Typical VOLP (Output Ground Bounce) 25°C High-Impedance State During P
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SN54ABT126, SN74ABT126 QUADRUPLE BUFFER GATES WITH 3-STATE OUTPUTS
Typical VOLP (Output Ground Bounce) 25°C High-Impedance State During Power Power Down High-Drive Outputs (-32-mA IOH, 64-mA IOL)
Ioff Power-Up 3-State Support Insertion Latch-Up Performance Exceeds JESD Protection Exceeds JESD 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A)
SN54ABT126 PACKAGE (TOP VIEW)
internal connection ORDERABLE PART NUMBER SN74ABT126RGYR SN74ABT126N SN74ABT126D SN74ABT126DR SN74ABT126NSR SN74ABT126DBR SN74ABT126PW SN74ABT126PWR SNJ54ABT126J TOP-SIDE MARKING AB126 SN74ABT126N ABT126 ABT126 AB126 AB126 SNJ54ABT126J
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SN54ABT126 PACKAGE SN74ABT126 PACKAGE (TOP VIEW)
SN74ABT126 PACKAGE (TOP VIEW)
description/ordering information
'ABT126 buffer gates feature independent line drivers with 3-state outputs. Each output disabled when associated output-enable (OE) input low. When between device high-impedance state during power power down. However, ensure high-impedance state above should tied through pulldown resistor; minimum value resistor determined current-sourcing capability driver. ORDERING INFORMATION
PACKAGE PDIP SOIC -40°C 85°C 40°C SSOP TSSOP -55°C 125°C 55°C CDIP Tape reel Tube Tube Tape reel Tape reel Tape reel Tube Tape reel Tube
LCCC Tube SNJ54ABT126FK SNJ54ABT126FK Package drawings, standard packing quantities, thermal data, symbolization, design guidelines available www.ti.com/sc/package.
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UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters. POST OFFICE 655303
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SN54ABT126, SN74ABT126 QUADRUPLE BUFFER GATES WITH 3-STATE OUTPUTS
FUNCTION TABLE (each buffer) INPUTS OUTPUT
logic diagram (positive logic)
numbers shown packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, -0.5 Input voltage range, (see Note -0.5 Voltage range applied output high power-off state, -0.5 Current into output state, SN54ABT126 SN74ABT126 Input clamp current, Output clamp current, Package thermal impedance, (see Note package 86°C/W (see Note package 96°C/W (see Note package 80°C/W (see Note package 76°C/W (see Note package 113°C/W (see Note package 47°C/W Storage temperature range, Tstg -65°C 150°C
Stresses beyond those listed under "absolute maximum ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated under "recommended operating conditions" implied. Exposure absolute-maximum-rated conditions extended periods affect device reliability. NOTES: input output negative-voltage ratings exceeded input output clamp-current ratings observed. package thermal impedance calculated accordance with JESD 51-7. package thermal impedance calculated accordance with JESD 51-5.
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SN54ABT126, SN74ABT126 QUADRUPLE BUFFER GATES WITH 3-STATE OUTPUTS
recommended operating conditions (see Note
SN54ABT126 t/VCC Supply voltage High-level input voltage Low-level input voltage Input voltage High-level output current Low-level output current Input transition rise fall rate Power-up ramp rate Operating free-air temperature SN74ABT126 UNIT ns/V µs/V
NOTE unused inputs device must held ensure proper device operation. Refer application report, Implications Slow Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER Vhys IOZPU IOZPD IOZH IOZL Ioff ICEX TEST CONDITIONS input Other inputs Outputs high Outputs high Outputs Outputs disabled Outputs enabled Outputs disabled -100 ±100 -200 -200 ±100 -200 0.55 0.55* 0.55 0.55 25°C -1.2 SN54ABT126 -1.2 SN74ABT126 -1.2 UNIT
products compliant MIL-PRF-38535, this parameter does apply. typical values between should less than equal ensure state. more than output should tested time, duration test should exceed second. This increase supply current each input that specified voltage level, rather than GND.
PRODUCT PREVIEW information concerns products formative design phase development. Characteristic data other specifications design goals. Texas Instruments reserves right change discontinue these products without notice.
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SN54ABT126, SN74ABT126 QUADRUPLE BUFFER GATES WITH 3-STATE OUTPUTS
switching characteristics over recommended ranges supply voltage operating free-air temperature (unless otherwise noted) (see Note Figure
PARAMETER tPLH tPHL tPZH tPZL tPHZ tPLZ FROM (INPUT) (OUTPUT) 25°C SN54ABT126 SN74ABT126 UNIT
NOTE Limits vary among suppliers.
PRODUCT PREVIEW information concerns products formative design phase development. Characteristic data other specifications design goals. Texas Instruments reserves right change discontinue these products without notice.
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SN54ABT126, SN74ABT126 QUADRUPLE BUFFER GATES WITH 3-STATE OUTPUTS
PARAMETER MEASUREMENT INFORMATION
Open TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Open
From Output Under Test (see Note
LOAD CIRCUIT Input VOLTAGE WAVEFORMS PULSE DURATION
Timing Input Data Input VOLTAGE WAVEFORMS SETUP HOLD TIMES Output Control tPZL Output Waveform (see Note tPZH Output Waveform Open (see Note tPLZ tPHZ VOLTAGE WAVEFORMS ENABLE DISABLE TIMES LOW- HIGH-LEVEL ENABLING
Input tPLH Output tPHL tPHL tPLH VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING NONINVERTING OUTPUTS
Output
NOTES: includes probe capacitance. Waveform output with internal conditions such that output except when disabled output control. Waveform output with internal conditions such that output high except when disabled output control. input pulses supplied generators having following characteristics: MHz, outputs measured time with transition measurement. parameters waveforms applicable devices.
Figure Load Circuit Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device SN74ABT126D SN74ABT126DBLE SN74ABT126DBR SN74ABT126DBRE4 SN74ABT126DE4 SN74ABT126DR SN74ABT126DRE4 SN74ABT126N SN74ABT126NE4 SN74ABT126NSR SN74ABT126NSRE4 SN74ABT126PW SN74ABT126PWE4 SN74ABT126PWLE SN74ABT126PWR SN74ABT126PWRE4 SN74ABT126RGYR SN74ABT126RGYRG4
Status ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type SOIC SSOP SSOP SSOP SOIC SOIC SOIC PDIP PDIP TSSOP TSSOP TSSOP TSSOP TSSOP
Package Drawing
Pins Package Plan Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br)
Lead/Ball Finish NIPDAU Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Call NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Call Level-1-260C-UNLIM Level-1-260C-UNLIM Level-2-260C-1YEAR Level-2-260C-1YEAR
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br) 1000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above.
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
(R-PDSO-G**)
PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65
0,30 0,19
0,10
0,15 4,50 4,30 6,60 6,20 Gage Plane 0,25 0,75 0,50
Seating Plane 1,20 0,15 0,05 0,10
PINS
3,10
5,10
5,10
6,60
7,90
9,80
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-153
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