74HC/HCT583 4-bit full adder with fast carry Product specificatio

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74HC/HCT583 4-bit full adder with fast carry Product specificatio

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IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications IC06 74HC/HCT/HCU/HCMOS Logic Package Information IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT583 4-bit full adder with fast carry
Product specification Supersedes data December 1990 File under Integrated Circuits, IC06 1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
FEATURES Adds decimal numbers Full internal look-ahead Fast ripple carry economical expansion Output capability: standard driver category: GENERAL DESCRIPTION 74HC/HCT583 high-speed Si-gate CMOS devices compatible with power Schottky (LSTTL). They specified compliance with JECEC standard 74HC/HCT583 high-speed 4-bit full adders with internal carry look-ahead. They accept 4-bit decimal numbers carry input (CIN). QUICK REFERENCE DATA Tamb=
74HC/HCT583
"583" generates decimal outputs carry output (Cn+4) greater than addition numbers produce number greater than valid number carry will result. input values larger than number converted from binary BCD. Binary conversion occurs grounding inputs, applying 4-bit binary number other inputs. input between number occurs output. binary input falls between carry term generated. Both carry term equivalent binary input. Converting binary numbers greater than achieved cascading "583s". "283" binary version.
TYPICAL SYMBOL tPHL/ tPLH PARAMETER propagation delay Cn+4 Cn+4 Notes used determine dynamic power dissipation µW): VCC2 VCC2 where: input frequency output frequency VCC2 outputs output load capacitance supply voltage condition condition input capacitance power dissipation capacitance package notes CONDITIONS UNIT
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
ORDERING INFORMATION TYPE NUMBER 74HC583 74HC583 74HCT583 74HCT583 PACKAGE NAME DIP16 SO16 DIP16 SO16 DESCRIPTION plastic dual in-line package; leads (300 mil); long body plastic small outline package; leads; body width plastic dual in-line package; leads (300 mil); long body plastic small outline package; leads; body width
74HC/HCT583
VERSION SOT38-1 SOT109-1 SOT38-1 SOT109-1
DESCRIPTION SYMBOL Cn+4 NAME FUNCTION carry input carry output ground outputs operand inputs operand inputs positive supply voltage
handbook, halfpage
MGM851
Fig.1 configuration.
handbook, halfpage
handbook, halfpage
(BCD)
MGM852
MGM853
Fig.2 Logic symbol.
Fig.3 logic symbol.
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
74HC/HCT583
handbook, halfpage
MGM854
Fig.4 Functional diagram.
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
74HC/HCT583
handbook, full pagewidth
MGM856
Fig.5 Logic diagram.
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
CHARACTERISTICS 74HC characteristics "74HC/HCT/HCU/HCMOS Logic Family Specifications". Output capability: standard category: CHARACTERISTICS 74HC Tamb (°C) 74HC SYMBOL PARAMETER
min. typ. max.
74HC/HCT583
TEST CONDITIONS UNIT WAVEFORMS Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6
min. max.
+125
min. max.
tPHL/ tPLH
propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay Cn+4 propagation delay Cn+4
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
tPHL/ tPLH
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
74HC/HCT583
Tamb (°C) 74HC SYMBOL PARAMETER
min. typ. max.
TEST CONDITIONS WAVEFORMS UNIT Fig.6 Fig.6
min. max.
+125
min. max.
tPHL/ tPLH
propagation delay Cn+4 output transition time standard outputs
tTHL/ tTLH
CHARACTERISTICS 74HCT characteristics "74HC/HCT/HCU/HCMOS Logic Family Specifications". Output capability: standard category: Note types value additional quiescent supply current (ICC) unit load given family specifications. determine input, multiply this value unit load coefficient shown table below.
INPUT
UNIT LOAD COEFFICIENT
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
CHARACTERISTICS 74HCT Tamb (°C) 74HCT SYMBOL PARAMETER
min. typ. max.
74HC/HCT583
TEST CONDITIONS UNIT WAVEFORMS Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6 Fig.6
min. max.
+125
min. max.
tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tPHL/ tPLH tTHL/ tTLH
propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay propagation delay Cn+4 propagation delay Cn+4 propagation delay Cn+4 output transition time standard outputs
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
WAVEFORMS
74HC/HCT583
book, full pagewidth
CIN, INPUT
VM(1)
tPHL OUTPUT tTHL
tPLH
VM(1)
tTLH
MGM855
50%; VCC. HCT:
Fig.6
Waveforms showing inputs (CIN, outputs Cn+4) propagation delays output transition times.
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
PACKAGE OUTLINES DIP16: plastic dual in-line package; leads (300 mil); long body
74HC/HCT583
SOT38-1
seating plane
index
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches max. 0.19 min. 0.51 0.020 max. 0.15 1.40 1.14 0.055 0.045 0.53 0.38 0.021 0.015 0.32 0.23 0.013 0.009 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 2.54 0.10 7.62 0.30 0.15 0.13 8.25 7.80 0.32 0.31 0.37 0.33 0.254 0.01 max. 0.087
Note Plastic metal protrusions 0.25 maximum side included. OUTLINE VERSION SOT38-1 REFERENCES 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
74HC/HCT583
SO16: plastic small outline package; leads; body width
SOT109-1
index detail
scale
DIMENSIONS (inch dimensions derived from original dimensions) UNIT inches max. 1.75 0.069 0.25 0.10 1.45 1.25 0.25 0.01 0.49 0.36 0.25 0.19 10.0 0.16 0.15 1.27 0.050 1.05 0.039 0.016 0.028 0.020 0.25 0.01 0.25 0.01 0.004 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
Note Plastic metal protrusions 0.15 maximum side included. OUTLINE VERSION SOT109-1 REFERENCES 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
SOLDERING Introduction There soldering method that ideal packages. Wave soldering often preferred when through-hole surface mounted components mixed printed-circuit board. However, wave soldering always suitable surface mounted ICs, printed-circuits with high population densities. these situations reflow soldering often used. This text gives very brief insight complex technology. more in-depth account soldering found "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 90011). SOLDERING DIPPING WAVE maximum permissible temperature solder solder this temperature must contact with joint more than seconds. total contact time successive solder waves must exceed seconds. device mounted seating plane, temperature plastic body must exceed specified maximum storage temperature (Tstg max). printed-circuit board been pre-heated, forced cooling necessary immediately after soldering keep temperature within permissible limit. REPAIRING SOLDERED JOINTS Apply voltage soldering iron (less than lead(s) package, below seating plane more than above temperature soldering iron less than remain contact seconds. temperature between contact seconds. REFLOW SOLDERING Reflow soldering techniques suitable packages. Reflow soldering requires solder paste suspension fine solder particles, flux binding agent) applied printed-circuit board screen printing, stencilling pressure-syringe dispensing before package placement.
74HC/HCT583
Several techniques exist reflowing; example, thermal conduction heated belt. Dwell times vary between seconds depending heating method. Typical reflow temperatures range from Preheating necessary paste evaporate binding agent. Preheating duration: minutes WAVE SOLDERING Wave soldering techniques used packages following conditions observed: double-wave turbulent wave with high upward pressure followed smooth laminar wave) soldering technique should used. longitudinal axis package footprint must parallel solder flow. package footprint must incorporate solder thieves downstream end. During placement before soldering, package must fixed with droplet adhesive. adhesive applied screen printing, transfer syringe dispensing. package soldered after adhesive cured. Maximum permissible solder temperature maximum duration package immersion solder seconds, cooled less than within seconds. Typical dwell time seconds mildly-activated flux will eliminate need removal corrosive residues most applications. REPAIRING SOLDERED JOINTS component first soldering diagonallyopposite leads. only voltage soldering iron (less than applied flat part lead. Contact time must limited seconds When using dedicated tool, other leads soldered operation within seconds between
1998
Philips Semiconductors
Product specification
4-bit full adder with fast carry
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
74HC/HCT583
This data sheet contains target goal specifications product development. This data sheet contains preliminary data; supplementary data published later. This data sheet contains final product specifications.
Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. LIFE SUPPORT APPLICATIONS These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
1998

74HC/HCT583 4-bit full adder with fast carry Product specificatio

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