CP704 High Current Transistor Chip PROCESS DETAILS Process S
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CP704
High Current Transistor Chip
PROCESS DETAILS Process Size Thickness Base Bonding Area Emitter Bonding Area Side Metalization Back Side Metalization GEOMETRY GROSS INCH WAFER 23,450 PRINCIPAL DEVICE TYPES MPSA55 MPSA56 EPITAXIAL PLANAR MILS MILS MILS MILS
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-December 2001)
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