This data sheet applicable CD54/74AC240, CD54ACT240, CD54/74ACT241. CD

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This data sheet applicable CD54/74AC240, CD54ACT240, CD54/74ACT241. CD

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CD54/74AC240, CD54/74AC241, CD54/74AC244 CD54/74ACT240, CD54/74ACT241, CD54/74ACT244 3-state octal buffer/line drivers ADVANCED CMOS technology. CD54/74AC/ACT240 CD54/74AC/ACT244 have active-LOW output enables (1OE, 2OE). CD54/74AC/ACT241 active-LOW (1OE) active-HIGH (2OE) output enable. CD74AC240 CD74ACT240 supplied 20-lead dual-in-line plastic packages suffix) 20-lead small-outline packages suffixes). CD74AC241 supplied 20-lead dual-in-line plastic packages suffix) CD74ACT241 supplied 20-lead dual-in-line plastic packages suffix) 20-lead small-outline packages (M96 suffix). CD74AC244 CD74ACT244 supplied 20-lead dual-in-line plastic packages suffix), 20-lead small-outline packages suffixes), 20-lead shrink small-outline packages (SM96 suffix). These package types operable over following temperature ranges: Commerical 705C); Industrial (-40 +855C); Extended Industrial/Military (-55 1255C). CD54AC240 CD54AC244 CD54ACT240, CD54ACT241, CD54ACT244 supplied 20-lead hermetic dual-in-line ceramic packages (F3A suffix) operable over +1255C temperature range.
This data sheet applicable CD54/74AC240, CD54ACT240, CD54/74ACT241. CD54/74AC241 were acquired from Harris Semiconductor. SCHS244 information CD74ACT240, CD74AC244, CD74ACT244. Copyright 2004, Texas Instruments Incorporated
+85°C (Package Type +70°C (Package Type +85°C (Package Type Derate Linearly mW/°C OPERATING-TEMPERATURE RANGE (TA): CD54 .-55 +125°C CD74 +85°C STORAGE TEMPERATURE (Tstg) +150°C LEAD TEMPERATURE (DURING SOLDERING): distance 1/16 1/32 (1.59 0.79 from case maximum. .+265°C Unit inserted into board min. thickness 1/16 (1.59 with solder contacting lead tips only. .+300°C
outputs device: each additional output.
CHARACTERISTIC MIN. Supply-Voltage Range, VCC*: (For Full Package-Temperature Range) Types Types Input Output Voltage, Operating Temperature, Input Rise Fall Slew Rate, dt/dv Types) Types) (ACT Types)
Unless otherwise specified, voltages referenced ground.
LIMITS MAX. UNITS
CD54 CD74
+125
ns/V ns/V ns/V
PACKAGE OPTION ADDENDUM
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12-Jan-2006
PACKAGING INFORMATION
Orderable Device CD54AC240F3A CD54AC244F3A CD54ACT240F3A CD54ACT241F3A CD54ACT244F3A CD74AC240E CD74AC240EE4 CD74AC240M CD74AC240M96 CD74AC240M96E4 CD74AC240ME4 CD74AC244E CD74AC244EE4 CD74AC244M CD74AC244M96 CD74AC244M96E4 CD74AC244ME4 CD74AC244SM CD74AC244SM96 CD74AC244SM96E4 CD74ACT240E CD74ACT240EE4 CD74ACT240M CD74ACT240M96 CD74ACT240M96E4 CD74ACT240ME4 CD74ACT241E Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP CDIP CDIP PDIP PDIP SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SSOP SSOP SSOP PDIP PDIP SOIC SOIC SOIC SOIC PDIP Package Drawing Pins Package Plan Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br) Lead/Ball Finish Call Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU Peak Temp Type Type Type Type Type Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS)
Addendum-Page
PACKAGE OPTION ADDENDUM
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12-Jan-2006
Orderable Device CD74ACT241EE4 CD74ACT241M96 CD74ACT241M96E4 CD74ACT244E CD74ACT244EE4 CD74ACT244M CD74ACT244M96 CD74ACT244M96E4 CD74ACT244ME4 CD74ACT244SM CD74ACT244SM96 CD74ACT244SM96E4
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE
Package Type PDIP SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SSOP SSOP SSOP
Package Drawing
Pins Package Plan Pb-Free (RoHS)
Lead/Ball Finish NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Type Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br) 2000 Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes. Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold
Addendum-Page
PACKAGE OPTION ADDENDUM
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12-Jan-2006
Customer annual basis.
Addendum-Page
MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
(R-PDSO-G**)
PINS SHOWN 0,65 0,38 0,22 0,15
PLASTIC SMALL-OUTLINE
0,25 0,09 5,60 5,00 8,20 7,40
Gage Plane 0,25 0,95 0,55
Seating Plane 2,00 0,05 0,10
PINS
6,50
6,50
7,50
8,50
10,50
10,50
12,90
5,90
5,90
6,90
7,90
9,90
9,90
12,30 4040065 12/01
NOTES:
linear dimensions millimeters. This drawing subject change without notice. Body dimensions include mold flash protrusion exceed 0,15. Falls within JEDEC MO-150
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This data sheet applicable CD54/74AC240, CD54ACT240, CD54/74ACT241. CD

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