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Assembly/Test Site, Fabrication Site Extended Temperature Performance
Top Searches for this datasheetLOW-POWER BICMOS CURRENT-MODE Assembly/Test Site, Fabrication Site Extended Temperature Performance -40°C 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree Protection Exceeds Using Machine Model Typical Starting Supply Current Typical Operating Supply Current Operation 1MHz Internal Soft Start Internal Fault Soft Start Internal Leading-Edge Blanking Current Sense Signal Totem-Pole Output Typical Response from Current-Sense Gate Drive Output 1.5% Tolerance Voltage Reference Same Pinout UC3842 UC3842A PACKAGE (TOP VIEW) Component qualification accordance with JEDEC industry standards ensure reliable operation over extended temperature range. This includes, limited Highly Accelerated Stress Test (HAST) biased 85/85, temperature cycle, autoclave unbiased HAST, electromigration, bond intermetallic life, mold compound life. Such qualification testing should viewed justifying this component beyond specified performance environmental limits. COMP description UCC2800/1/2/3/4/5 family high-speed, low-power integrated circuits contain control drive components required off-line DC-to-DC fixed frequency current-mode switching power supplies with minimal parts count. These devices have same configuration UC2842/3/4/5 family, also offer added features internal full-cycle soft start internal leading-edge blanking current-sense input. UCC2800/1/2/3/4/5 family offers choice maximum duty cycle critical voltage levels. Lower reference parts such UCC2803 UCC2805 best into battery operated systems, while higher reference higher UVLO hysteresis UCC2802 UCC2804 make these ideal choices off-line power supplies. PART NUMBER UCC2800 UCC2801 UCC2802 UCC2803 UCC2804 UCC2805 MAXIMUM DUTY CYCLE 100% 100% 100% REFERENCE VOLTAGE TURN-ON THRESHOLD 12.5 12.5 TURN-OFF THRESHOLD Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters. Copyright 2003, Texas Instruments Incorporated POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE ORDERING INFORMATION 40°C -40°C 125°C PACKAGE Tape reel Tape reel Tape reel Tape reel Tape reel Tape reel ORDERABLE PART NUMBER UCC2800QDREP UCC2801QDREP UCC2802QDREP UCC2803QDREP UCC2804QDREP UCC2805QDREP TOP-SIDE MARKING 2800EP 2801EP 2802EP 2803EP 2804EP 2805EP Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. block diagram Ordering Information UCC2 ENHANCED PLASTIC INDICATOR TAPE REEL INDICATOR PACKAGE Plastic SOIC AUTOMOTIVE TEMPERATURE RANGE INDICATOR PRODUCT OPTION through POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE absolute maximum ratings over operating free-air temperature range (unless otherwise noted) voltage current Output current, Output energy (Capacitive Load) Analog Inputs (FB, -0.3 Power Dissipation +25_C package) 0.65 Storage temperature range, Tstg -65_C 150_C Lead temperature soldering (1/16 inch) from case seconds 300_C Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. Unless otherwise indicated, voltages reference ground currents positive into negative specified terminals. normal operation powered through current limiting resistor. Absolute maximum applies when driven from impedance source such that does exceed (which includes gate drive current requirement). electrical characteristics, -40_C 125_C, (see Note from from GND, capacitor from GND, capacitor from VREF (unless otherwise stated) PARAMETER Reference Section Output voltage Load regulation voltage Line regulation voltage 25_C clamp Note kHz, Note 1000 hours, Note 25_C -40_C 125_C UCC2800/01/02/04 Total variation voltage Output noise voltage Long term stability Output short-circuit current UCC2803/05 25_C 125_C 4.88 UCC2800/01/02/04 UCC2803/05 4.925 3.94 5.075 4.06 4.08 mV/V TEST CONDITIONS UNITS POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE electrical characteristics, -40_C 125_C, (see Note from from GND, capacitor from GND, capacitor from VREF (unless otherwise stated) PARAMETER Oscillator Section UCC2800/01/02/04 Oscillator frequency Temperature stability Amplitude peak-to-peak Oscillator peak voltage Error Amplifier Section COMP Input voltage Input bias current Open loop voltage gain COMP sink current COMP source current Gain bandwidth product Section UCC2800/02/03 Maximum duty cycle Minimum duty cycle Current Sense Section Gain Maximum input signal Input bias current blank time Over-current threshold voltage COMP offset voltage Output Section (OUT) IOUT Low-level level output voltage IOUT IOUT IOUT IOUT High level output High-level voltage VSAT (VCC OUT) Rise time Fall time IOUT -200 IOUT parts parts UCC2803/05 parts parts parts UCC2803/05 0.35 0.15 0.15 Note COMP Note -200 1.42 0.45 1.55 1.65 1.68 1.35 COMP UCC2801/04/05 Note COMP COMP COMP UCC2800/01/02/04 UCC2803/05 2.44 1.95 -0.2 -0.5 -0.8 2.56 2.05 Note Note 2.25 UCC2803/05 2.45 2.55 TEST CONDITIONS UNITS POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE electrical characteristics, -40_C 125_C, (see Note from from GND, capacitor from GND, capacitor from VREF (unless otherwise stated) PARAMETER Undervoltage Lockout Section UCC2800 UCC2801 Start threshold Note UCC2802/04 UCC2803/05 UCC2800 UCC2801 Stop threshold Note UCC2802/04 UCC2803/05 UCC2800 UCC2801 Start stop hysteresis UCC2802/04 UCC2803/05 Soft Start Section COMP rise time Overall Section Start-up current Operating supply current internal zener voltage internal zener voltage minus start threshold voltage Start Threshold Note Notes UCC2802/04 13.5 Rise from 11.5 0.12 12.5 10.2 13.5 0.48 TEST CONDITIONS UNITS NOTES: Adjust above start threshold before setting Oscillator frequency UCC2800, UCC2802 UCC2803 output frequency. Oscillator frequency UCC2801, UCC2804 UCC2805 twice output frequency. DVCOMP DVCS Gain defined Parameter measured trip point latch with Total Variation includes temperature stability load regulation. Start Threshold, Stop Threshold Zener Shunt Thresholds track another. production tested. device fully operating clamp mode forcing current higher than normal operating supply current. POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE detailed terminal descriptions COMP COMP output error amplifier input comparator. Unlike other devices, error amplifier UCC2800 family true, output-impedance, operational amplifier. such, COMP terminal both source sink current. However, error amplifier internally current limited, that command zero duty cycle externally forcing COMP GND. UCC2800 family features built-in full cycle Soft Start. Soft Start implemented clamp maximum COMP voltage. input current sense comparators. UCC2800 family different current sense comparators: comparator over-current comparator. UCC2800 family contains digital current sense filtering, which disconnects terminal from current sense comparator during interval immediately following rising edge pin. This digital filtering, also called leading-edge blanking, means that most applications, analog filtering filter) required Compared external filter technique, leading-edge blanking provides smaller effective propagation delay. Note, however, that minimum non-zero On-Time signal directly affected leading-edge-blanking propagation delay. over-current comparator only intended fault sensing, exceeding over-current threshold will cause soft start cycle. inverting input error amplifier. best stability, keep lead length short possible stray capacitance small possible. ground (GND) reference ground power ground functions this part. output high-current power driver capable driving gate power MOSFET with peak currents exceeding "750 actively held when below UVLO threshold. high-current power driver consists output devices, which switch output stage also provides very impedance overshoot undershoot. This means that many cases, external schottky clamp diodes required. POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE detailed descriptions (continued) oscillator timing pin. fixed frequency operation, timing capacitor charging current connecting resistor from frequency connecting timing capacitor from GND. best perfomance, keep timing capacitor lead short direct possible. possible, separate ground traces timing capacitor other functions. frequency oscillation estimated with following equations: UCC2803 UCC2805 UCC2800 where frequency resistance ohms, capacitance farads. recommended range timing resistors between 200k timing capacitor 1000 Never timing resistor less than 10k. prevent noise problems, bypass with ceramic capacitor close possible. electrolytic capacitor also used addition ceramic capacitor. voltage reference (REF) voltage reference error amplifier also many other functions also used logic power supply high speed switching logic When greater than less than UVLO threshold, pulled ground through resistor. This means that used logic output indicating power system status. important reference stability that bypassed with ceramic capacitor close possible. electrolytic capacitor also used addition ceramic capacitor. minimum ceramic required. Additional bypassing required external loads greater than reference. prevent noise problems with high speed switching transients, bypass ground with ceramic capacitor very close package. power (VCC) power input connection this device. normal operation powered through current limiting resistor. Although quiescent current very low, total supply current will higher, depending current. Total current quiescent current average current. Knowing operating frequency MOSFET gate charge (Qg), average current calculated from: POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE PARAMETER MEASUREMENT INFORMATION Oscillator Error Amplifier Gain/Phase Response UCC3800/1/2/3/4/5 oscillator generates sawtooth waveform rise time time constant fall time internal transistor on-resistance approximately 125. During fall time, output maximum duty cycle reduced below 100% depending part number. Larger timing capacitors increase discharge time reduce maximum duty cycle frequency. Figure UCC1803/05 VREF VCC; ILOAD Figure UCC1800/01/02/04 Oscillator Frequency Figure Figure POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE UCC1803/05 Oscillator Frequency UCC1800/02/03 Maximum Duty Cycle Oscillator Frequency Figure UCC1801/04/05 Maximum Duty Cycle Oscillator Frequency Figure UCC1800 Oscillator Frequency Figure Figure POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE UCC1805 Oscillator Frequency Dead Time 100k Figure COMP Offset Temperature, Figure Figure POST OFFICE 655303 DALLAS, TEXAS 75265 LOW-POWER BICMOS CURRENT-MODE MECHANICAL DATA (R-PDSO-G**) PINS SHOWN 0.050 (1,27) 0.020 (0,51) 0.014 (0,35) 0.010 (0,25) PLASTIC SMALL-OUTLINE PACKAGE 0.244 (6,20) 0.228 (5,80) 0.157 (4,00) 0.150 (3,81) 0.008 (0,20) Gage Plane 0.044 (1,12) 0.016 (0,40) 0.010 (0,25) Seating Plane 0.069 (1,75) 0.010 (0,25) 0.004 (0,10) 0.004 (0,10) PINS 0.197 (5,00) 0.189 (4,80) 0.344 (8,75) 0.337 (8,55) 0.394 (10,00) 0.386 (9,80) 4040047/E 09/01 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. Body dimensions include mold flash protrusion, exceed 0.006 (0,15). Falls within JEDEC MS-012 POST OFFICE 655303 DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 24-Feb-2006 PACKAGING INFORMATION Orderable Device UCC2800QDREP UCC2801QDREP UCC2802QDREP UCC2803QDREP UCC2804QDREP UCC2805QDREP V62/03624-01XE V62/03624-02XE V62/03624-03XE V62/03624-04XE V62/03624-05XE V62/03624-06XE Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC Package Drawing Pins Package Plan Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device. Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material) MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. 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