Members Texas Instruments Widebus Family Output Ports Have Equiva

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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
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Widebus Family Output Ports Have Equivalent Series Resistors, External Resistors Required Typical VOLP (Output Ground Bounce) 25°C High-Impedance State During Power Power Down Ioff Power-Up 3-State Support Insertion Distributed Pins Minimize High-Speed Switching Noise Flow-Through Architecture Optimizes Layout Latch-Up Performance Exceeds JESD-17
SN54ABT162244 PACKAGE SN74ABT162244 DGG, DGV, PACKAGE (TOP VIEW)
description/ordering information
'ABT162244 devices 16-bit buffers line drivers designed specifically improve both performance density 3-state memory address drivers, clock drivers, bus-oriented receivers transmitters. These devices used four 4-bit buffers, 8-bit buffers, 16-bit buffer. These devices provide noninverting outputs symmetrical active-low output-enable (OE) inputs.
outputs, which designed source sink include equivalent series resistors reduce overshoot undershoot. ensure high-impedance state during power power down, should tied through pullup resistor; minimum value resistor determined current-sinking capability driver. ORDERING INFORMATION
PACKAGE Tube SSOP -40°C 85°C TSSOP TVSOP Tape reel Tape reel Tape reel ORDERABLE PART NUMBER SN74ABT162244DL SN74ABT162244DLR SN74ABT162244DGGR SN74ABT162244DGVR ABT162244 ABT162244 AH2244 TOP-SIDE MARKING
-55°C 125°C Tube SNJ54ABT162244WD SNJ54ABT162244WD Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. Widebus trademark Texas Instruments.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters. products compliant 38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters.
Copyright 2004, Texas Instruments Incorporated
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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
description/ordering information (continued)
These devices fully specified hot-insertion applications using Ioff power-up 3-state. Ioff circuitry disables outputs, preventing damaging current backflow through devices when they powered down. power-up 3-state circuitry places outputs high-impedance state during power power down, which prevents driver conflict.
FUNCTION TABLE (each 4-bit buffer) INPUTS OUTPUT
logic diagram (positive logic)
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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, Input clamp current, Output clamp current, Package thermal impedance, (see Note package 70°C/W package 58°C/W package 63°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with JESD 51-7.
recommended operating conditions (see Note
SN54ABT162244 t/VCC Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Power-up ramp rate Operating free-air temperature Outputs enabled SN74ABT162244 UNIT ns/V µs/V
NOTES: unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS Vhys IOZPU IOZPD IOZH IOZL Ioff ICEX Outputs high input Other inputs Outputs high Outputs Outputs disabled Outputs enabled Outputs disabled ±100 -100 -100 ±100 -100 3.35 3.85 2.6* 0.8* 25°C -1.2 3.35 3.85 SN54ABT162244 -1.2 3.35 3.85 0.65 SN74ABT162244 -1.2 UNIT
Data inputs Control inputs
input Other inputs
products compliant MIL-PRF-38535, this parameter does apply. typical values more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level, rather than GND.
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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN54ABT162244 PARAMETER FROM (INPUT) (OUTPUT) 25°C tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT
switching characteristics over recommended ranges supply voltage operating free-air temperature, (unless otherwise noted) (see Figure
SN74ABT162244 PARAMETER FROM (INPUT) (OUTPUT) 25°C tPLH tPHL tPZH tPZL tPHZ tPLZ UNIT
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SN54ABT162244, SN74ABT162244 BUFFERS/DRIVERS WITH STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
From Output Under Test (see Note
LOAD CIRCUIT Input VOLTAGE WAVEFORMS PULSE DURATION
Timing Input Data Input VOLTAGE WAVEFORMS SETUP HOLD TIMES Output Control tPZL Output Waveform (see Note Output Waveform Open (see Note tPZH VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING tPLZ tPHZ
Input tPLH Output tPHL tPHL tPLH Output VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS
NOTES: includes probe capacitance. Waveform output with internal conditions such that output low, except when disabled output control. Waveform output with internal conditions such that output high, except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time, with transition measurement. parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Feb-2006
PACKAGING INFORMATION
Orderable Device 5962-9458701QXA 74ABT162244DGGRE4 74ABT162244DGVRE4 74ABT162244DLRG4 SN74ABT162244DGGR SN74ABT162244DGVR SN74ABT162244DL SN74ABT162244DLG4 SN74ABT162244DLR SNJ54ABT162244WD
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type TSSOP TVSOP SSOP TSSOP TVSOP SSOP SSOP SSOP
Package Drawing
Pins Package Plan 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call
Peak Temp Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type
1000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MCFP010B JANUARY 1995 REVISED NOVEMBER 1997
(R-GDFP-F**)
LEADS SHOWN 0.120 (3,05) 0.075 (1,91)
CERAMIC DUAL FLATPACK
0.009 (0,23) 0.004 (0,10)
1.130 (28,70) 0.870 (22,10) 0.370 (9,40) 0.250 (6,35) 0.390 (9,91) 0.370 (9,40) 0.025 (0,635) 0.370 (9,40) 0.250 (6,35)
0.014 (0,36) 0.008 (0,20)
LEADS**
0.640 (16,26) 0.610 (15,49)
0.740 (18,80) 0.710 (18,03) 4040176 10/97
NOTES:
linear dimensions inches (millimeters). This drawing subject change without notice. This package hermetically sealed with ceramic using glass frit. Index point provided terminal identification only Falls within 1835: GDFP1-F48 JEDEC -146AA GDFP1-F56 JEDEC -146AB
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MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
(R-PDSO-G**)
PINS SHOWN 0,23 0,13
PLASTIC SMALL-OUTLINE
0,40
0,07
0,16 4,50 4,30 6,60 6,20
Gage Plane
0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,08
PINS
3,70 3,50
3,70 3,50
5,10 4,90
5,10 4,90
7,90 7,70
9,80 9,60
11,40 11,20
4073251/E 08/00 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion, exceed 0,15 side. Falls within JEDEC: 24/48 Pins MO-153 14/16/20/56 Pins MO-194
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MECHANICAL DATA
MSSO001C JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0.025 (0,635)
0.0135 (0,343) 0.008 (0,203)
0.005 (0,13)
0.010 (0,25) 0.005 (0,13)
0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03)
Gage Plane 0.010 (0,25)
0.040 (1,02) 0.020 (0,51)
Seating Plane 0.110 (2,79) 0.008 (0,20) 0.004 (0,10)
PINS
0.380 (9,65) 0.370 (9,40)
0.630 (16,00) 0.620 (15,75)
0.730 (18,54) 0.720 (18,29) 4040048 12/01
NOTES:
linear dimensions inches (millimeters). This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0.006 (0,15). Falls within JEDEC MO-118
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MECHANICAL DATA
MTSS003D JANUARY 1995 REVISED JANUARY 1998
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,50
0,27 0,17
0,08
6,20 6,00
8,30 7,90
0,15
Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
12,60
14,10
17,10
12,40
13,90
16,90 4040078 12/97
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold protrusion exceed 0,15. Falls within JEDEC MO-153
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