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HIGH REL MICROPROCESSORS

PROCESSORS PROCESSORS CONTROLLER SERVICES

HIGH REL MICROPROCESSORS
PROCESSORS PROCESSORS CONTROLLER SERVICES
Atmel
your partner
With over 25 years of experience and in close partnership with Freescale Semiconductor, Atmel offers a wide range of microprocessor products dedicated to serve Hi-Rel applications such as avionics, defense, space, industrial and field telecommunications. The offering is based on microprocessors from the PowerPC® and 68k architecture , and a range of key peripherals supported in partnership with Tundra Semiconductor. Atmel is committed to guaranteeing long-term availability of these products: Wafer storage and foundry transfer. We also offer assembly and test services. All manufacturing facilities meet international quality standards recognition ISO 9001 and are QML-Q certified.
quality
screening
level
Typical Temperature Range Military: -55°C to +125°C Industrial: -40°C to +110°C Screening Quality Assurance Levels Upscreening Standard: extended and military temperatures MIL STD 883 Class B QML 38535 Class Q
space
defense
· Radar Systems · Electronic Warfare · Counter Measures
avionics
· · · · · Flight Computers Flight Control Systems Voice Data Recorders Displays Engine Controllers
rience
telecom &
industrial
· · · · · Transportation Heavy Industry Industrial Computer Field Networking System Power Plant Control
general purpose
microprocessors
PC603R Core frequency up to 300 MHz 255-ball CBGA, CI-CGA and Hi-TCE 240-pin CERQUAD
product
PC745 / 755 Core frequency up to 400 MHz L2-cache support up to 1 MB 255-ball CBGA, Hi-TCE (74x) 360-ball CBGA, CI-CGA, Hi-TCE (75x) PC106 / 107 · · · · 60X bus-support up to 100 MHz PCI bus-support up to 66 MHz 303-ball CBGA, CI-CGA (106) 503-ball FC-PBGA, Hi-TCE CBGA (107)
PC7410 / 7447 / 7447A / 7457 / 7448 Core frequency up to 1.5 GHz 128-bit vector processing: Altivec L2-cache support up to 2MB (7410) On-Chip L2 up to 1MB (744x / 745x) L3-cache support up to 2MB (7457) 360-ball CBGA, CI-CGA, Hi-TCE CBGA (7410 / 744x) 483-ball CBGA, Hi-TCE CBGA (7457)
PC108 · MPX bus-support up to 200 MHz · PCI-X bus-support up to 133 MHz PC8240 / 8245 / 8349E · · · · · · Integrated e300 (G2) processor Core frequency up to 667 MHz PCI bus-support up to 66 MHz Memory controller 352-ball TBGA (824x) 672-ball TBGA (8349E)
PC8641 / 8641D Integrated e600 processor single or dual core (8641D) DDR / DDR II memory controller Gigabit Ethernet, Rapid IO, PCI-Express
PC8540 · Integrated e500 processor Memory controller / PCI-X / RapidIO · 783-ball Hi-TCE CBGA
PowerPC Architecture
integrated processors and
peripherals
communication
controllers
PC860SR / 8265A Embedded PowerPC core up to 266 MHz System interface unit (memory controller, RTC, PCMCIA) Communication processor module up to 166 MHz (Ethernet, ATM, HDCL) 357-ball PBGA (860SR), 480-ball TBGA (8265A)
general
purpose
TS68C000 16-bit microprocessor Up to 12.5 MHz in CDIP64, LCCC68, CQFP68, PGA68 TS68020 32-bit microprocessor Up to 25 MHz in CPGA114, CQFP132 MIL STD 883 Class B
overview
integrated processors and
peripherals
TS68040 32-bit microprocessor Up to 33 MHz in CPGA179, CQFP196
68K Architecture
ARINC
controller
TS68C429 ARINC 429 controller 8 receivers + 3 transmitters Designed to be connected to 68K processors In CPGA84, CQFP132
specific
packaging
The whole High-Rel family is available in a wide range of market standard packages CPGA, CQFP, LDCC, CERQUAD CBGA, FC-PBGA, TBGA, PBGA Atmel also provides specific packaging solutions
Lead-Free policy
In accordance with environmental concerns, the need for Pb-Free solution in electronic components has received increased attention and Atmel is commited to working with our cutomers to be able to offer products that meet their needs in this area.
CI-CGA: Solder Column Interposer
· A ruggedized packaging solution for CBGA packages · Same size and footprint as ceramic BGAs · Enhanced resistance to thermal cycling (3 - 5 times better than CBGA)
packaging
Hi-TCE Ceramic BGA
· Low temperature co-fired ceramic (LTCC) material · Optimized coefficient of thermal expansion (CTE) enhanced resistance to thermal cycling · Same body size & footprint as CBGAs · Same board assembly process as CBGAs · Optional lead-free solder-balls
PowerPC + L2 Cache Multi-chip Modules
· High-performance PowerPC microprocessor · + Fast SRAMs on the same package · 21x21 CBGA package footprint · Pinout compatible with PC603 and PC745 devices
manufacturing
capabilities
Assembly Line: Number 1 European High Reliability Assembly Facility · 600 sq. meters, Class 100 clean room · Hermetic ceramic packages: DIL, CHIP-CARRIER, CPGA, CQFP, CERQUAD · Flip-Chip assembly on ceramic substrate · Die processing assembly capacity: GelPack delivery · Low and medium volume capacity (up to 1M / year) Test Line · 1000 sq. meters under controlled environment · Digital ICs automatic test equipment: Teradyne, J971, J973, A585 · Burn-in and quality test equipment
industrial facilities
assembly and
test offer
Taking benefit of its outstanding manufacturing capabilities, Atmel offers specific services for customized solutions: Complex digital circuits, microprocessors, memories, ASICS We can design, simulate and characterize all types of ceramic packages
Package Design
Assembly
All kinds of ceramic packages, wirebonding and Flip-Chip, multi-chip modules
Engineering: Test program transfer or development Design & manufacturing of test interface Qualification: life-test, environmental tests Production: Wafer probe test: -40°C to +125°C Package test: -55°C to +125°C Burn-in and screening
Atmel Corporation
2325 Orchard Parkway San Jose, CA 95131 Tel: (408) 441-0311 Fax: (408) 487-2600
Regional Headquarters
Europe Atmel Sarl Route des Arsenaux 41 Case postale 80 CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581
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