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Typical VOLP (Output Ground Bounce) 25°C High-Drive Outputs (-32-
Top Searches for this datasheetSN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS Typical VOLP (Output Ground Bounce) 25°C High-Drive Outputs (-32-mA IOH, 64-mA IOL) Ioff Supports Partial-Power-Down Mode Operation SN54ABT573 PACKAGE SN74ABT573A PACKAGE (TOP VIEW) Latch-Up Performance Exceeds JEDEC Standard JESD Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) SN54ABT573 PACKAGE (TOP VIEW) SN74ABT573A PACKAGE (TOP VIEW) description/ordering information These 8-bit latches feature 3-state outputs designed specifically driving highly capacitive relatively low-impedance loads. They particularly suitable implementing buffer registers, ports, bidirectional drivers, working registers. ORDERING INFORMATION PDIP SOIC -40°C 85°C SSOP TSSOP VFBGA VFBGA (Pb-free) CDIP 125°C -55°C Tape reel Tube Tube PACKAGE Tube Tape reel Tube Tape reel Tape reel Tape reel Tube Tape reel ORDERABLE PART NUMBER SN74ABT573AN SN74ABT573ARGYR SN74ABT573ADW SN74ABT573ADWR SN74ABT573ANSR SN74ABT573ADBR SN74ABT573APW SN74ABT573APWR SN74ABT573AGQNR SN74ABT573AZQNR SNJ54ABT573J SNJ54ABT573W AB573A SNJ54ABT573J SNJ54ABT573W AB573A ABT573A ABT573A AB573A TOP-SIDE MARKING SN74ABT573AN AB573A LCCC Tube SNJ54ABT573FK SNJ54ABT573FK Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package. Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters. products compliant 38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters. Copyright 2003, Texas Instruments Incorporated POST OFFICE 655303 DALLAS, TEXAS 75265 SN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS description/ordering information (continued) buffered output-enable (OE) input used place eight outputs either normal logic state (high logic levels) high-impedance state. high-impedance state, outputs neither load drive lines significantly. high-impedance state increased drive provide capability drive lines without need interface pullup components. does affect internal operations latches. data retained data entered while outputs high-impedance state. ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. This device fully specified partial-power-down applications using Ioff. Ioff circuitry disables outputs, preventing damaging current backflow through device when powered down. SN74ABT573A PACKAGE (TOP VIEW) terminal assignments FUNCTION TABLE (each latch) INPUTS OUTPUT logic diagram (positive logic) Seven Other Channels numbers shown RGY, packages. POST OFFICE 655303 DALLAS, TEXAS 75265 SN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, SN54ABT573 SN74ABT573A Input clamp current, Output clamp current, Package thermal impedance, (see Note package 70°C/W (see Note package 58°C/W (see Note GQN/ZQN package 78°C/W (see Note package 69°C/W (see Note package 60°C/W (see Note package 83°C/W (see Note package 37°C/W Storage temperature range, Tstg -65°C 150°C Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with JESD 51-7. package thermal impedance calculated accordance with JESD 51-5. recommended operating conditions (see Note SN54ABT573 Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Outputs enabled SN74ABT573A UNIT ns/V Operating free-air temperature NOTE unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004. POST OFFICE 655303 DALLAS, TEXAS 75265 SN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER Vhys IOZH IOZL Ioff ICEX TEST CONDITIONS Outputs high Outputs high input Other inputs Outputs Outputs disabled -100 ±100 -180 -180 ±100 -180 0.55 0.55* 0.55 0.55 25°C -1.2 SN54ABT573 -1.2 SN74ABT573A -1.2 UNIT products compliant MIL-PRF-38535, this parameter does apply. typical values This data sheet limit vary among suppliers. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level, rather than GND. timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure SN54ABT573 25°C Pulse duration, high Setup time, data before Hold time, data after High UNIT POST OFFICE 655303 DALLAS, TEXAS 75265 SN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure SN74ABT573A 25°C Pulse duration, high High Setup time, data before Hold time, data after This data-sheet limit vary among suppliers. UNIT switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure SN54ABT573 PARAMETER FROM (INPUT) (OUTPUT) 25°C tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure SN74ABT573A PARAMETER FROM (INPUT) (OUTPUT) 25°C tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT This data-sheet limit vary among suppliers. POST OFFICE 655303 DALLAS, TEXAS 75265 SN54ABT573, SN74ABT573A OCTAL TRANSPARENT TYPE LATCHES WITH STATE OUTPUTS PARAMETER MEASUREMENT INFORMATION Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open From Output Under Test (see Note LOAD CIRCUIT Input VOLTAGE WAVEFORMS PULSE DURATION Timing Input Data Input VOLTAGE WAVEFORMS SETUP HOLD TIMES Output Control tPZL Output Waveform (see Note tPZH Output Waveform Open (see Note tPLZ tPHZ VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING Input tPLH Output tPHL tPHL tPLH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS Output NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with transition measurement. parameters waveforms applicable devices. Figure Load Circuit Voltage Waveforms POST OFFICE 655303 DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 13-Feb-2006 PACKAGING INFORMATION Orderable Device 5962-9321901Q2A 5962-9321901QRA 5962-9321901QSA SN74ABT573ADBLE SN74ABT573ADBR SN74ABT573ADBRE4 SN74ABT573ADW SN74ABT573ADWE4 SN74ABT573ADWR SN74ABT573ADWRE4 SN74ABT573AGQNR Status ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type LCCC CDIP SSOP SSOP SSOP SOIC SOIC SOIC SOIC CROSTA JUNI PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP CROSTA JUNI LCCC CDIP Package Drawing Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Lead/Ball Finish Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU SNPB Peak Temp Type Type Type Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-240C-UNLIM 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 1000 SN74ABT573AN SN74ABT573ANE4 SN74ABT573ANSR SN74ABT573ANSRE4 SN74ABT573APW SN74ABT573APWE4 SN74ABT573APWLE SN74ABT573APWR SN74ABT573APWRE4 SN74ABT573ARGYR SN74ABT573ARGYRG4 SN74ABT573AZQNR ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Pb-Free (RoHS) Pb-Free (RoHS) NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU NIPDAU NIPDAU SNAGCU Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1YEAR Level-2-260C-1YEAR Level-1-260C-UNLIM 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br) SNJ54ABT573FK SNJ54ABT573J SNJ54ABT573W ACTIVE ACTIVE ACTIVE Call Call Call Type Type Type Addendum-Page PACKAGE OPTION ADDENDUM www.ti.com 13-Feb-2006 marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device. Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material) MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis. Addendum-Page MECHANICAL DATA MLCC006B OCTOBER 1996 (S-CQCC-N**) TERMINAL SHOWN LEADLESS CERAMIC CHIP CARRIER TERMINALS 0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6) 0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0) 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 0.045 (1,14) 0.035 (0,89) 4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004 POST OFFICE 655303 DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E JANUARY 1995 REVISED DECEMBER 2001 (R-PDSO-G**) PINS SHOWN 0,65 0,38 0,22 0,15 PLASTIC SMALL-OUTLINE 0,25 0,09 5,60 5,00 8,20 7,40 Gage Plane 0,25 0,95 0,55 Seating Plane 2,00 0,05 0,10 PINS 6,50 6,50 7,50 8,50 10,50 10,50 12,90 5,90 5,90 6,90 7,90 9,90 9,90 12,30 4040065 12/01 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150 POST OFFICE 655303 DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C JANUARY 1995 REVISED FEBRUARY 1999 (R-PDSO-G**) PINS SHOWN PLASTIC SMALL-OUTLINE PACKAGE 0,65 0,30 0,19 0,10 0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50 Seating Plane 1,20 0,15 0,05 0,10 PINS 3,10 5,10 5,10 6,60 7,90 9,80 2,90 4,90 4,90 6,40 7,70 9,60 4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153 POST OFFICE 655303 DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated subsidiaries (TI) reserve right make corrections, modifications, enhancements, improvements, other changes products services time discontinue product service without notice. Customers should obtain latest relevant information before placing orders should verify that such information current complete. products sold subject TI's terms conditions sale supplied time order acknowledgment. warrants performance hardware products specifications applicable time sale accordance with TI's standard warranty. Testing other quality control techniques used extent deems necessary support this warranty. Except where mandated government requirements, testing parameters each product necessarily performed. assumes liability applications assistance customer product design. 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