigger negative threshold CMOS input input High Level Input Voltage Input Capacitance Output Capacitance
VOH3
VTVIH Functional verification
Forcing conditions functional test, assure that these limits met, they will individually recorded. Read Record measurements accordance with MIL-PRF-38535. Tested initial design after major process changes, otherwise guaranteed.
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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Case
Figure Case outlines Continued
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QUALITY ASSURANCE PROVISIONS Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modification plan shall affect form, fit, function described herein. device class sampling inspection procedures shall accordance with MIL-PRF-38535, appendix Screening. device classes screening shall accordance with MIL-PRF-38535, shall conducted devices prior qualification technology conformance inspection. device class screening shall accordance with method 5004 MIL-STD-883, shall conducted devices prior quality conformance inspection. 4.2.1 Additional criteria device class Burn-in test, method 1015 MIL-STD-883. Test condition described AID. test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015. +125°C, minimum. Interim final electrical test parameters shall specified table herein.
4.2.2 Additional criteria device classes burn-in test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. burn-in test circuit shall maintained under document revision level control device manufacturer's Technology Review Board (TRB) accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1015 MIL-STD-883. Interim final electrical test parameters shall specified table herein. Additional screening device class beyond requirements device class shall specified MIL-PRF-38535, appendix
Qualification inspection device classes Qualification inspection device classes shall accordance with MIL-PRF-38535. Inspections performed shall those specified MIL-PRF-38535 herein groups inspections (see 4.4.1 through 4.4.4). Conformance inspection. Technology conformance inspection classes shall accordance with MIL-PRF-38535 including groups inspections specified herein. Quality conformance inspection device class shall accordance with MIL-PRF-38535, appendix specified herein. Inspections performed device class shall those specified method 5005 MIL-STD-883 herein groups inspections (see 4.4.1 through 4.4.4).
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TABLE Electrical test requirements. Test requirements Subgroups accordance with MIL-STD-883, method 5005, table Device class Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group test requirements (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) Group end-point electrical parameters (see 4.4) applies subgroup applies subgroups 4.4.1 Group inspection. Tests shall specified table herein. device class subgroups tests shall sufficient verify functionality device described AID. Subgroups accordance with MIL-PRF-38535, table III) Device class Device class
4.4.2 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.2.1 Additional criteria device class Steady-state life test conditions, method 1005 MIL-STD-883: Test condition described AID. test circuit shall maintained manufacturer under document revision level control shall made available preparing acquiring activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883. +125°C, minimum. Test duration: 1,000 hours, except permitted method 1005 MIL-STD-883.
4.4.2.2 Additional criteria device classes steady-state life test duration, test condition test temperature, approved alternatives shall specified device manufacturer's plan accordance with MIL-PRF-38535. test circuit shall maintained under document revision level control device manufacturer's accordance with MIL-PRF-38535 shall made available acquiring preparing activity upon request. test circuit shall specify inputs, outputs, biases, power dissipation, applicable, accordance with intent specified test method 1005 MIL-STD-883.
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4.4.3 Group inspection. group inspection end-point electrical parameters shall specified table herein. 4.4.4 Group inspection. Group inspection required only parts intended marked radiation hardness assured (see herein). End-point electrical parameters shall specified table herein. device classes devices test vehicle shall subjected radiation hardness assured tests specified MIL-PRF-38535 level being tested. device class devices shall subjected radiation hardness assured tests specified MIL-PRF-38535, appendix level being tested. device classes must meet postirradiation end-point electrical parameter limits defined table +25°C ±5°C, after exposure, subgroups specified table herein. When specified purchase order contract, copy delta limits shall supplied.
PACKAGING Packaging requirements. requirements packaging shall accordance with MIL-PRF-38535 device classes MIL-PRF-38535, appendix device class NOTES Intended use. Microcircuits conforming this drawing intended Government microcircuit applications (original equipment), design applications, logistics purposes. 6.1.1 Replaceability. Microcircuits covered this drawing will replace same generic device covered contractor prepared specification drawing. 6.1.2 Substitutability. Device class devices will replace device class devices. Configuration control SMD's. proposed changes existing SMD's will coordinated with users record individual documents. This coordination will accomplished using Form 1692, Engineering Change Proposal. Record users. Military industrial users should inform Defense Supply Center Columbus when system application requires configuration control which SMD's applicable that system. DSCC will maintain record users this list will used coordination distribution changes drawings. Users drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. Comments. Comments this drawing should directed DSCC-VA Columbus, Ohio 43216-5000, telephone (614) 692-0547. Abbreviations, symbols, definitions. abbreviations, symbols, definitions used herein defined MIL-PRF-38535 MIL-HDBK-1331. Sources supply. 6.6.1 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed QML-38535 have submitted certificate compliance (see herein) DSCC-VA have agreed this drawing. 6.6.2 Approved sources supply device class Approved sources supply class listed MIL-HDBK-103. vendors listed MIL-HDBK-103 have agreed this drawing certificate compliance (see herein) been submitted accepted DSCC-VA.
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APPENDIX APPENDIX FORMS PART 5962-00B02 SCOPE 10.1 Scope. This appendix establishes minimum requirements microcircuit supplied under Qualified Manufacturers List (QML) Program. microcircuit meeting requirements MIL-PRF-38535 manufacturers approved plan monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, devices using chip wire designs accordance with MIL-PRF-38534 specified herein. product assurance classes consisting military high reliability (device class space application (device Class reflected Part Identification Number (PIN). When available choice Radiation Hardiness Assurance (RHA) levels reflected PIN. 10.2 PIN. shown following example: 5962 Federal stock class designator designator (see 10.2.1) Drawing number 10.2.1 designator. Device classes identified shall meet MIL-PRF-38535 specified levels. dash indicates non-RHA die. 10.2.2 Device type(s). device type(s) shall identify circuit function follows: Device type Generic number MG2044E MG2091E MG2140E MG2194E MG2265E MG2360E MG2480E MG2044 MG2091 MG2140 MG2194 MG2265 MG2360 MG2480 MG2M044E MG2M091E MG2M140E MG2M194E MG2M265E MG2M360E MG2M480E MG2M044 MG2M091 MG2M140 MG2M194 MG2M265 MG2M360 MG2M480 Circuit function 44,000 MG2RT gates available 91,000 MG2RT gates available 140,000 MG2RT gates available 194,000 MG2RT gates available 265,000 MG2RT gates available 360,000 MG2RT gates available 480,000 MG2RT gates available 44,000 gates available 91,000 gates available 140,000 gates available 194,000 gates available 265,000 gates available 360,000 gates available 480,000 gates available composite 44,000 MG2RT gates available composite 91,000 MG2RT gates available composite 140,000 MG2RT gates available composite 194,000 MG2RT gates available composite 265,000 MG2RT gates available composite 360,000 MG2RT gates available composite 480,000 MG2RT gates available composite 44,000 gates available composite 91,000 gates available composite 140,000 gates available composite 194,000 gates available composite 265,000 gates available composite 360,000 gates available composite 480,000 gates available 00B02 Device type (see 10.2.2) Device class designator (see 10.2.3) code Details (see 10.2.4)
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APPENDIX APPENDIX FORMS PART 5962-00B02 10.2.3 Device class designator. Device class Device requirements documentation Certification qualification requirements MIL-PRF-38535
10.2.4 Details. details designation shall unique letter which designates physical dimensions, bonding location(s) related electrical function(s), interface materials, other assembly related information, each product variant supplied this appendix. 10.2.4.1 physical dimensions. type Figure number REVERSED
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APPENDIX APPENDIX FORMS PART 5962-00B02 10.2.4.2 bonding locations electrical functions. type Figure number RESERVED
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APPENDIX APPENDIX FORMS PART 5962-00B02 10.2.4.3 Interface materials. type Figure number RESERVED
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APPENDIX APPENDIX FORMS PART 5962-00B02
10.2.4.4 Assembly related information. type Figure number RESERVED
10.3 Absolute maximum ratings. paragraph within body this drawing details. 10.4 Recommended operating conditions. paragraph within body this drawing details.
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APPENDIX APPENDIX FORMS PART 5962-00B02 APPLICABLE DOCUMENTS. 20.1 Government specifications, standards, handbooks. Unless otherwise specified, following specification, standard, handbook issue listed that issue Department Defense Index Specifications Standards specified solicitation, form part this drawing extent specified herein. SPECIFICATION DEPARTMENT DEFENSE MIL-PRF-38535 Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT DEFENSE MIL-STD-883 HANDBOOK DEPARTMENT DEFENSE MIL-HDBK-103 List Standard Microcircuit Drawings (SMD's). (Copies specification, standard, handbook required manufacturers connection with specific acquisition functions should obtained from contracting activity directed contracting activity). 20.2. Order precedence. event conflict between text this drawing references cited herein, text this drawing shall take precedence. REQUIREMENTS 30.1 Item requirements. individual item requirements device classes shall accordance with MIL-PRF-38535 specified herein modified device manufacturer's Quality Management (QM) plan. modification plan shall effect form, function described herein. 30.2 Design, construction physical dimensions. design, construction physical dimensions shall specified MIL-PRF-38535 manufacturer's plan, device classes herein. 30.2.1 physical dimensions. physical dimensions shall specified 10.2.4.1 figures thru A-7. 30.2.2 bonding locations electrical functions. bonding locations electrical functions shall specified 10.2.4.2 figures thru A-7. 30.2.3 Interface materials. interface materials shall specified 10.2.4.3 figures thru A-7. 30.2.4 Assembly related information. assembly related information shall specified 10.2.4.4 figures thru A-7. 30.2.5 Truth table(s). truth table(s) shall defined within paragraph 3.2.3. body this document. 30.3 Electrical performance characteristics post-irradiation parameter limits. Unless otherwise specified herein, electrical performance characteristics post-irradiation parameter limits specified table body this document. 30.4 Electrical test requirements. wafer probe test requirements shall include functional parametric testing sufficient make packaged capable meeting electrical performance requirements table Test Method Standard Microcircuits.
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APPENDIX APPENDIX FORMS PART 5962-00B02 30.5 Marking. minimum, each unique die, loaded single multiple stack carriers, shipment customer, shall identified with wafer number, certification mark, manufacturer's identification listed 10.2 herein. certification mark shall "QML" required MIL-PRF-38535. 30.6 Certification compliance. device classes certificate compliance shall required from QML38535 listed manufacturer order supply requirements this drawing (see 60.4 herein). certificate compliance submitted DSCC-VA prior listing approved source supply this appendix shall affirm that manufacturer's product meets, device classes requirements MIL-PRF-38535 requirements herein. 30.7 Certificate conformance. certificate conformance required device classes MIL-PRF-38535 shall provided with each microcircuit delivered this drawing. QUALITY ASSURANCE PROVISIONS 40.1 Sampling inspection. device classes sampling inspection procedures shall accordance with MIL-PRF-38535 modified device manufacturer's Quality Management (QM) plan. modifications plan shall effect form, function described herein. 40.2 Screening. device classes screening shall accordance with MIL-PRF-38535, defined manufacturer's plan. minimum shall consist Wafer acceptance Class product using criteria defined within MIL-STD-883 test method 5007. 100% wafer probe (see paragraph 30.4).
100% internal visual inspection applicable class criteria defined within MIL-STD-883 test method 2010 alternate procedures allowed within MIL-STD-883 test method 5004. 40.3 Conformance inspection. 40.3.1 Group inspection. Group inspection required only parts intended identified radiation assured (see 30.5 herein). levels device classes shall specified MIL-PRF-38535. point electrical testing packaged shall specified table herein. Group tests conditions specified within paragraphs 4.4.4.1, 4.4.4.1.1., 4.4.4.2, 4.4.4.3 4.4.4.4. CARRIER 50.1 carrier requirements. requirements carrier shall accordance with manufacturer's plan specified purchase order acquiring activity. carrier shall provide adequate physical, mechanical electrostatic protection. NOTES 60.1 Intended use. Microcircuit conforming this drawing intended microcircuits built accordance with MIL-PRF-38535 MIL-PRF-38534 government microcircuit applications (original equipment), design applications logistics purposes. 60.2 Comments. Comments this appendix should directed DSCC-VA, Columbus, Ohio, 43216-5000 telephone (614)-692-0547. 60.3 Abbreviations, symbols definitions. abbreviations, symbols, definitions used herein defined within MIL-PRF-38535 MIL-STD-1331. 60.4 Sources supply device classes Sources supply device classes listed QML-38535. vendors listed within QML-38535 have submitted certificate compliance (see 30.6 herein) DSCC-VA have agreed this drawing.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02 complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 4940.04 4840.11 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-1. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-1. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-1. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-1. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-1. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-1. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 6600.05 6530.05 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-2. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-2. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02 complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 7600.11 7590.13 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-3. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-3. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 8730 8790 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-4. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-4. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 9910.15 9900.09 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-5. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-5. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 11530.09 11600.13 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-6. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-6. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
complexity device, graphical representation locations available. This figure shall maintained available from device manufacturer. subsequent pages table locations.
bonding locations electrical functions physical dimensions. size: 13020.13 12950.12 microns (with scribe line) thickness: microns Interface materials. metallization: Aluminium Copper Backside metallization: Bare Silicon Glassivation. Type: Oxinitride Thickness: 10,000 Angstroms Substrate: Single crystal silicon Assembly related information. Substrate potential: connected Special assembly instructions: None
FIGURE A-7. bonding locations electrical functions.
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
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SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
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APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
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5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
APPENDIX APPENDIX FORMS PART 5962-00B02
FIGURE A-7. bonding locations electrical functions. Continued
STANDARD MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
SIZE
REVISION LEVEL
5962-00B02
SHEET
STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-03-08 Approved sources supply 5962-00B02 listed below immediate acquisition information only shall added MIL-HDBK-103 QML-38535 during next revision. MIL-HDBK-103 QML-38535 will revised include addition deletion sources. vendors listed below have agreed this drawing certificate compliance been submitted accepted DSCC-VA. This bulletin superseded next dated revision MIL-HDBK-103 QML-38535.
Standard microcircuit drawing 5962-00B0201Q_C 5962-00B0201V_C 5962-00B0201Q9A 5962-00B0201V9A 5962-00B0202Q_C 5962-00B0202V_C 5962-00B0202Q9A 5962-00B0202V9A 5962-00B0203Q_C 5962-00B0203V_C 5962-00B0203Q9A 5962-00B0203V9A 5962-00B0204Q_C 5962-00B0204V_C 5962-00B0204Q9A 5962-00B0204V9A 5962-00B0205Q_C 5962-00B0205V_C 5962-00B0205Q9A 5962-00B0205V9A 5962-00B0206Q_C 5962-00B0206V_C 5962-00B0206Q9A 5962-00B0206V9A 5962-00B0207Q_C 5962-00B0207V_C 5962-00B0207Q9A 5962-00B0207V9A
Vendor CAGE number F7400
Vendor similar MG2044E MG2044E MM0-G2044EHxxxMQ SM0-G2044EHxxxSV
F7400
MG2091E MG2091E MM0-G2091EHxxxMQ SM0-G2091EHxxxSV
F7400
MG2140E MG2140E MM0-G2140EHxxxMQ SM0-G2140EHxxxSV
F7400
MG2194E MG2194E MM0-G2194EHxxxMQ SM0-G2194EHxxxSV
F7400
MG2265E MG2265E MM0-G2265EHxxxMQ SM0-G2265EHxxxSV
F7400
MG2360E MG2360E MM0-G2360EHxxxMQ SM0-G2360EHxxxSV
F7400
MG2480E MG2480E MM0-G2480EHxxxMQ SM0-G2480EHxxxSV
Standard microcircuit drawing 5962-00B0209Q_C 5962-00B0209Q9A 5962-00B0210Q_C 5962-00B0210Q9A 5962-00B0211Q_C 5962-00B0211Q9A 5962-00B0212Q_C 5962-00B0212Q9A 5962-00B0213Q_C 5962-00B0213Q9A 5962-00B0214Q_C 5962-00B0214Q9A 5962-00B0215Q_C 5962-00B0215Q9A 5962-00B0216Q_C 5962-00B0216V_C 5962-00B0216Q9A 5962-00B0216V9A 5962-00B0217Q_C 5962-00B0217V_C 5962-00B0217Q9A 5962-00B0217V9A 5962-00B0218Q_C 5962-00B0218V_C 5962-00B0218Q9A 5962-00B0218V9A 5962-00B0219Q_C 5962-00B0219V_C 5962-00B0219Q9A 5962-00B0219V9A 5962-00B0220Q_C 5962-00B0220V_C 5962-00B0220Q9A 5962-00B0220V9A 5962-00B0221Q_C 5962-00B0221V_C 5962-00B0221Q9A 5962-00B0221V9A
Vendor CAGE number F7400
Vendor similar MG2044 MM0-G2044xxxMQ
F7400
MG2091 MM0-G2091xxxMQ
F7400
MG2140 MM0-G2140xxxMQ
F7400
MG2194 MM0-G2194xxxMQ
F7400
MG2265 MM0-G2265xxxMQ
F7400
MG2360 MM0-G2360xxxMQ
F7400
MG2480 MM0-G2480xxxMQ
F7400
MG2M044E MG2M044E MM0-G2M044EHxxxMQ SM0-G2M044EHxxxSV
F7400
MG2M091E MG2M091E MM0-G2M091EHxxxMQ SM0-G2M091EHxxxSV
F7400
MG2M140E MG2M140E MM0-G2M140EHxxxMQ SM0-G2M140EHxxxSV
F7400
MG2M194E MG2M194E MM0-G2M194EHxxxMQ SM0-G2M194EHxxxSV
F7400
MG2M265E MG2M265E MM0-G2M265EHxxxMQ SM0-G2M265EHxxxSV
F7400
MG2M360E MG2M360E MM0-G2M360EHxxxMQ SM0-G2M360EHxxxSV
Standard microcircuit drawing 5962-00B0222Q_C 5962-00B0222V_C 5962-00B0222Q9A 5962-00B0222V9A 5962-00B0223Q_C 5962-00B0223Q9A 5962-00B0224Q_C 5962-00B0224Q9A 5962-00B0225Q_C 5962-00B0225Q9A 5962-00B0226Q_C 5962-00B0226Q9A 5962-00B0227Q_C 5962-00B0227Q9A 5962-00B0228Q_C 5962-00B0228Q9A 5962-00B0229Q_C 5962-00B0229Q9A
Vendor CAGE number F7400
Vendor similar MG2M480E MG2M480E MM0-G2M480EHxxxMQ SM0-G2M480EHxxxSV
F7400
MG2M044 MM0-G2M044xxxMQ
F7400
MG2M091 MM0-G2M091xxxMQ
F7400
MG2M140 MM0-G2M140xxxMQ
F7400
MG2M194 MM0-G2M194xxxMQ
F7400
MG2M265 MM0-G2M265xxxMQ
F7400
MG2M360 MM0-G2M360xxxMQ
F7400
MG2M480 MM0-G2M480xxxMQ
lead finish shown each representing hermetic package most readily available from manufacturer listed that part. desired lead finish listed contact vendor determine availability. Caution. this number item acquisition. Items acquired this number satisfy performance requirements this drawing. nature this SMD, standard microcircuit drawing corresponding vendor similar shall specified AID. "xxx" reserved indicate customer specific code.
Vendor CAGE number F7400
Vendor name address Atmel Nantes S.A. Part Atmel Wireless Microcontrollers Chantrerie 70602 44306 Nantes Cedex France
information contained herein disseminated convenience only Government assumes liability whatsoever inaccuracies information bulletin.

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