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SMJ: Processing MIL-PRF-38535 Operating Temperature Ranges: Ident


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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
SMJ: Processing MIL-PRF-38535 Operating Temperature Ranges:
Identical External Data Address
Military -55°C 125°C Commercial -25°C 85°C Commercial 70°C Highest Performance Floating-Point Digital Signal Processor (DSP) C40-50: 40-ns Instruction Cycle Time: MFLOPS, MIPS, MOPS, MBps C40-40: 50-ns Instruction Cycle Time: MFLOPS, MIPS, MOPS, MBps Communications Ports 6-Channel Direct Memory Access (DMA) Coprocessor Single-Cycle Conversion From IEEE-745 Floating-Point Format Single Cycle 1/x, Source-Code Compatible With SMJ320C30 Validated Compiler Single-Cycle 40-Bit Floating-Point, 32-Bit Integer Multipliers 40-Bit Registers, Auxiliary Registers, Control Registers, Timers IEEE Standard 1149.1 Test-Access Port (JTAG)
Buses Supporting Shared Memory Systems High Data-Rate, Single-Cycle Transfers: High Port-Data Rate MBytes/s (Each Bus) 16G-Byte Continuous Program/Data/Peripheral Address Space Memory-Access Request Fast, Intelligent Arbitration Separate Address-, Data-, Control-Enable Pins Four Sets Memory-Control Signals Support Different Speed Memories Hardware Fabricated Using Enhanced Performance Implanted CMOS (EPIC) Technology Texas Instruments (TI) Separate Internal Program, Data, Coprocessor Buses Support Massive Concurrent Input/Output (I/O) Program Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance On-Chip Program Cache Dual-Access/Single-Cycle Increased Memory-Access Performance 512-Byte Instruction Cache Bytes Single-Cycle Dual-Access Program Data ROM-Based Bootloader Supports Program Bootup Using 16-, 32-Bit Memories Over Communications Ports
description
SMJ320C40KGD 32-bit, floating-point processor manufactured 0.72-µm, double-level metal CMOS technology. fourth generation DSPs from Texas Instruments, world's first designed parallel processing. on-chip parallel processing capabilities make floating-point performance required many applications achievable cost-effective. SMJ320C40 first with on-chip communication ports processor-to-processor communication using simple communication software with external hardware. This allows connectivity with external glue logic. communication ports remove bottlenecks, independent smart-DMA coprocessor able handle requirements.
Please aware that important notice concerning availability, standard warranty, critical applications Texas Instruments semiconductor products disclaimers thereto appears this data sheet. IEEE Standard 1149.1-1990 Standard Test-Access Port Boundary-Scan Architecture EPIC trademarks Texas Instruments Incorporated.
PRODUCTION DATA information current publication date. Products conform specifications terms Texas Instruments standard warranty. Production processing does necessarily include testing parameters. products compliant 38535, parameters tested unless otherwise noted. other products, production processing does necessarily include testing parameters.
Copyright 2004, Texas Instruments Incorporated
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
description (continued)
features communication ports are:
communication ports direct interprocessor communication processor MBps bidirectional interface each communication port high-speed low-cost multiprocessor
interface
Separate input output first-in, first-out (FIFO) buffers processor-to-processor
communication
Automatic arbitration handshaking direct processor-to-processor connection
coprocessor allows concurrent processing superior sustained performance. features coprocessor:
Link pointers that allow channels auto-initialize Parallel operation transfers channels support communication-port-to-memory data transfers
SMJ320C40KGD configured high-speed internal parallel processing. features are:
Eight operations cycles
32-bit floating-point integer multiply 40-/32-bit floating-point integer arithmetic logic unit (ALU) operation data accesses address-register updates
IEEE floating-point conversion Division square-root support assembly language compatibility Byte halfword accessibility
factors parallel-processing implementation development tools that available. supported host parallel-processing development tools developing simulating code debugging parallel-processing systems. code generation tools include:
Optimizing ANSI compiler with runtime library that supports communication ports SPOX, Spectron Microsystems Incorporated, which provides parallel processing support well
communication port drivers
Assembler linker with support mapping program data parallel processors.
SPOX trademark Spectron Microsystems, Inc.
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
description (continued)
simulation tools include:
Parallel system-level simulation, Logic Modeling Corporation (LMC), which includes hardware
verification (HV) model full functional (FF) model
software simulator with high-level language debugger interface simulating single processor
hardware development verification tools include:
Parallel processor in-circuit emulator high-level language debugger: XDS510 Parallel processor development system with four TMS320C40s, local global memory,
communication port connections additional information when designing cold temperature operation, please Texas Instruments application report 320C3x, 320C4x 320MCM42x Power-up Sensitivity Cold Temperature, literature number SGUA001.
known good technology
Known good (KGD) options offered multichip modules chip-on-board (COB) applications. There currently verification technology used support requirements SMJ320C40KGD: Chuck Probe.
electrical specifications
military electrical timing specifications, please refer SMJ320C40 Digital Signal Processor data sheet, literature number SGUS017. commercial electrical timing specifications, TMS320C40 Digital Signal Processor Data Sheet, literature number SPRS038.
XDS510 trademark Texas Instruments Incorporated.
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
PREFIX
MIL-PRF-38535 Processing Commercial Level
OPTION process blank REVISION Revision Revision SPEED RANGE TEMPERATURE RANGE (Military) -55°C 125°C (Commercial) 70°C PACKAGE TYPE Known Good
DEVICE FAMILY Family
TECHNOLOGY CMOS
DEVICE Floating-Point
Figure SMJ320C40KGD Device Nomenclature
JEDEC STANDARD
thickness approximately mils mil. Backside surface finish silicon. Maximum allowable junction operating temperature 175°C. Glassivation material compressive nitride. Bond metal composed copper-doped aluminum. Percent defective allowed burned-in Life test data available. Configuration control notification. Group attribute summary available (SMJ only). Suggested die-attach material silver glass (QMI 2569F). Suggested bond wire size 1.25 mil. rating Class Maximum allowable peak process temperature die-attach 440°C (for QMS2569F) kerf dependent blade size used. backside potential left floating.
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
320C40 (rev 7.0) known good information
Number Side Number
Side Number
Side Number
Designator
Zero-Zero (origin) Side Number
Figure 320C40 Numbering Format (See Table Table provides reference following:
signal identities relation numbers coordinates, where bond serves origin (0,0)
addition, following notes significant: coordinate data microns. active silicon dimensions 424.86 035.52 (489.16 mils 473.83 mils). size approximately 598.40 192.00 (496.00 mils 480.00 mils). Bond dimensions 108.00 108.00 (4.25 mils 4.25 mils). Center bond edge (without scribe) 107.80 (4.24 mils). R-Tab devices, gold bump dimensions approximately (3.62 mils 3.62 mils). Coordinate origin (0,0) (center bond 82).
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72
SIDE BOND LOCATIONS DIE/TAB BOND IDENTITY GDDVDD CVSS IVSS GDDVDD DVSS GDDVDD RDY1 DVSS CVSS 429.48 X-COORDINATE BOND Y-COORDINATE BOND 11368.44 11242.44 11116.44 10990.44 10864.44 10738.44 10612.44 10486.44 10360.44 10234.44 10108.44 9982.44 9856.44 9730.44 9604.44 9478.44 9352.44 9226.44 9100.44 8974.44 8848.44 8722.44 8596.44 8470.44 8344.44 8218.44 8092.44 7966.44 7840.44 7714.44 7588.44 7462.44 7336.44 7210.44 7084.44 6958.44 6832.44 6706.44 6550.02 6377.22 6225.12 6099.12 PITCH LEAD REFERENCES WHICH BOND PADS 126.00 126.00 126.00 126.00 126.00 126.00 126.00 126.00 126.00 126.00 (10, 126.00 (11, 126.00 (12, 126.00 (13, 126.00 (14, 126.00 (15, 126.00 (16, 126.00 (17, 126.00 (18, 126.00 (19, 126.00 (20, 126.00 (21, 126.00 (22, 126.00 (23, 126.00 (24, 126.00 (25, 126.00 (26, 126.00 (27, 126.00 (28, 126.00 (29, 126.00 (30, 126.00 (31, 126.00 (32, 126.00 (33, 126.00 (34, 126.00 (35, 126.00 (36, 126.00 (37, 156.42 (38, 172.80 (39, 152.10 (40, 126.00 (41, 126.00 (42,
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE (CONTINUED) BOND LOCATIONS DIE/TAB BOND IDENTITY LOCK VDDL VSSL RDY0 TRST EMU0 EMU1 DVSS DVDD PAGE1 STRB1 STAT0 STAT1 IVSS STAT2 STAT3 PAGE0 STRB0 RESETLOC DVDD RESETLOC RESET CRDY5 CSTRB5 CACK5 CREQ5 CRDY4 CSTRB4 CACK4 CREQ4 429.48 X-COORDINATE BOND Y-COORDINATE BOND 5973.12 5847.12 5721.12 5564.70 5391.90 5219.10 5046.30 4894.20 4737.78 4564.98 4392.18 4240.08 4114.08 3988.08 3962.08 3736.08 3610.08 3484.08 3358.08 3232.08 3106.08 2980.08 2854.08 2726.64 2600.64 2474.64 2318.22 2143.98 1991.88 1835.46 1662.66 1510.56 1384.56 1258.56 1132.56 1006.56 880.56 754.56 628.56 PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (43, 126.00 (44, 156.42 (45, 172.80 (46, 172.80 (47, 172.80 (48, 152.10 (49, 156.42 (50, 172.80 (51, 172.80 (52, 151.10 (53, 126.00 (54, 126.00 (55, 126.00 (56, 126.00 (57, 126.00 (58, 126.00 (59, 126.00 (60, 126.00 (61, 126.00 (62, 126.00 (63, 126.00 (64, 127.44 (65, 126.00 (66, 126.00 (67, 156.42 (68, 174.24 (69, 152.10 (70, 156.42 (71, 172.80 (72, 172.80 (73, 126.00 (74, 126.00 (75, 126.00 (76, 126.00 (77, 126.00 (78, 126.00 (79, 126.00 (80,
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE BOND LOCATIONS DIE/TAB BOND IDENTITY CVSS DVSS DVDD C5D7 C5D6 C5D5 C5D4 C5D3 C5D2 C5D1 C5D0 DVDD C4D7 C4D6 C4D5 C4D4 C4D3 C4D2 C4D1 C4D0 CVSS DVSS DVDD C3D7 C3D6 C3D5 C3D4 C3D3 C3D2 C3D1 C3D0 DVDD IVSS C2D7 C2D6 C2D5 C2D4 C2D3 C2D2 C2D1 C2D0 CVSS X-COORDINATE BOND 0.00 1062.00 1188.00 1314.00 1440.00 1566.00 1692.00 1818.00 1944.00 2070.00 2196.00 2322.00 2448.00 2574.00 2700.00 2813.40 2952.00 3078.00 3204.00 3330.00 3456.00 3582.00 3708.00 3834.00 3960.00 4086.00 4212.00 4338.00 4464.00 4590.00 4716.00 4842.00 4968.00 5094.00 5220.00 5346.00 5472.00 5598.00 5724.00 5850.00 5976.00 6102.00 0.00 Y-COORDINATE BOND PITCH LEAD REFERENCES WHICH BOND PADS 1062.00 (82, 126.00 (83, 126.00 (84, 126.00 (85, 126.00 (86, 126.00 (87, 126.00 (88, 126.00 (89, 126.00 (90, 126.00 (91, 126.00 (92, 126.00 (93, 126.00 (94, 126.00 (95, 126.00 (96, 126.00 (97, 126.00 (98, 126.00 (99, 100) 126.00 (100, 101) 126.00 (101, 102) 126.00 (102, 103) 126.00 (103, 104) 126.00 (104, 105) 126.00 (105, 106) 126.00 (106, 107) 126.00 (107, 108) 126.00 (108, 109) 126.00 (109, 110) 126.00 (110, 111) 126.00 (111, 112) 126.00 (112, 113) 126.00 (113, 114) 126.00 (114, 115) 126.00 (115, 116) 126.00 (116, 117) 126.00 (117, 118) 126.00 (118, 119) 126.00 (119, 120) 126.00 (120, 121) 126.00 (121, 122) 126.00 (122, 123) 126.00 (123, 124)
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE (CONTINUED) BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS DVDD CRDY3 CSTRB3 CACK3 CREQ3 VDDL VSSL CRDY2 CSTRB2 CACK2 CREQ2 DVDD CRDY1 CSTRB1 CACK1 CREQ1 CRDY0 CSTRB0 CACK0 CREQ0 CVSS DVSS IVSS DVDD C1D7 C1D6 C1D5 C1D4 C1D3 C1D2 C1D1 C1D0 DVDD C0D7 C0D6 C0D5 C0D4 C0D3 X-COORDINATE BOND 6228.00 6354.00 6480.00 6606.00 6732.00 6858.00 6984.00 7110.00 7236.00 7362.00 7488.00 7614.00 7740.00 7866.00 7992.00 8118.00 8244.00 8370.00 8496.00 8622.00 8748.00 8874.00 9000.00 9126.00 9252.00 9378.00 9504.00 9630.00 9756.00 9882.00 10008.00 10134.00 10260.00 10386.00 10512.00 10638.00 10764.00 10890.00 11016.00 0.00 Y-COORDINATE BOND PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (124, 125) 126.00 (125, 126) 126.00 (126, 127) 126.00 (127, 128) 126.00 (128, 129) 126.00 (129, 130) 126.00 (130, 131) 126.00 (131, 132) 126.00 (132, 133) 126.00 (133, 134) 126.00 (134, 135) 126.00 (135, 136) 126.00 (136, 137) 126.00 (137, 138) 126.00 (138, 139) 126.00 (139, 140) 126.00 (140, 141) 126.00 (141, 142) 126.00 (142, 143) 126.00 (143, 144) 126.00 (144, 145) 126.00 (145, 146) 126.00 (146, 147) 126.00 (147, 148) 126.00 (148, 149) 126.00 (149, 150) 126.00 (150, 151) 126.00 (151, 152) 126.00 (152, 153) 126.00 (153, 154) 126.00 (154, 155) 126.00 (155, 156) 126.00 (156, 157) 126.00 (157, 158) 126.00 (158, 159) 126.00 (159, 160) 126.00 (160, 161) 126.00 (161, 162)
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE BOND LOCATIONS DIE/TAB BOND IDENTITY C0D2 C0D1 C0D0 CVSS DVDD ROMEN IIOF0 DVSS IIOF1 IIOF2 IIOF3 LSTRB0 LPAGE0 LRDY0 LCE0 LSTRB1 DVDD CVSS LPAGE1 LRDY1 LCE1 TCLK0 TCLK1 IVSS LLOCK LSTAT0 LSTAT1 LSTAT2 LSTAT3 IACK VDDL VSSL CLKIN CVSS X-COORDINATE BOND Y-COORDINATE BOND 810.00 936.00 1062.00 1188.00 1314.00 1470.42 1622.88 1748.88 1874.88 2000.88 2126.88 2283.30 2435.40 2561.40 2687.40 2843.82 3016.62 3168.72 3294.72 3420.72 11779.74 3546.72 3672.72 3829.14 4001.94 4174.74 4326.84 4452.84 4578.84 4704.84 4861.26 5013.36 5139.36 5265.36 5391.36 5517.36 5643.36 5770.80 5896.80 6022.80 6154.74 6326.28 6494.40 PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (163, 164) 126.00 (164, 165) 126.00 (165, 166) 126.00 (166, 167) 156.42 (167, 168) 152.46 (168, 169) 126.00 (169, 170) 126.00 (170, 171) 126.00 (171, 172) 126.00 (172, 173) 156.42 (173, 174) 152.10 (174, 175) 126.00 (175, 176) 126.00 (176, 177) 156.42 (177, 178) 172.80 (178, 179) 152.10 (179, 180) 126.00 (180, 181) 126.00 (181, 182) 126.00 (182, 183) 126.00 (183, 184) 156.42 (184, 185) 172.80 (185, 186) 172.80 (186, 187) 152.10 (187, 188) 126.00 (188, 189) 126.00 (189, 190) 126.00 (190, 191) 156.42 (191, 192) 152.10 (192, 193) 126.00 (193, 194) 126.00 (194, 195) 126.00 (195, 196) 126.00 (196, 197) 126.00 (197, 198) 127.44 (198, 199) 126.00 (199, 200) 126.00 (200, 201) 131.94 (201, 202) 171.58 (202, 203) 168.12 (203, 204) 126.00 (204, 205)
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE (CONTINUED) BOND LOCATIONS DIE/TAB BOND IDENTITY DVDD DVSS LA30 LA29 LA28 LA27 LADVDD LA26 LA25 LA24 LA23 LA22 LA21 LA20 LA19 LA18 LA17 LA16 LADVDD CVSS DVSS LA15 LA14 LA13 LA12 LA11 LA10 LADVDD DVSS 11779.74 X-COORDINATE BOND Y-COORDINATE BOND 6620.40 6746.40 6873.84 6999.84 7125.84 7251.84 7377.84 7503.84 7629.84 7755.84 7881.84 8007.84 8133.84 8259.84 8385.84 8511.84 8637.84 8763.84 8889.84 9015.84 9141.84 9267.84 9393.84 9519.84 9645.84 9771.84 9897.84 10023.84 10149.84 10275.84 10401.84 10527.84 10653.84 10779.84 10905.84 11031.84 11157.84 11283.84 11489.76 PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (205, 206) 127.44 (206, 207) 126.00 (207, 208) 126.00 (208, 209) 126.00 (209, 210) 126.00 (210, 211) 126.00 (211, 212) 126.00 (212, 213) 126.00 (213, 214) 126.00 (214, 215) 126.00 (215, 216) 126.00 (216, 217) 126.00 (217, 218) 126.00 (218, 219) 126.00 (219, 220) 126.00 (220, 221) 126.00 (221, 222) 126.00 (222, 223) 126.00 (223, 224) 126.00 (224, 225) 126.00 (225, 226) 126.00 (226, 227) 126.00 (227, 228) 126.00 (228, 229) 126.00 (229, 230) 126.00 (230, 231) 126.00 (231, 232) 126.00 (232, 233) 126.00 (233, 234) 126.00 (234, 235) 126.00 (235, 236) 126.00 (236, 237) 126.00 (237, 238) 126.00 (238, 239) 126.00 (239, 240) 126.00 (240, 241) 126.00 (241, 242) 205.92 (242, 243)
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE BOND LOCATIONS DIE/TAB BOND IDENTITY CVSS LD31 LD30 LD29 LD28 LDDVDD LD27 LD26 LD25 LD24 LD23 LD22 LD21 LD20 LD19 LD18 LD17 LDDVDD CVSS DVSS IVSS LD16 LD15 LD14 LD13 LD12 LD11 LD10 LDDVDD VDDL VSSL CVSS X-COORDINATE BOND 10953.72 10827.72 10701.72 10575.72 10449.72 10323.72 10197.72 10071.72 9945.72 9819.72 9693.72 9567.72 9441.72 9315.72 9189.72 9063.72 8937.72 8811.72 8685.72 8559.72 8433.72 8307.72 8181.72 8055.72 7929.72 7803.72 7677.72 7551.72 7425.72 7299.72 7173.72 7047.72 6921.72 6795.72 6669.72 6543.72 6417.72 6291.72 6165.72 6038.10 5912.10 5786.10 11819.88 Y-COORDINATE BOND PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (244, 245) 126.00 (245, 246) 126.00 (246, 247) 126.00 (247, 248) 126.00 (248, 249) 126.00 (249, 250) 126.00 (250, 251) 126.00 (251, 252) 126.00 (252, 253) 126.00 (253, 254) 126.00 (254, 255) 126.00 (255, 256) 126.00 (256, 257) 126.00 (257, 258) 126.00 (258, 259) 126.00 (259, 260) 126.00 (260, 261) 126.00 (261, 262) 126.00 (262, 263) 126.00 (263, 264) 126.00 (264, 265) 126.00 (265, 266) 126.00 (266, 267) 126.00 (267, 268) 126.00 (268, 269) 126.00 (269, 270) 126.00 (270, 271) 126.00 (271, 272) 126.00 (272, 273) 126.00 (273, 274) 126.00 (274, 275) 126.00 (275, 276) 126.00 (276, 277) 126.00 (277, 278) 126.00 (278, 279) 126.00 (279, 280) 126.00 (280, 281) 126.00 (281, 282) 127.62 (282, 283) 126.00 (283, 284) 126.00 (284, 285) 126.00 (285, 286)
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SMJ320C40KGDD FLOATING POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES
Table 320C40 Lead Information Rev. (0,72 (Continued)
SIDE (CONTINUED) BOND LOCATIONS DIE/TAB BOND IDENTITY DVSS GADVDD GADVDD CVSS DVSS GADVDD CVSS DVSS SUBS X-COORDINATE BOND 5660.10 5534.10 5408.10 5282.10 5156.10 5030.10 4904.10 4778.10 4652.10 4526.10 4400.10 4274.10 4148.10 4022.10 3896.10 3770.10 3644.10 3518.10 3392.10 3266.10 3140.10 3014.10 2888.10 2762.10 2636.10 2510.10 2384.10 2258.10 2132.10 2006.10 1880.10 1754.10 1628.10 1502.10 1376.10 1250.10 1124.10 998.10 440.10 189.90 11819.88 Y-COORDINATE BOND PITCH LEAD REFERENCES WHICH BOND PADS 126.00 (286, 287) 126.00 (287, 288) 126.00 (288, 289) 126.00 (289, 290) 126.00 (290, 291) 126.00 (291, 292) 126.00 (292, 293) 126.00 (293, 294) 126.00 (294, 295) 126.00 (295, 296) 126.00 (296, 297) 126.00 (297, 298) 126.00 (298, 299) 126.00 (299, 300) 126.00 (300, 301) 126.00 (301, 302) 126.00 (302, 303) 126.00 (303, 304) 126.00 (304, 305) 126.00 (305, 306) 126.00 (306, 307) 126.00 (307, 308) 126.00 (308, 309) 126.00 (309, 310) 126.00 (310, 311) 126.00 (311, 312) 126.00 (312, 313) 126.00 (313, 314) 126.00 (314, 315) 126.00 (315, 316) 126.00 (316, 317) 126.00 (317, 318) 126.00 (318, 319) 126.00 (319, 320) 126.00 (320, 321) 126.00 (321, 322) 126.00 (322, 323) 558.00 (323, 324) 630.00 (324, 325)
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-9466903Q9D SMJ320C40KGDM40D SMJ320C40KGDM50D
Status ACTIVE ACTIVE ACTIVE
Package Type XCEPT XCEPT XCEPT
Package Drawing
Pins Package Plan
Lead/Ball Finish Call Call Call
Peak Temp Type Type Type
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
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