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N-CHANNEL 0.010 DPAK/IPAK ULTRA GATE CHARGE STripFETPOWER MOSFET
Top Searches for this datasheetSTD55NH2LL N-CHANNEL 0.010 DPAK/IPAK ULTRA GATE CHARGE STripFETPOWER MOSFET TYPE STD55NH2LL VDSS TYPICAL RDS(on) 0.01 TYPICAL RDS(on) 0.012 RDS(ON) INDUSTRY's BENCHMARK CONDUCTION LOSSES REDUCED SWITCHING LOSSES REDUCED THRESHOLD DEVICE THROUGH-HOLE IPAK (TO-251) POWER PACKAGE TUBE (SUFFIX "-1") SURFACE-MOUNTING DPAK (TO-252) POWER PACKAGE TAPE REEL (SUFFIX "T4") RDS(on) 0.011 A(*) IPAK TO-251 (Suffix "-1") DPAK TO-252 (Suffix "T4") DESCRIPTION STD55NH2LL based latest generation ST's proprietary STripFETtechnology. innovative layout enables device also exhibit extremely gate charge most demanding requirements high-side switch high-frequency DC-DC converters. It's therefore ideal high-density converters Telecom Computer applications. INTERNAL SCHEMATIC DIAGRAM APPLICATIONS SPECIFICALLY DESIGNED OPTIMISED HIGH EFFICIENCY DC/DC CONVERTES Ordering Information SALES TYPE STD55NH2LLT4 STD55NH2LL-1 MARKING D55NH2LL D55NH2LL PACKAGE TO-252 TO-251 PACKAGING TAPE REEL TUBE ABSOLUTE MAXIMUM RATINGS Symbol Vspike(1) VDGR ID(*) IDM(2) Ptot EAS(3) Tstg March 2004 Parameter Drain-source Voltage Rating Drain-source Voltage (VGS Drain-gate Voltage (RGS Gate- source Voltage Drain Current (continuous) 25°C Drain Current (continuous) 100°C Drain Current (pulsed) Total Dissipation 25°C Derating Factor Single Pulse Avalanche Energy Storage Temperature Operating Junction Temperature Value Unit W/°C 1/12 STD55NH2LL THERMAL DATA Rthj-case Rthj-amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Maximum Lead Temperature Soldering Purpose °C/W °C/W ELECTRICAL CHARACTERISTICS (TCASE UNLESS OTHERWISE SPECIFIED) Symbol V(BR)DSS IDSS IGSS Parameter Drain-source Breakdown Voltage Zero Gate Voltage Drain Current (VGS Gate-body Leakage Current (VDS Test Conditions Rating Rating 125°C Min. Typ. Max. Unit ±100 Symbol VGS(th) RDS(on) Parameter Gate Threshold Voltage Static Drain-source Resistance Test Conditions Min. Typ. 0.010 0.012 Max. 0.011 0.0135 Unit DYNAMIC Symbol Ciss Coss Crss Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Input Resistance Test Conditions Min. Typ. Max. Unit Gate Bias Test Signal Level Open Drain 2/12 STD55NH2LL ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbol td(on) Qoss(5) Parameter Turn-on Delay Time Rise Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Output Charge Test Conditions (Resistive Load, Figure 0.44V 10V, VGS= VDS= VGS= Min. Typ. Max. Unit SWITCHING Symbol td(off) Parameter Turn-off Delay Time Fall Time Test Conditions 4.7, (Resistive Load, Figure Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbol ISDM IRRM Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Test Conditions Min. Typ. Max. Unit di/dt 100A/µs 150°C (see test circuit, Figure Value limited wire bonding 32.5 Garanted when external Rg=4.7 tfmax. Pulse width limited safe operating area Starting 20A, Pulsed: Pulse duration duty cycle Qoss Coss* Coss Appendix Safe Operating Area Thermal Impedance 3/12 STD55NH2LL Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance Gate Charge Gate-source Voltage Capacitance Variations 4/12 STD55NH2LL Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics Normalized Breakdown Voltage Temperature 5/12 STD55NH2LL Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times 6/12 STD55NH2LL TO-251 (IPAK) MECHANICAL DATA DIM. MIN. 0.45 0.48 15.9 0.95 16.3 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 0.64 TYP. MAX. 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 0068771-E 7/12 STD55NH2LL TO-252 (DPAK) MECHANICAL DATA MIN. 0.03 0.64 0.45 0.48 9.35 0.023 TYP. MAX. 0.23 10.1 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.252 0.173 0.368 0.031 0.039 inch TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.260 0.181 0.397 DIM. DETAIL DETAIL 0068772-B 8/12 STD55NH2LL 9/12 STD55NH2LL 10/12 STD55NH2LL 11/12 STD55NH2LL Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specifications mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo registered trademark STMicroelectronics other names property their respective owners. 2004 STMicroelectronics Rights Reserved STMicroelectronics GROUP COMPANIES Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco -Singapore Spain Sweden Switzerland United Kingdom United States. www.st.com 12/12 Other recent searchesuPD9930 - uPD9930 uPD9930 Datasheet UMX21N - UMX21N UMX21N Datasheet TO5022-XXX - TO5022-XXX TO5022-XXX Datasheet Si5475DC - Si5475DC Si5475DC Datasheet L9437 - L9437 L9437 Datasheet CS5371A - CS5371A CS5371A Datasheet CS5372A - CS5372A CS5372A Datasheet CGM-08-2004 - CGM-08-2004 CGM-08-2004 Datasheet
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