Operation Inputs Accept Voltages 3-State Noninverting Outputs Drive Li
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SN54AC374, SN74AC374 OCTAL TYPE EDGE TRIGGERED FLIP FLOPS WITH STATE OUTPUTS
Operation Inputs Accept Voltages 3-State Noninverting Outputs Drive Lines Directly Full Parallel Access Loading
SN54AC374 PACKAGE SN74AC374 PACKAGE (TOP VIEW)
description/ordering information
These 8-bit flip-flops feature 3-state outputs designed specifically driving highly capacitive relatively low-impedance loads. devices particularly suitable implementing buffer registers, ports, bidirectional drivers, working registers. eight flip-flops 'AC374 devices D-type edge-triggered flip-flops. positive transition clock (CLK) input, outputs logic levels data inputs. buffered output-enable (OE) input used place eight outputs either normal logic state (high logic levels) high-impedance state. high-impedance state, outputs neither load drive lines significantly. high-impedance state increased drive provide capability drive lines bus-organized systems without need interface pullup components.
SN54AC374 PACKAGE (TOP VIEW)
does affect internal operations flip-flop. data retained data entered while outputs high-impedance state. ORDERING INFORMATION
PDIP SOIC 85°C -40°C SSOP TSSOP CDIP 125°C -55°C LCCC PACKAGE Tube Tube Tape reel Tape reel Tape reel Tube Tape reel Tube Tube Tube ORDERABLE PART NUMBER SN74AC374N SN74AC374DW SN74AC374DWR SN74AC374NSR SN74AC374DBR SN74AC374PW SN74AC374PWR SNJ54AC374J SNJ54AC374W SNJ54AC374FK AC374 SNJ54AC374J SNJ54AC374W SNJ54AC374FK AC374 AC374 AC374 TOP-SIDE MARKING SN74AC374N
Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
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products compliant 38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters.
Copyright 2003, Texas Instruments Incorporated
SN54AC374, SN74AC374 OCTAL TYPE EDGE TRIGGERED FLIP FLOPS WITH STATE OUTPUTS
description/ordering information (continued)
ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver.
FUNCTION TABLE (each flip-flop) INPUTS OUTPUT
logic diagram (positive logic)
Seven Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Output voltage range, (see Note -0.5 Input clamp current, VCC) Output clamp current, VCC) Continuous output current, VCC) Continuous current through ±200 Package thermal impedance, (see Note package 70°C/W package 58°C/W package 69°C/W package 60°C/W package 83°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output voltage ratings exceeded input output current ratings observed. package thermal impedance calculated accordance with JESD 51-7.
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SN54AC374, SN74AC374 OCTAL TYPE EDGE TRIGGERED FLIP FLOPS WITH STATE OUTPUTS
recommended operating conditions (see Note
SN54AC374 Supply voltage Low-level input voltage Input voltage Output voltage Low-level output current Input transition rise fall rate 4.5V 3.15 3.85 1.35 1.65 SN74AC374 3.15 3.85 1.35 1.65 ns/V UNIT
High-level input voltage
High-level output current
Operating free-air temperature NOTE unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS GND, 2.56 3.86 4.86 0.36 0.36 0.36 ±0.1 ±0.25 25°C SN54AC374 SN74AC374 2.46 3.76 4.76 0.44 0.44 0.44 ±2.5 UNIT
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SN54AC374, SN74AC374 OCTAL TYPE EDGE TRIGGERED FLIP FLOPS WITH STATE OUTPUTS
timing requirements over recommended operating free-air temperature range, (unless otherwise noted) (see Figure
25°C fclock Clock frequency Pulse duration, high Setup time, data before Hold time, data after SN54AC374 SN74AC374 UNIT
timing requirements over recommended operating free-air temperature range, (unless otherwise noted) (see Figure
25°C fclock Clock frequency Pulse duration, high Setup time, data before Hold time, data after SN54AC374 SN74AC374 UNIT
switching characteristics over recommended operating free-air temperature range, (unless otherwise noted) (see Figure
PARAMETER fmax tPLH tPHL tPZH tPZL tPHZ tPLZ (INPUT) (OUTPUT) 25°C 10.5 13.5 12.5 11.5 11.5 12.5 11.5 SN54AC374 16.5 SN74AC374 15.5 14.5 12.5 UNIT
switching characteristics over recommended operating free-air temperature range, (unless otherwise noted) (see Figure
PARAMETER fmax tPLH tPHL tPZH tPZL tPHZ tPLZ (INPUT) (OUTPUT) 25°C SN54AC374 10.5 12.5 10.5 SN74AC374 10.5 12.5 UNIT
operating characteristics, 25°C
PARAMETER Power dissipation capacitance TEST CONDITIONS UNIT
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SN54AC374, SN74AC374 OCTAL TYPE EDGE TRIGGERED FLIP FLOPS WITH STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
From Output Under Test (see Note Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
LOAD CIRCUIT Timing Input Input VOLTAGE WAVEFORMS Data Input VOLTAGE WAVEFORMS
Input tPLH In-Phase Output tPHL Out-of-Phase Output tPHL tPLH VOLTAGE WAVEFORMS
Output Control (low-level enabling) tPZL Output Waveform (see Note Output Waveform Open (see Note
tPLZ tPZH tPHZ VOLTAGE WAVEFORMS
NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with input transition measurement.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
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12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-87694012A 5962-8769401RA 5962-8769401SA 5962-8769401VRA 5962-8769401VSA SN74AC374DBLE SN74AC374DBR SN74AC374DBRE4 SN74AC374DW SN74AC374DWE4 SN74AC374DWR SN74AC374DWRE4 SN74AC374N SN74AC374NE4 SN74AC374NSR SN74AC374NSRE4 SN74AC374PW SN74AC374PWE4 SN74AC374PWLE SN74AC374PWR SN74AC374PWRE4 SNJ54AC374FK SNJ54AC374J SNJ54AC374W
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type LCCC CDIP CDIP SSOP SSOP SSOP SOIC SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP LCCC CDIP
Package Drawing
Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish Call Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU Call Call Call
Peak Temp Type Type Type Type Type Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Type
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details.
Addendum-Page
PACKAGE OPTION ADDENDUM
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12-Jan-2006
TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
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