CP392 Amp/Switch Transistor Chip PROCESS DETAILS Process Siz
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Small Signal Transistor
CP392
Amp/Switch Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER 93,826 PRINCIPAL DEVICE TYPES 2N3904 CMKT3904 CMLT3904E CMPT3904 CMPT3904E CMST3904 CXT3904 CZT3904
EPITAXIAL PLANAR MILS MILS MILS MILS
BACKSIDE COLLECTOR Adams Avenue Hauppauge, 11788 Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
-April 2004)
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