POWERPC ARINC PROCESSORS PROCESSORS CONTROLLER SERVICES Atme

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POWERPC ARINC PROCESSORS PROCESSORS CONTROLLER SERVICES Atme

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HIGH MICROPROCESSORS
POWERPC ARINC
PROCESSORS PROCESSORS CONTROLLER SERVICES
Atmel
your partner
With over years experience close partnership with FreescaleSemiconductor, Atmel offers wide range microprocessor products dedicated serve Hi-Rel applications such avionics, defense, space, industrial field telecommunications. offering based microprocessors from PowerPC® architecture range peripherals supported partnership with TundraSemiconductor. Atmel committed guaranteeing long-term availability these products: Wafer storage foundry transfer. also offer assembly test services. manufacturing facilities meet international quality standards recognition 9001 QML-Q certified.
quality
quality
expe
screening
level
Typical Temperature Range Military: -55°C +125°C Industrial: -40°C +110°C Screening Quality Assurance Levels Upscreening Standard: extended military temperatures Class 38535 Class
space
defense
Radar Systems Electronic Warfare Counter Measures
avionics
avionics
Flight Computers Flight Control Systems Voice Data Recorders Displays Engine Controllers
rience
telecom
industrial
Transportation Heavy Industry Industrial Computer Field Networking System Power Plant Control
general purpose
microprocessors
PC603R Core frequency 255-ball CBGA, CI-CGA Hi-TCE 240-pin CERQUAD
product
PC745/755 Core frequency L2-cache support 255-ball CBGA, Hi-TCE (74x) 360-ball CBGA, CI-CGA, Hi-TCE (75x) PC106/107 bus-support bus-support 303-ball CBGA, CI-CGA (106) 503-ball FC-PBGA,Hi-TCE CBGA (107)
PC7410/7447/7447A/7457/7448 Core frequency 128-bit vector processing: AltivecL2-cache support (7410) On-Chip (744x/745x) L3-cache support (7457) 360-ball CBGA, CI-CGA, Hi-TCE CBGA (7410/744x) 483-ball CBGA, Hi-TCE CBGA (7457)
PC108 bus-support PCI-X bus-support PC8240/8245/8349E Integrated e300 (G2) processor Core frequency bus-support Memory controller 352-ball TBGA (824x) 672-ball TBGA (8349E)
PC8641/8641D Integrated e600 processor single dual core (8641D) DDR/DDR memory controller Gigabit Ethernet, Rapid PCI-Express
PC8540 Integrated e500 processor Memory controller/PCI-X/RapidIO 783-ball Hi-TCE CBGA
PowerPC Architecture
integrated processors
peripherals
communication
controllers
PC860SR/8265A Embedded PowerPC core System interface unit (memory controller, RTC, PCMCIA) Communication processor module (Ethernet, ATM, HDCL) 357-ball PBGA (860SR), 480-ball TBGA (8265A)
general
purpose
TS68C000 16-bit microprocessor 12.5 CDIP64, LCCC68, CQFP68, PGA68 TS68020 32-bit microprocessor CPGA114, CQFP132 Class
overview
integrated processors
peripherals
TS68EN360 32-bit communication controller Four SCC's (Ethernet Mbps support) CPGA241, CERQUAD240 TS68332 General purpose microcontroller CPGA132, CERQUAD132 TS68882 32-bit co-processor CPGA68, CQFP68 TS88915T Clock driver CPGA29, LDCC28 TS68302 16-bit communication processor CPGA132, CERQUAD132
TS68040 32-bit microprocessor CPGA179, CQFP196
Architecture
ARINC
controller
TS68C429 ARINC controller receivers transmitters Designed connected processors CPGA84, CQFP132
specific
packaging
whole High-Rel family available wide range market standard packages CPGA, CQFP, LDCC, CERQUAD CBGA, FC-PBGA, TBGA, PBGA Atmel also provides specific packaging solutions
Lead-Free policy
accordance with environmental concerns, need Pb-Free solution electronic components received increased attention Atmel commited working with cutomers able offer products that meet their needs this area.
CI-CGA: Solder Column Interposer
ruggedized packaging solution CBGA packages Same size footprint ceramic BGAs Enhanced resistance thermal cycling times better than CBGA)
packaging
Hi-TCE Ceramic
temperature co-fired ceramic (LTCC) material Optimized coefficient thermal expansion (CTE) enhanced resistance thermal cycling Same body size footprint CBGAs Same board assembly process CBGAs Optional lead-free solder-balls
PowerPC Cache Multi-chip Modules
High-performance PowerPC microprocessor Fast SRAMs same package 21x21 CBGA package footprint Pinout compatible with PC603 PC745 devices
manufacturing
capabilities
Assembly Line: Number European High Reliability Assembly Facility meters, Class clean room Hermetic ceramic packages: DIL, CHIP-CARRIER, CPGA, CQFP, CERQUAD Flip-Chip assembly ceramic substrate processing assembly capacity: GelPack delivery medium volume capacity 1M/year) Test Line 1000 meters under controlled environment Digital automatic test equipment: Teradyne, J971, J973, A585 Burn-in quality test equipment
industrial facilities
assembly
test offer
Taking benefit outstanding manufacturing capabilities, Atmel offers specific services customized solutions: Complex digital circuits, microprocessors, memories, ASICS design, simulate characterize types ceramic packages
Package Design
Assembly
kinds ceramic packages, wirebonding Flip-Chip, multi-chip modules
Test
Engineering: Test program transfer development Design manufacturing test interface Qualification: life-test, environmental tests Production: Wafer probe test: -40°C +125°C Package test: -55°C +125°C Burn-in screening
Atmel Corporation
2325 Orchard Parkway Jose, 95131 Tel: (408) 441-0311 Fax: (408) 487-2600
Regional Headquarters
Europe Atmel Sarl Route Arsenaux Case postale CH-1705 Fribourg Switzerland Tel: (41) 26-426-5555 Fax: (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Japan Tonetsu Shinkawa Bldg. 1-24-8 shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581
Product Information Biometrics/Imaging/Hi-Rel MPU/High Speed Converters/RF Datacom
Avenue Rochepleine 38521 Saint Cedex France Tel: (33) 4-76-58-30-00 Fax: (33) 4-76-58-34-80 Literature Requests www.atmel.com/literature Site www.atmel.com
©Atmel Corporation 2005. right reserved. Atmel® combinations thereof registered trademarks Atmel Corporation. Altivecand Freescaleare trademarks Freescalesemiconductors. Tundrais trademark Tundrasemiconductors. PowerPC® registred trademark IBM. 5341B-HIREL-01/05 Design:

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