High-Speed CMOS Logic 8-Input Multiplexer, Three-State Descriptio

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High-Speed CMOS Logic 8-Input Multiplexer, Three-State Descriptio

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CD54HC251, CD74HC251, CD54HCT251, CD74HCT251
High-Speed CMOS Logic 8-Input Multiplexer, Three-State
Description
'HC251 'HCT251 8-channel digital multiplexers with three-state outputs, fabricated with high-speed silicongate CMOS technology. Together with power consumption standard CMOS integrated circuits, they possess ability drive LSTTL loads. three-state feature makes them ideally suited interfacing with lines bus-oriented system. This multiplexer features both true complement outputs well output enable (OE) input. must logic level enable this device. When input high, both outputs high-impedance state. When enabled, address information data select inputs determines which data input routed outputs. 'HCT251 logic family speed, function, pin-compatible with standard 'LS251.
Features
Selects Eight Binary Data Inputs
/Title (CD74 HC251 CD74 HCT25 /Subject (High Speed CMOS Logic 8-Input Multiplexer; Three-
Three-State Output Capability True Complement Outputs Typical (Data Output) Propagation Delay 14ns 15pF, 25oC Fanout (Over Temperature Range) Standard Outputs LSTTL Loads Driver Outputs LSTTL Loads Wide Operating Temperature Range -55oC 125oC Balanced Propagation Delay Transition Times Significant Power Reduction Compared LSTTL Logic Alternate Source Philips Types Operation High Noise Immunity: 30%, Types 4.5V 5.5V Operation Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), (Min) CMOS Input Compatibility, VOL,
Ordering Information
PART NUMBER CD54HC251F3A CD54HCT251F3A CD74HC251E CD74HC251M CD74HC251MT CD74HC251M96 TEMP. RANGE (oC) PACKAGE CERDIP CERDIP PDIP SOIC SOIC SOIC PDIP SOIC SOIC SOIC
Pinout
CD54HC251, CD54HCT251 (CERDIP) CD74HC251, CD74HCT251 (PDIP, SOIC) VIEW
CD74HCT251E CD74HCT251M CD74HCT251MT CD74HCT251M96
NOTE: When ordering, entire part number. suffix denotes tape reel. suffix denotes small-quantity reel 250.
CAUTION: These devices sensitive electrostatic discharge. Users should follow proper Handling Procedures. Copyright
2003, Texas Instruments Incorporated
CD54HC251, CD74HC251, CD54HCT251, CD74HCT251 Functional Diagram
CHANNEL INPUTS OUTPUTS
DATA SELECT
TRUTH TABLE INPUTS SELECT OUTPUT CONTROL OUTPUT
High Voltage Level, Voltage Level, Don't Care, High Impedance (Off), I1.I7 level respective input.
CD54HC251, CD74HC251, CD54HCT251, CD74HCT251
Absolute Maximum Ratings
Supply Voltage, -0.5V Input Diode Current, -0.5V 0.5V .±20mA Output Diode Current, -0.5V 0.5V .±20mA Drain Current, Output, -0.5V +0.5V .±25mA Output Source Sink Current Output Pin, -0.5V 0.5V .±25mA Ground Current, .±50mA
Thermal Information
Thermal Resistance (Typical, Note (oC/W) (PDIP) Package (SOIC) Package. Maximum Junction Temperature 150oC Maximum Storage Temperature Range .-65oC 150oC Maximum Lead Temperature (Soldering 10s) 300oC (SOIC Lead Tips Only)
Operating Conditions
Temperature Range (TA) -55oC 125oC Supply Voltage Range, Types Types .4.5V 5.5V Input Output Voltage, Input Rise Fall Time 1000ns (Max) 4.5V. 500ns (Max) 400ns (Max)
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
NOTE: package thermal impedance calculated accordance with JESD 51-7.
Electrical Specifications
TEST CONDITIONS PARAMETER TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads -0.02 -0.02 -0.02 High Level Output Voltage Loads -5.2 Level Output Voltage CMOS Loads 0.02 0.02 0.02 Level Output Voltage Loads 3.15 3.98 5.48 1.35 0.26 0.26 3.15 3.84 5.34 1.35 0.33 0.33 3.15 1.35 SYMBOL (mA) 25oC -40oC 85oC -55oC 125oC UNITS
CD54HC251, CD74HC251, CD54HCT251, CD74HCT251
Electrical Specifications
(Continued) TEST CONDITIONS PARAMETER Input Leakage Current Quiescent Device Current Three-State Leakage Current TYPES High Level Input Voltage Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage Loads Level Output Voltage CMOS Loads Level Output Voltage Loads Input Leakage Current Quiescent Device Current Three-State Leakage Current Additional Quiescent Device Current Input Pin: Unit Load NOTE: dual-supply systems theoretical worst case 2.4V, 5.5V) specification 1.8mA. -0.02 SYMBOL (mA) 25oC ±0.1 ±0.5 -40oC 85oC -55oC 125oC ±5.0 UNITS
3.98
3.84
0.02
0.26
0.33
±0.1 ±0.5
±5.0
(Note
-2.1
Input Loading Table
INPUT UNIT LOADS 0.55 2.65
NOTE: Unit Load limit specified Electrical Table, e.g., 360µA 25oC.
CD54HC251, CD74HC251, CD54HCT251, CD74HCT251
Switching Specifications Input
TEST CONDITIONS 25oC -40oC 85oC -55oC 125oC UNITS
PARAMETER TYPES Propagation Delay Select Outputs
SYMBOL
tPLH, tPHL 50pF
=15pF 50pF Data Outputs tPLH, tPHL 50pF
=15pF 50pF Enable High Enable from High tPLH, tPHL 50pF
=15pF 50pF Output Transition Time tTLH, tTHL 50pF
Input Capacitance Three-State Output Capacitance Power Dissipation Capacitance (Notes TYPES Propagation Delay Select Outputs
tPLH, tPHL 50pF =15pF
Data Outputs
tPLH, tPHL 50pF =15pF
Enable High Enable tPLH, tPHL 50pF from High =15pF Output Transition Time Input Capacitance Power Dissipation Capacitance (Notes NOTES: tTLH, tTHL 50pF
used determine dynamic power consumption, package. VCC2 (CPD where input frequency, output load capacitance, supply voltage.
CD54HC251, CD74HC251, CD54HCT251, CD74HCT251 Test Circuits Waveforms
INPUT tTLH tPHL tPLH INPUT tTHL 2.7V 1.3V 0.3V tTLH INVERTING OUTPUT tPHL tPLH 1.3V
tTHL
INVERTING OUTPUT
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
OUTPUT DISABLE tPZL tPHZ OUTPUT HIGH OUTPUTS ENABLED OUTPUTS DISABLED OUTPUTS ENABLED tPZH
FIGURE TRANSITION TIMES PROPAGATION DELAY TIMES, COMBINATION LOGIC
OUTPUT DISABLE tPLZ OUTPUT tPHZ OUTPUT HIGH OUTPUTS ENABLED tPZL
tPLZ OUTPUT
tPZH
1.3V
1.3V OUTPUTS DISABLED OUTPUTS ENABLED
FIGURE THREE-STATE PROPAGATION DELAY WAVEFORM
FIGURE THREE-STATE PROPAGATION DELAY WAVEFORM
OTHER INPUTS TIED HIGH OUTPUT DISABLE
WITH THREESTATE OUTPUT
OUTPUT 50pF
tPLZ tPZL tPHZ tPZH
NOTE: Open drain waveforms tPLZ tPZL same those three-state shown left. test circuit Output VCC, 50pF. FIGURE THREE-STATE PROPAGATION DELAY TEST CIRCUIT
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
PACKAGING INFORMATION
Orderable Device 5962-9052401MEA CD54HC251F CD54HC251F3A CD54HCT251F3A CD74HC251E CD74HC251EE4 CD74HC251M CD74HC251M96 CD74HC251M96E4 CD74HC251ME4 CD74HC251MT CD74HC251MTE4 CD74HCT251E CD74HCT251EE4 CD74HCT251M CD74HCT251M96 CD74HCT251M96E4 CD74HCT251ME4 CD74HCT251MT CD74HCT251MTE4
Status ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type CDIP CDIP CDIP CDIP PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC
Package Drawing
Pins Package Plan Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
Lead/Ball Finish Call Call Call Call NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU NIPDAU
Peak Temp Type Type Type Type Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Type Type Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM Level-1-260C-UNLIM
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS Sb/Br)
2500 Green (RoHS Sb/Br) 2500 Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br) Green (RoHS Sb/Br)
marketing status values defined follows: ACTIVE: Product device recommended designs. LIFEBUY: announced that device will discontinued, lifetime-buy period effect. NRND: recommended designs. Device production support existing customers, does recommend using this part design. PREVIEW: Device been announced production. Samples available. OBSOLETE: discontinued production device.
Plan planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), Green (RoHS Sb/Br) please check latest availability information additional product content details. TBD: Pb-Free/Green conversion plan been defined. Pb-Free (RoHS): TI's terms "Lead-Free" "Pb-Free" mean semiconductor products that compatible with current RoHS requirements substances, including requirement that lead exceed 0.1% weight homogeneous materials. Where designed soldered high temperatures, Pb-Free products suitable specified lead-free processes.
Addendum-Page
PACKAGE OPTION ADDENDUM
www.ti.com
12-Jan-2006
Pb-Free (RoHS Exempt): This component RoHS exemption either lead-based flip-chip solder bumps used between package, lead-based adhesive used between leadframe. component otherwise considered Pb-Free (RoHS compatible) defined above. Green (RoHS Sb/Br): defines "Green" mean Pb-Free (RoHS compatible), free Bromine (Br) Antimony (Sb) based flame retardants exceed 0.1% weight homogeneous material)
MSL, Peak Temp. Moisture Sensitivity Level rating according JEDEC industry standard classifications, peak solder temperature. Important Information Disclaimer:The information provided this page represents TI's knowledge belief date that provided. bases knowledge belief information provided third parties, makes representation warranty accuracy such information. Efforts underway better integrate information from third parties. taken continues take reasonable steps provide representative accurate information have conducted destructive testing chemical analysis incoming materials chemicals. suppliers consider certain information proprietary, thus numbers other limited information available release. event shall TI's liability arising such information exceed total purchase price part(s) issue this document sold Customer annual basis.
Addendum-Page
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High-Speed CMOS Logic 8-Input Multiplexer, Three-State Descriptio

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