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N-Channel 150-V (D-S) MOSFET TrenchFETr Power MOSFETS Thermal Res


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Si7846DP
N-Channel 150-V (D-S) MOSFET
TrenchFETr Power MOSFETS Thermal Resistance PowerPAKr Package with 1.07-mm Profile Optimized Fast Switching 100% Tested
PRODUCT SUMMARY
rDS(on)
0.050
APPLICATIONS
Primary Side Switch High Density DC/DC Telecom/Server 48-V DC/DC Industrial 42-V Automotive
PowerPAK SO-8
6.15
5.15
N-Channel MOSFET
Bottom View Ordering Information: Si7846DP-T1
ABSOLUTE MAXIMUM RATINGS 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 150_C)a Pulsed Drain Current Avalanch Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction Storage Temperature Range 25_C 70_C 25_C 70_C
Symbol
Tstg
secs
Steady State
Unit
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta Maximum Junction-to-Foot (Drain) Notes Surface Mounted Board. Document Number: 71442 S-31728-Rev. 18-Aug-03 www.vishay.com Steady State Steady State
Symbol
RthJA RthJF
Typical
Maximum
Unit
_C/W
Si7846DP
SPECIFICATIONS 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea VGS(th) IGSS IDSS ID(on) rDS(on) VGS, 55_C 0.041 0.75 0.050 "100
Symbol
Test Condition
Unit
Forward Transconductancea Diode Forward Voltagea
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time td(on) td(off) di/dt A/ms VGEN 0.85
Notes Pulse test; pulse width duty cycle Guaranteed design, subject production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
thru Drain Current Drain Current
Transfer Characteristics
125_C 25_C 55_C
Drain-to-Source Voltage
Gate-to-Source Voltage
www.vishay.com
Document Number: 71442 S-31728-Rev. 18-Aug-03
Si7846DP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance Drain Current
0.10 DS(on) On-Resistance 3000 2500 Capacitance (pF) 2000 1500 1000 Crss Coss 0.00
Capacitance
0.08
0.06 0.04
Ciss
0.02
Drain Current
Drain-to-Source Voltage
Gate Charge
Gate-to-Source Voltage
On-Resistance Junction Temperature
DS(on) On-Resistance (Normalized)
Total Gate Charge (nC)
Junction Temperature (_C)
Source-Drain Diode Forward Voltage
0.15
On-Resistance Gate-to-Source Voltage
DS(on) On-Resistance
0.12 0.09
Source Current
150_C
0.06
25_C
0.03
0.00 Source-to-Drain Voltage Gate-to-Source Voltage
Document Number: 71442 S-31728-Rev. 18-Aug-03
www.vishay.com
Si7846DP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Avalanche Current Time
GS(th) Variance
25_C
125_C
Temperature (_C)
Time (sec)
Single Pulse Power, Juncion-to-Ambient
Power
0.001 0.01 Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient Thermal Impedance
Duty Cycle
0.05 0.02 Single Pulse 0.01 Square Wave Pulse Duration (sec)
Notes:
Duty Cycle,
Unit Base RthJA 52_C/W PDMZthJA(t) Surface Mounted
www.vishay.com
Document Number: 71442 S-31728-Rev. 18-Aug-03
Si7846DP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient Thermal Impedance
Duty Cycle
0.05 0.02 Single Pulse 0.01 Square Wave Pulse Duration (sec)
Document Number: 71442 S-31728-Rev. 18-Aug-03
www.vishay.com

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