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General Description AS1109 designed drive LEDs through fast seria


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General Description
AS1109 designed drive LEDs through fast serial interface features output constant current drivers on-chip diagnostic read-back function. high clock-frequency 50MHz), adjustable output current, flexible serial interface makes device perfectly suited high-volume transmission applications. Output current adjustable 100mA/channel) using external resistor (REXT). serial interface with Schmitt trigger inputs includes integrated shift register. Additionally, internal data register stores currently displayed data. device features integrated diagnostics overtemperature, open-LED, shorted-LED conditions. Integrated registers store global fault status information during load well detailed temperature/openLED/shorted-LED diagnostics results. AS1109 also features low-current diagnostic mode minimize display flicker during fault testing. With operating temperature range from +125°C AS1109 also ideal industrial applications. AS1109 available 16-pin SOIC-150, 16-pin (4x4mm) 16-pin SSOP-150 package.
Features
Constant-Current Output Channels Excellent Output Current Accuracy Between Channels: Between AS1109 Devices:
Output Current Channel: 100mA Controlled In-Rush Current Over-Temperature, Open-LED, Shorted-LED Diagnostics Functions Low-Current Test Mode Global Fault Monitoring Shutdown Mode Current: Fast Serial Interface: 50MHz Cascaded Configuration Fast Output Drivers Suitable 16-pin SOIC-150, 16-pin (4x4mm) 16-pin SSOP-150 Package
Applications
device ideal fixed- slow-rolling displays using static multiplexed matrix dimming functions, large matrix displays, mixed display switch monitoring, displays elevators, public transports (underground, trains, buses, taxis, airplanes, etc.), large displays stadiums public areas, price indicators retail stores, promotional panels, bar-graph displays, industrial controller displays, white good panels, emergency light indicators, traffic signs.
Figure Main Diagram Assignments
+VLED
OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 OUTN6 OUTN7
REXT
AS1109
OUTN0 OUTN1
AS1109
OUTN7 OUTN6 OUTN5 OUTN4
REXT
OUTN2 OUTN3
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AS1109 Data Sheet
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Contents
General Description Features Applications Absolute Maximum Ratings Electrical Characteristics
Switching Characteristics
Typical Operating Characteristics Pinout
Assignments Descriptions
Detailed Description
Serial Interface Timing Diagrams Error-Detection Mode Global Error Mode Error Detection Functions Open-LED Detection Shorted-LED Overtemperature Detailed Error Reports Detailed Temperature Warning Report Detailed Open-LED Error Report Detailed Shorted-LED Error Report Low-Current Diagnostic Mode
Shutdown Mode
Application Information
Error Detection Error Detection On-The-Fly Error Detection with Low-Current Diagnosis Mode Cascading Devices Constant Current Adjusting Output Current Package Power Dissipation Delayed Outputs Switching-Noise Reduction Load Supply Voltage
Package Drawings Markings Ordering Information
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AS1109 Data Sheet
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Absolute Maximum Ratings
Stresses beyond those listed Table cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated Section Electrical Characteristics page implied. Exposure absolute maximum rating conditions extended periods affect device reliability. Table Absolute Maximum Ratings Parameter Input Voltage Output Current Output Voltage Current Power Dissipation PCB, TAMB Thermal Resistance PCB, TAMB Operating Temperature Range Storage Temperature Humidity Electrostatic Discharge Digital Outputs Other Pins -100 (INOM 0.5) 0.87 90.6 -0.4 -0.4 +0.4 1000 1.11 115.4 2000 2000 +100 INOM Units Non-condensing Norm: method 3015 Device fully functional 125°C Comments
Latch-Up Immunity
EIA/JESD78 reflow peak soldering temperature (body temperature) specified accordance with IPC/JEDEC J-STD020C "Moisture/Reflow Sensitivity Classification Non-Hermetic Solid State Surface Mount Devices". lead finish Pb-free leaded packages matte (100% Sn).
Package Body Temperature
+260
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AS1109 Data Sheet
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Electrical Characteristics
+3.0 +5.5V, TAMB +85°C (unless otherwise specified). Typical values measured TAMB 25°C. Table Electrical Characteristics Symbol IOUT Input Voltage IDS(OFF) IAV(LC1) IAV(LC1) IAV(LC2) IAV(LC2) IAV(LC3) IAV(LC3) %/VDS %/VDD RIN(UP) RIN(DOWN) VTHL
Parameter Supply Voltage Output Voltage
Condition
15.0
Unit
OUTN0:7 OUTN0:7
-1.0 -0.3
Output Current
High Level CLK, OEN, Level Output Leakage Current Output Voltage 15.0V +1.0mA -1.0mA 0.5V, Const., REXT IOUT 25.26mA, 0.5V, Const., REXT 0.6V, 3.3V, REXT IOUT 50.52mA, 0.6V, Const., REXT 0.8V, 5.0V, REXT IOUT 90mA, 0.8V, Const., REXT 0.8V, 5.0V 0.8V, 5.0V, REXT 372, OUTN0:7 within 3.0V within 5.0V load 3.0V, load 5.0V, load
0.4V 24.5 25.26 ±0.9
Device-to-Device Average Output Current from OUTN0 OUTN7 Current Skew (Between Channels) Device-to-Device Average Output Current from OUTN0 OUTN7 Current Skew (Between Channels) Device-to-Device Average Output Current from OUTN0 OUTN7 Current Skew (Between Channels) Low-Current Diagnosis Mode Power Down Supply Current Output Current Output Voltage Regulation Output Current Supply Voltage Regulation Pullup Resistance Pulldown Resistance Open Error Detection Threshold Voltage Short Error Detection Threshold Voltage Overtemperature Threshold Flag
49.50 50.52 51.55 ±0.8 ±0.5 ±0.1 0.25 0.35 0.45
VTHH
TOV1
Min/max values load dependent.
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AS1109 Data Sheet
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Table Electrical Characteristics (Continued) Symbol IDD(OFF)0 IDD(OFF)1 IDD(OFF)2 IDD(OFF)3 IDD(ON)1 IDD(ON)2 IDD(ON)3 Supply Current Parameter Condition REXT Open, OUTN0:7 REXT 744, OUTN0:7 REXT 372, OUTN0:7 REXT 186, OUTN0:7 REXT 744, OUTN0:7 REXT 372, OUTN0:7 REXT 186, OUTN0:7 13.7 3.68 5.37 8.73 Unit
Switching Characteristics
5.5V, 0.8V, VDD, GND, REXT 372, VLOAD 4.0V, RLOAD CLOAD 10pF; guaranteed design. Table Switching Characteristics Symbol tW(CLK) tW(L) tW(OE)
Parameter Propagation Delay Time Propagation Delay Time (Without Staggered Output Delay) Propagation Delay Time Pulse Width Maximum Rise Time Maximum Fall Time Output Rise Time VOUT (Turn Off) Output Fall Time VOUT (Turn Setup Time Hold Time Setup Time Hold Time Minimum Time Error Detection Staggered Output Delay Output Enable Setup Time Global Error Switching Setup Time Global Error Detection Setup Time Propagation Delay Global Error Flag Switching Time Global Error Flag Maximum Clock Frequency (Cascade Operation) Low-Current Test Mode Propagation Delay Time External Resistor Reaction Time External Resistor Reaction Time
Conditions OUTNn OUTNn (@IOUT 60mA)
Unit
2000 0.05
tSU(D) tH(D) tSU(L) tH(L) tTESTING tSTAG tSU(OE) tGSW(ERROR) tSU(ERROR) tP(I/O) tSW(ERROR) fCLK tP3,ON tTP3,OFF tREXT2,1 tREXT2,1
Turn Turn Change from REXT1 372, IOUT1 50.52mA REXT2 37.2k, IOUT2 Change from REXT1 37.2k, IOUT1 0.5mA REXT2 372, IOUT2 25mA
multiple AS1109 devices cascaded large, critical achieve timing required data transfer between cascaded drivers.
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AS1109 Data Sheet
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Typical Operating Characteristics
Figure Output Current REXT, VOUT 0.8V, TAMB 25°C
Figure Relative Output Current Error VDD, Iout/Iout@VDD TAMB 25°C
Relative Output Current Error
REXT 744; 0.5V REXT 186; 0.8V
IOUT (mA)
-0.5
REXT 372; 0.6V
-1.5
1000 REXT (Ohm)
10000
Figure Output Current VDS; TAMB 25°C
REXT
Figure Output Current VDS; TAMB 25°C
REXT
REXT
REXT REXT REXT
IOUT (mA)
IOUT (mA)
REXT REXT
REXT REXT
REXT REXT
Figure Relative IOUT Error Temperature Iout/Iout@25°C TAMB 25°C
Relative Output Current Error
REXT 372; 0.6V
REXT 186; 0.8V
-0.5
REXT 744; 0.5V
Temperature (°C)
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AS1109 Data Sheet
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Assignments
Pinout
Assignments
Figure Assignments (Top View)
OUTN0 OUTN1 OUTN2 OUTN3 16-pin SSOP-150 16-pin SOIC-150 REXT OUTN0 OUTN1 OUTN2 OUTN3 OUTN4 OUTN5 REXT OUTN7 OUTN6
AS1109
OUTN7 OUTN6 OUTN5 OUTN4
AS1109
16-pin (4x4mm)
Descriptions
Table Descriptions Number
16-pin SSOP-150 16-pin SOIC-150 16-pin (4x4mm)
Name OUTN0:7 Ground Serial Data Input
Description
5:12
3:10
Serial Data Clock. rising edge signal used clock data into falling edge AS1109 shift register. error mode, rising edge signal used switch error modes. Serial Data Load. Data transferred data register rising edge this pin. Output Current Drivers. These pins used drivers input sense diagnostic modes. Output Enable. active-low signal always enable output drivers sink current independent AS1109 mode. Output drivers enabled. Output drivers disabled. Serial Data Output. normal mode clocked clock cycles after clocked global error detection mode this indicates occurrence global error. Global error mode returned error. errors. External Resistor Connection. This connects through external resistor (REXT) GND, setup load current. Positive Supply Voltage
REXT
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AS1109 Data Sheet
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Detailed Description
AS1109 designed drive LEDs through fast serial interface constant-current output drivers. Furthermore, AS1109 provides diagnostics detecting open- shorted-LEDs, well over-temperature conditions display systems, especially traffic sign applications. AS1109 contains 8-bit shift register 8-bit data register, which convert serial input data into parallel output format. AS1109 output stages, eight regulated current sinks designed provide uniform constant current with excellent matching between ports driving LEDs within wide range forward voltage variations. External output current adjustable from 100mA using external resistor flexibility controlling brightness intensity LEDs. AS1109 guarantees endure maximum outputs. serial interface capable operating minimum MHz, satisfying requirements high-volume data transmission. Using multiplexed input/output technique, AS1109 adds additional functionality pins SDO, OEN. These pins provide highly useful functions (open- shorted-LED detection, over-temperature detection), thus reducing count. Over-temperature detection will work on-the-run, whereas open- shorted-LED detection used on-the-run low-current diagnostic mode (see page 15). Figure Block Diagram
+VLED
OUTN0
OUTN1
OUTN2
OUTN3
OUTN4
OUTN5
OUTN6
OUTN7
REXT Current Generators
Temperature Detection
8-Bit Open Detection Error Register
8-Bit Short Detection Error Register
AS1109
8-Bit Data Register
Detailed Error Detection
Global Error Detection
8-Bit Shift Register Control Logic
Indicates Path
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AS1109 Data Sheet
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Serial Interface
Serial Interface
Data accesses made serially pins SDO. each rising edge, signal present shifted into first internal shift register other bits shifted ahead first bit. first clocked error-detection mode shift register will latch-in corresponding error data temperature-, open-, short-error register with each falling edge 8-bit data register will latch data shift register each rising edge This data then used drive current generator output drivers switch corresponding LEDs goes low.
Timing Diagrams
This section contains timing diagrams referenced other sections this data sheet. Figure Normal Mode Timing Diagram
tW(CLK)
tSU(D)
tH(D)
tW(L) tSU(L) tH(L)
Output Enabled OUTNx High Output OUTNx Output
OUTNx
Figure Output Delay Timing Diagram
tW(OE) OUTN0 tSTAG OUTN1 tSTAG
7XtSTAG OUTN7
7XtSTAG
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Timing Diagrams
Figure Data Input Timing Diagram
tSU(L tSU(OE)
tW(OE)
Pulses
tW(L)
tSU(D) SDI0 Data Data Data Data Data Data Data Data tH(D) SDO0 Data Data Data Data Data Data Data Data Don't Care Don't Care
Figure Data Input Example Timing Diagram
Time
OUTN0
OUTN1
OUTN2
OUTN3
OUTN4
OUTN5
OUTN6
OUTN7
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AS1109 Data Sheet
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Error-Detection Mode
Figure Switching Global Error Mode Timing Diagram
tTESTING tGSW(ERROR) tSU(ERROR) tP(I/O) tP(I/O) tP(I/O) tGSW(ERROR)
tGSW(ERROR)
TFLAG(IN)
OFLAG(IN)
SFLAG(IN)
Don't Care
TFLAG
Don't Care
OFLAG
Don't Care
SFLAG
Acquisition Error Status
tSW(ERROR)
tSW(ERROR)
Error-Detection Mode
Acquisition error status occurs rising edge OEN. Error-detection mode started rising edge when high. signal must when entering error detection mode. Error detection open- shorted-LEDs only performed LEDs that switched during test time. switch between error-detection modes clock pulses needed (see Table Note: test LEDs, test pattern that turns LEDs must input AS1109.
Global Error Mode
Global error mode entered when error-detection mode started. Clock pulses during this period used select between temperature, open-LED, shorted-LED tests, well low-current diagnostic mode shutdown mode (see Table global error mode, error flag (TFLAG, OFLAG, SFLAG) delivered errors encountered. Table Global Error Mode Selections Clock Pulses Output Port Don't Care Enabled Enabled Don't Care Don't Care Error-Detection Mode Over-Temperature Detection Open-LED Detection Shorted-LED Detection Low-Current Diagnostic Mode Shutdown Mode Wakeup Shutdown Global Error Flag/Shutdown Condition TFLAG over-temperature warning. TFLAG Over-temperature warning. OFLAG open-LED error. OFLAG Open-LED error. SFLAG shorted-LED error. SFLAG Shorted-LED error.
Note: valid result must first device.
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Error Detection Functions
there multiple AS1109s chain, error flag will gated through devices. valid result chain, logic must applied input first device chain. device produces error this error will show after n*tP(I/O) tSW(ERROR) last device chain. This means possible identify which device chain produced error. Therefore, global error occurs, detailed error report identify which AS1109, produced error. Note: When error occurred, detailed error report skipped, setting subsequently low.
Error Detection Functions
Open-LED Detection
AS1109 open-LED detection based comparison between VTHL. open status aquired rising edge stored internally. While detecting open-LEDs output port must turned Open detection started with clock pulse during error detection mode while output port turned Note: LEDs which turned test time cannot tested. Table Open Detection Modes Output Port State Effective Output Point Conditions VTHL VTHL Detected Open-LED Error Status Code Meaning Open Circuit Normal
Shorted-LED
AS1109 shorted-LED detection based comparison between VTHH. shortened status aquired rising edge stored internally. While detecting shorted-LEDs output port must turned Shorted-LED detection started with clock pulses during error detection mode while output port turned valid results, voltage OUTN0:OUTN7 must lower then VTHH under low-current diagnostic mode operating conditions. This achieved reducing VLED voltage adding additional diodes, resistors LED's. Note: LEDs which turned test time cannot tested. Table Shorted Detection Modes Output Port State Effective Output Point Conditions VTHH VTHH Detected Shorted-LED Error Status Code Meaning Short Circuit Normal
Overtemperature
Thermal protection AS1109 provided continuously monitoring device's core temperature. overtemperature status aquired rising edge stored internally. Table Overtemperature Modes Output Port State Don't Care Don't Care Effective Output Point Conditions Temperature TOV1 Temperature TOV1 Detected Overtemperature Status Code Meaning Overtemperature Condition Normal
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Detailed Error Reports
Detailed Error Reports
detailed error report read after global error mode been run. falling edge detailed error report selected test latched into shift register clocked with clock cycles number AS1109s chain) SDO. same time data written into shift register, which will load next rising edge This data will show output drivers, falling edge OEN.
Detailed Temperature Warning Report
detailed temperature warning report read immediately after global error mode been run. Bit0 8bit data word represents temperature flag chip. Figure Detailed Temperature Warning Report Timing Diagram
Global Flag Readout tGSW(ERROR) t(SU)ERROR tH(L) Detailed Error Report Readout
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don't Care Don't Care
Data Input TFLAG Undefined Temperature Error Report Output
TBit0
detailed timing information Timing Diagrams page
Detailed Temperature Warning Report Example Consider case where five AS1109s cascaded chain. detailed error report lists temperatures each device chain: IC1:[70°] IC2:[85°] IC3:[66°] IC4:[160°] IC5:[76°] this case, overheated will generate global error, therefore clock cycles needed write detailed temperature warning report, optionally read data. detailed temperature warning report would look like this: XXXXXXX1 XXXXXXX1 XXXXXXX1 XXXXXXX0 XXXXXXX1 detailed temperature warning report indicates that device with over-temperature condition. Note: actual report there spaces output.
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Detailed Error Reports
Detailed Open-LED Error Report
detailed open-LED error report read immediately after global error mode been run. Figure Detailed Open-LED Error Report Timing Diagram
Global Flag Readout tTESTING tSU(ERROR) tGSW(ERROR) tGSW(ERROR)
Acquisition Error Status
Detailed Error Report Readout
tH(L)
tGSW(ERROR)
tSW(ERROR)
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don't Care
Data Input TFlag OFlag
OBit7 OBit6 OBit5 OBit4 OBit3 OBit2 OBit1 OBit0
Don't Care
Open Error Report Output
detailed timing information Timing Diagrams page
Detailed Open-LED Error Report Example Consider case where five AS1109s cascaded chain. indicates indicates off, indicates open LED. open-LED test only applied LEDs that turned This test used with test pattern where LEDs test time. IC1:[11111111] IC2:[111XX111] IC3:[11111111] IC4:[1X111111] IC5:[11111111] open LEDs open switched input. clock cycles needed write entire error code out. detailed error report would look like this: Input Data: Status: Failure Code: 11111111 11100111 11111111 11111111 11111111 11111111 10111111 11111111 11111111 11111111
Comparing this report with input data indicates that device with open LEDs position with open second position. such test recommended enter low-current diagnostic mode first (see Low-Current Diagnostic Mode page reduce onscreen flickering. Note: actual report there spaces output. LEDs turned during test time cannot tested.
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Detailed Error Reports
Detailed Shorted-LED Error Report
detailed shorted-LED error report read immediately after global error mode been (see Global Error Mode page 11). Figure Detailed Shorted-LED Error Report Timing Diagram
Global Flag Readout tTESTING tSU(ERROR) tGSW(ERROR) tGSW(ERROR)
Acquisition Error Status
Detailed Error Report Readout
tH(L) tGSW(ERROR)
DBit7
DBit6
DBit5
DBit4
DBit3
DBit2
DBit1
DBit0
Don't Care
tSW(ERROR)
Data Input
SBit7 SBit6 SBit5 SBit4 SBit3 SBit2 SBit1 SBit0
TFLAG OFLAG TFLAG
SFLAG
Don't Care
detailed timing information Timing Diagrams page
Shorted-LED Error Report Output
Detailed Shorted-LED Error Report Example Consider case where five AS1109s cascaded chain. indicates indicates off, indicates shorted LED. This test used with test pattern where LEDs test time. Additionally, this test should after starting low-current diagnostic mode (see Low-Current Diagnostic Mode page 15). IC1:[11111XX1] IC2:[11111111] IC3:[11111111] IC4:[111X1111] IC5:[11111111] shorted LEDs shorted switched input. clock cycles needed write entire error code out. detailed error report would look like this: Input Data: Status: Failure Code: 11111111 11111111 11111111 11111111 11111111 11111111 11111111 11101111 11111111 11111111 11111111
Showing device with shorted LEDs position with shorted position Note: actual report there spaces output. LEDs turned during test time cannot tested.
Low-Current Diagnostic Mode
open- shorted-LED test, test pattern must used that will turn each tested. This test pattern will cause short flicker screen while test being performed. low-current diagnostic mode initiated prior running detailed error report reduce this on-screen flickering. Note: Normally, displays using such diagnosis mode require additional cables, resistors, other components reduce current. AS1109 this current-reduction capability built-in, thereby minimizing number external components required. Low-current diagnostic mode initiated clock pulses during error-detection mode. After falling edge test pattern displaying written shift register which will used next error-detection test. next falling edge OEN, current reduced ILC. With next rising edge current will immediately increase normal levels detailed error report read entering error-detection mode.
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Shutdown Mode
Figure Switching into Low-Current Diagnostic Mode Timing Diagram
Global Flag Readout Load Internal Test Pattern (optional) tSU(ERROR) tH(L) Low-Current Diagnosis Mode
tTESTING
tGSW(ERROR) tGSW(ERROR) tSW(ERROR) tGSW(ERROR)
tH(L)
Re-entering Error Detection Mode
TFLAG OFLAG SFLAG
Don't Care Normal Operation Current
detailed timing information Timing Diagrams page
Shutdown Mode
AS1109 features shutdown mode which entered clock pulses during error-detection mode. enable shutdown mode must placed after rising edge clock pulse. disable shutdown mode must placed after clock pulse. shutdown/wakeup information will latched through multiple AS1109 devices chain. rising edge clock pulse shutdown will read AS1109 will shutdown wakeup. Note: shutdown mode supply current drops down typically 3µA. Figure Shutdown Mode Timing Diagram
tSU(ERROR)
Wakeup Shutdown
Wakeup TFLAG OFLAG SFLAG Shutdown tSU(D)
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Error Detection
Application Information
Error Detection
AS1109 features types error detection. error detection used on-the-fly, active LEDs, without delay, entering into low-current diagnosis mode.
Error Detection On-The-Fly
Error detection on-the-fly will output status active LEDs during operation. Without choosing error mode this will output temperature flag every input/output cycle. Triggering clock pulse open clock pulses short detection during error detection mode outputs detailed open- short-error report with next input/output cycle (see Figure 19). LEDs that turned cannot tested their digits error output must ignored. Figure Normal Operation with Error Detection During Operation Cascaded AS1109s
Display Data1 Data2 Data3
Data2 Error Code Data0
Data3
Data4
Clock Error Mode 0x/1x/2x
Error Code Data1
Clock Error Mode 0x/1x/2x
Error Code Data2
1024x Rising Edge Acquisition Error Status
1024x Rising Edge Acquisition Error Status Falling Edge Error Register copied into Shift Register 100mA
1024x
Falling Edge Error Register copied into Shift Register
Current
Global Error Flag
Error Detection with Low-Current Diagnosis Mode
This unique feature AS1109 uses internal test pattern flicker free diagnosis LEDs. This error detection mode started anytime, does require input (see Figure 20). Figure Low-Current Diagnosis Mode with Internal Test Pattern Cascaded AS1109s
Low-Current Diagnosis Mode Display Data0 Data1
Data1 Error Code Test Patern
Data2
Clocks LowCurrent Mode
Clock Error Mode 1x/2x
Temperature Error Code
1024x Rising Edge Acquisition Error Status Falling Edge Error Register copied into Shift Register Load Internal Test Pattern
1024x
Current
100mA 0.8mA
100mA Global Error Flag
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Cascading Devices
Low-current diagnosis mode started with clock pulses during error detection mode. After three pulses CLK, pulse loads internal test pattern. Then should enabled testing. With rising edge test LEDs stopped while high desired error mode selected with corresponding clock pulses. With next data input detailed error code will clocked SDO. Note: Figure external test pattern. Figure Low-Current Diagnosis Mode with External Test Pattern Cascaded AS1109s
Low-Current Diagnosis Mode Display Data1 External Test Pattern Error Code Data0
Clocks Low-Current Mode Clock Error Mode 1x/2x
Data2
Data2 Error Code from Test Pattern
Data3
Temperature Error Code
1024x
1024x Rising Edge Acquisition Error Status Falling Edge Error Register copied into Shift Register
1024x
Current
100mA 0.8mA
100mA
Global Error Flag
Cascading Devices
cascade multiple AS1109 devices, must connected next AS1109 (see Figure 22). each rising edge shift register will written into shift register next AS1109 chain. Data clocked rising edge pulse clocked clock cycles later falling edge pulse. Note: When n*AS1109 devices chain, clock pulses needed latch-in input data. Figure Cascading AS1109 Devices
AS1109
AS1109
AS1109 #n-1
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Constant Current
Constant Current
display applications, AS1109 provides virtually current variations from channel-to-channel from AS1109-to-AS1109. This mostly factors:
While IOUT 50mA, maximum current skew less than between channels less than between AS1109 devices. saturation region, characteristics curve output stage flat (see Figure page Thus, output current kept constant regardless variations forward voltages (VF).
Adjusting Output Current
AS1109 scales reference current (IREF) external resistor (REXT) sink current (IOUT) each output port. shown Figure page output current saturation region extremely flat that possible define target current (IOUT TARGET). IOUT TARGET calculated VREXT 1.253V IREF VREXT/REXT other REXT connected ground) IOUT TARGET IREF*15 (1.253V/REXT)*15 Where: REXT resistance external resistor connected REXT. VREXT voltage REXT. magnitude current function REXT) around 100mA 186, 50.52mA 25.26mA 744. Figure page shows relationship curve between IOUT TARGET each channel corresponding external resistor (REXT).
Package Power Dissipation
maximum allowable package power dissipation (PD) determined PD(MAX) (TJ-TAMB)/RTH(J-A) When output channels turned simultaneously, actual package power dissipation PD(ACT) (IDD*VDD) (IOUT*Duty*VDS*8) Therefore, keep PD(ACT) PD(MAX), allowable maximum output current function duty cycle IOUT Where:
Delayed Outputs
AS1109 graduated delay circuits between outputs. These delay circuits found between OUTNn constant current block. fixed delay time (typ) where OUTN0 delay, OUTN1 20ns delay, OUTN2 40ns delay OUTN7 140ns delay. This delay prevents large inrush currents, which reduce power supply bypass capacitor requirements when outputs turn (see Figure page
Switching-Noise Reduction
drivers frequently used switch-mode applications which normally exhibit switching noise parasitic inductance PCB.
Load Supply Voltage
Considering package power dissipation limits (see 4:6), AS1109 should operated within range 1.0V. example, VLED higher than high that PD(ACT) PD(MAX) where VLED this case, lowest possible supply voltage voltage reducer (VDROP) should used. voltage reducer allows (VLED -VF) VDROP. Note: Resistors zener diodes used voltage reducer shown Figure
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Load Supply Voltage
Figure Voltage Reducer using Resistor (Left) Zener Diode (Right)
Voltage Supply Voltage Supply
VLED
VDROP
VDROP
VLED
AS1109
AS1109
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Package Drawings Markings
device available 16-pin SOIC-150 package. Figure 16-pin SOIC-150 Package
Notes: Lead coplanarity should 0.10mm (.004") max. Package surfacing: Top: matte (charmilles #18- 30). sides: matte (charmilles #18- 30). Bottom: smooth matte (charmilles #18- 30). dimensions excluding mold flashes flash from package body shall exceed 0.25mm (.010") side (D). Detail identifier optional must located within zone indicated. Dimensions millimeters.
Symbol
0.10 0.25 0.36 0.46 0.19 0.25 9.80 9.98 3.81 3.99 1.27 5.80 6.20 0.25 0.50 0.41 1.27 1.52 1.72 0.51 1.37 1.57
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AS1109 Data Sheet
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Figure 16-pin SSOP-150 Package
Symbol
1.35 1.75 0.10 0.25 1.37 1.57 0.20 0.30 0.19 0.25 4.80 4.98 5.79 6.20 3.81 3.99 0.635 0.22 0.49 0.40 1.27 0.230 pins
Notes: Lead coplanarity should 0.10mm (.004") max. Package surfacing: Top: matte (charmilles #18- 30). sides: matte (charmilles #18- 30). Bottom: smooth matte (charmilles #18- 30). dimensions excluding mold flashes flash from package body shall exceed 0.25mm (.010") side (D). Dimensions does include dambar protrusion/intrusion solder coverage. Dimensions millimeters.
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AS1109 Data Sheet
austriam systems
Figure 16-pin 4x4mm Packages
-AD2 D2/2
Index Area (D/2 xE/2)
-BNXL E2/2
Detail Marker
Index Area (D/2 xE/2)
Detail
View
Bottom View
0.08
Seating Plane
Side View
16-pin 4x4mm Datum Dimensions Symbol
Datum
0.15 0.10 0.10 0.05
Notes
Terminal
0.25 0.70 0.00
0.30 0.65 0.75 0.02 0.20
0.35 0.80 0.05
Terminal
Terminal Side
Even Terminal Side 0.03 2.00 2.00 0.45 4.00 4.00 2.15 2.15 0.55
0.15
Detail
2.25 2.25 0.65
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Revision 1.14
AS1109 Data Sheet
austriam systems
Notes: Dimensioning tolerancing conform ASME Y14.5M-1994. dimensions millimeters; angles degrees. total number terminals. terminal identifier terminal numbering convention shall conform JEDEC SPP-012. Details terminal identifier optional must located within zone indicated. terminal identifier either mold marked feature. Dimension applies metallized terminal measured between 0.15 0.30mm from terminal tip. terminal optional radius, dimension should measured that radius area. Dimensions refer number terminals each side, respectively. Depopulation possible symmetrical fashion. Figure shown illustration only does represent specific variation. variations constructed Figure however variations alternately constructed between square rectangle shape dimensions Refer Dimensions Table complete dimensions. Bilateral coplanarity zone applies exposed heat sink slug well terminals. Depending method lead termination edge package, pullback (L1) present. minus 0.33mm.
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Revision 1.14
AS1109 Data Sheet
austriam systems
Load Supply Voltage
Ordering Information
device available standard products shown Table Table Ordering Information Type AS1109-BSOU AS1109-BSOT AS1109-BSSU AS1109-BSST AS1109-BQFR AS1109-BQFT Description Constant-Current, 8-Bit Driver with Diagnostics Constant-Current, 8-Bit Driver with Diagnostics Constant-Current, 8-Bit Driver with Diagnostics Constant-Current, 8-Bit Driver with Diagnostics Constant-Current, 8-Bit Driver with Diagnostics Constant-Current, 8-Bit Driver with Diagnostics Delivery Form Tubes Tape Reel Tubes Tape Reel Tray Tape Reel Package 16-pin SOIC-150 16-pin SOIC-150 16-pin SSOP-150 16-pin SSOP-150 16-pin (4x4mm) 16-pin (4x4mm)
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Revision 1.14
AS1109 Data Sheet
austriam systems
Load Supply Voltage
Copyrights
Copyright 1997-2006, austriamicrosystems Schloss Premstaetten, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered rights reserved. material herein reproduced, adapted, merged, translated, stored, used without prior written consent copyright owner. products companies mentioned trademarks registered trademarks their respective companies.
Disclaimer
Devices sold austriamicrosystems covered warranty patent indemnification provisions appearing Term Sale. austriamicrosystems makes warranty, express, statutory, implied, description regarding information forth herein regarding freedom described devices from patent infringement. austriamicrosystems reserves right change specifications prices time without notice. Therefore, prior designing this product into system, necessary check with austriamicrosystems current information. This product intended normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, high reliability applications, such military, medical life-support lifesustaining equipment specifically recommended without additional processing austriamicrosystems each application. shipments less than parts manufacturing flow might show deviations from standard production flow, such test flow test location. information furnished here austriamicrosystems believed correct accurate. However, austriamicrosystems shall liable recipient third party damages, including limited personal injury, property damage, loss profits, loss use, interruption business indirect, special, incidental consequential damages, kind, connection with arising furnishing, performance technical data herein. obligation liability recipient third party shall arise flow austriamicrosystems rendering technical other services.
Contact Information
Headquarters austriamicrosystems A-8141 Schloss Premstaetten, Austria Tel: 3136 Fax: 3136 Sales Offices, Distributors Representatives, please visit:
austriamicrosystems
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