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µPA1700A DESCRIPTION This product N-Channel Field Effect Tra
Top Searches for this datasheetFIELD EFFECT POWER TRANSISTORS µPA1700A DESCRIPTION This product N-Channel Field Effect Transistor designed DC/DC converters power management notebook computers. PACKAGE DIMENSIONS millimeter) FEATURES On-Resistance RDS(on)1 Max. (VGS RDS(on)2 Max. (VGS Input Capacitance 1.44 MAX. 5.37 MAX. +0.10 -0.05 Source Gate Drain ±0.3 Ciss Typ. Built-in Protection Diode Small Surface Mount Package (Power SOP8) 0.15 0.05 MIN. ±0.2 0.10 1.27 0.78 MAX. 0.40 +0.10 -0.05 0.12 ABSOLUTE MAXIMUM RATINGS terminals connected) Drain Source Voltage Gate Source Voltage Drain Current (DC) Drain Current (pulse)Note °C)Note Total Power Dissipation Channel Temperature Storage Temperature Notes Duty Cycle Mounted ceramic substrate 1200 diode connected between gate source transistor serves protector against ESD. When this device acutally used, additional protection circuit externally required voltage exceeding rated voltage applied this device. VDSS VGSS ID(DC) ID(pulse) Tstg ±7.0 +150 Gate Gate Protection Source Diode Body Diode Drain information this document subject change without notice. Document G12008EJ1V0DS00 (1st edition) Date Published April 1997 Printed Japan 1996 µPA1700A ELECTRICAL CHARACTERISTICS terminals connected) CHARACTERISTICS Drain Source On-state Resistance SYMBOL RDS(on)1 RDS(on)2 Gate Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS(off) |yfs| IDSS IGSS Ciss Coss Crss td(on) td(off) VF(S-D) di/dt A/µs TEST CONDITIONS VGS(on) 0.79 MIN. TYP. MAX. UNIT Test Circuit Switching Time Test Circuit Gate Charge D.U.T. Wave Form D.U.T. VGS(on) Wave Form Duty Cycle td(on) td(off) toff µPA1700A DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA Percentage Rated Power Total Power Dissipation TOTAL POWER DISSIPATION AMBIENT TEMPERATURE Mounted ceramic substrate 1200 Ambient Temperature Ambient Temperature FORWARD BIAS SAFE OPERATING AREA ID(pulse) Note Mounted ceramic substrate 1200 Drain Current ID(DC) Single Pulse Drain Source Voltage TRANSIENT THERMAL RESISTANCE PULSE WIDTH rth(t) Transient Thermal Resistance °C/W Mounted ceramic substrate 1200 Single Single Pulse Pulse Channel Ambient 1000 0.01 0.001 Pulse Width µPA1700A FORWARD TRANSFER CHARACTERISTICS Pulsed Drain Current Drain Current DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed Gate Source Voltage Drain Source Voltage Forward Transfer Admittance RDS(on) Drain Source On-State Resistance FORWARD TRANSFER ADMITTANCE DRAIN CURRENT Pulsed DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed Drain Current Gate Source Voltage RDS(on) Drain Source On-State Resistance DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT VGS(off) Gate Source Cutoff Voltage Pulsed Drain Current VGS=10 GATE SOURCE CUTOFF VOLTAGE CHANNEL TEMPERATURE Channel Temperature µPA1700A RDS(on) Drain Source On-State Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed Diode Forward Current Channel Temperature Source Drain Voltage CAPACITANCE DRAIN SOURCE VOLTAGE SWITCHING CHARACTERISTICS Ciss, Coss, Crss Capacitance td(on), td(off), Switching Time td(off) td(on) Ciss Coss Crss VGS(on) Drain Source Voltage Drain Current REVERSE RECOVERY TIME DRAIN CURRENT di/dt DYNAMIC INPUT/OUTPUT CHARACTERISTICS Reverse Recovery Time Drain Source Voltage Diode Current Gate Charge Gate Source Voltage µPA1700A REFERENCE Document Name semiconductor device reliability/quality control system Quality grade semiconductor devices Semiconductor device mounting technology manual Semiconductor device package manual Guide quality assurance semiconductor devices Application circuits using Power Safe operating area Power Document C11745E C11531E C10535E C10943X MEI-1202 TEA-1035 TEA-1037 µPA1700A [MEMO] µPA1700A part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. 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