State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Diss

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State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Diss

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SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) 25°C High-Drive Outputs 32-mA IOH, 64-mA Package Options Include Plastic Small-Outline (DW) Shrink Small-Outline (DB) Packages, Ceramic Chip Carriers (FK), Plastic Ceramic DIPs
SN54ABT374 PACKAGE SN74ABT374 PACKAGE (TOP VIEW)
description
These 8-bit flip-flops feature 3-state outputs designed specifically driving highly capacitive relatively low-impedance loads. They particularly suitable implementing buffer registers, ports, bidirectional drivers, working registers. eight flip-flops ABT374 edge-triggered D-type flip-flops. positive transition clock (CLK) input, outputs logic levels that were data inputs.
SN54ABT374 PACKAGE (TOP VIEW)
buffered output-enable (OE) input used place eight outputs either normal logic state (high low) high-impedance state. high-impedance state, outputs neither load drive lines significantly. high-impedance state increased drive provide capability drive lines without need interface pullup components. does affect internal operations flip-flop. data retained data entered while outputs high-impedance state. ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. SN74ABT374 available TI's shrink small-outline package (DB), which provides same count functionality standard small-outline packages less than half printed-circuit-board area. SN54ABT374 characterized operation over full military temperature range 55°C 125°C. SN74ABT374 characterized operation from 40°C 85°C.
FUNCTION TABLE (each flip-flop) INPUTS OUTPUT
EPIC-B trademark Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters.
Copyright 1994, Texas Instruments Incorporated
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SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
logic symbol
logic diagram (positive logic)
Seven Other Channels
This symbol accordance with ANSI/IEEE 91-1984 Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, Input voltage range, (see Note Voltage range applied output high state power-off state, Current into output state, SN54ABT374 SN74ABT374 Input clamp current, Output clamp current, Maximum power dissipation 55°C still air) (see Note package package package Storage temperature range 65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. maximum package power dissipation calculated using junction temperature 150°C board trace length mils, except package, which trace length zero. more information, refer Package Thermal Considerations application note 1994 Advanced BiCMOS Technology Data Book, literature number SCBD002B.
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SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
recommended operating conditions (see Note
SN54ABT374 Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Outputs enabled SN74ABT374 UNIT
Operating free-air temperature NOTE Unused floating inputs must held high low.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER IOZH IOZL Ioff ICEX TEST CONDITIONS Outputs high input Other inputs Outputs Outputs disabled Outputs high -100 0.55 0.55* ±100 -180 -180 0.55 0.55 ±100 -180 25°C -1.2 SN54ABT374 -1.2 SN74ABT374 -1.2 UNIT
products compliant MIL-STD-883, Class this parameter does apply. typical values This data sheet limit vary among suppliers. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level rather than GND.
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
timing requirements over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Figure
25°C fclock Clock frequency Pulse duration Setup time before high Data high Data Data high SN54ABT374 SN74ABT374 UNIT
Hold time after This data sheet limit vary among suppliers.
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
PARAMETER fmax tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) (OUTPUT) 25°C SN54ABT374 SN74ABT374 UNIT
POST OFFICE 655303
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SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
From Output Under Test (see Note Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
LOAD CIRCUIT OUTPUTS Timing Input Input VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP HOLD TIMES Data Input
Input (see Note tPLH Output
tPHL tPHL tPLH
Output Control tPZL Output Waveform (see Note Output Waveform Open (see Note tPZH
tPLZ tPHZ
Output
VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
NOTES: includes probe capacitance. input pulses supplied generators having following characteristics: MHz, Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. outputs measured time with transition measurement.
Figure Load Circuit Voltage Waveforms
POST OFFICE 655303
DALLAS, TEXAS 75265
SN54ABT374, SN74ABT374 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
POST OFFICE 655303
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-9314901Q2A 5962-9314901QRA 5962-9314901QSA SN74ABT374DBLE SN74ABT374DW SN74ABT374DWR SN74ABT374N SNJ54ABT374FK SNJ54ABT374J SNJ54ABT374W
Status ACTIVE ACTIVE ACTIVE OBSOLETE OBSOLETE OBSOLETE OBSOLETE ACTIVE ACTIVE ACTIVE
Package Type LCCC CDIP SSOP SOIC SOIC PDIP LCCC CDIP
Package Drawing
Pins Package Plan
Lead/Ball Finish Call Call Call Call Call Call Call Call Call Call
Peak Temp Type Type Type Call Call Call Call Type Type Type
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MLCC006B OCTOBER 1996
(S-CQCC-N**)
TERMINAL SHOWN
LEADLESS CERAMIC CHIP CARRIER
TERMINALS
0.342 (8,69) 0.442 (11,23) 0.640 (16,26) 0.739 (18,78) 0.938 (23,83) 1.141 (28,99) 0.358 (9,09) 0.458 (11,63) 0.660 (16,76) 0.761 (19,32) 0.962 (24,43) 1.165 (29,59) 0.307 (7,80) 0.406 (10,31) 0.495 (12,58) 0.495 (12,58) 0.850 (21,6) 1.047 (26,6)
0.358 (9,09) 0.458 (11,63) 0.560 (14,22) 0.560 (14,22) 0.858 (21,8) 1.063 (27,0)
0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25)
0.020 (0,51) 0.010 (0,25)
0.055 (1,40) 0.045 (1,14)
0.045 (1,14) 0.035 (0,89)
0.028 (0,71) 0.022 (0,54) 0.050 (1,27)
0.045 (1,14) 0.035 (0,89)
4040140 10/96 NOTES: linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with metal lid. terminals gold plated. Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Diss

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