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Rail-to-Rail Gain Bandwidth Product: (typ.) Supply Current: (typ.


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MCP6271/2/3/4/5
Rail-to-Rail
Gain Bandwidth Product: (typ.) Supply Current: (typ.) Supply Voltage: 2.0V 5.5V Rail-to-Rail Input/Output Extended Temperature Range: -40°C +125°C Available Single, Dual Quad Packages Single with Chip Select (CS) (MCP6273) Dual with Chip Select (CS) (MCP6275)
Description
Microchip Technology Inc. MCP6271/2/3/4/5 family operational amplifiers amps) provide wide bandwidth current. This family Gain Bandwidth Product (GBWP) phase margin. This family also operates from single supply voltage 2.0V, while drawing (typ.) quiescent current. Additionally, MCP6271/2/3/4/5 supports rail-to-rail input output swing, with common mode input voltage range This family operational amplifiers designed with Microchip's advanced CMOS process. MCP6275 Chip Select input (CS) dual amps 8-pin package manufactured cascading amps (the output connected non-inverting input input puts device Low-power mode. MCP6271/2/3/4/5 family operates over Extended Temperature Range -40°C +125°C, with power supply range 2.0V 5.5V.
Applications
Automotive Portable Equipment Photodiode Amplifier Analog Filters Notebooks PDAs Battery-Powered Systems
Available Tools
SPICE Macro Model www.microchip.com) FilterLab® Software www.microchip.com)
Package Types
MCP6271 PDIP, SOIC, MSOP
VIN_ VIN+ VOUT VOUT VIN+ VIN-
MCP6271 SOT-23-5
MCP6271R SOT-23-5
VOUT VIN+ VIN-
MCP6272 PDIP, SOIC, MSOP
VOUTA VINA VINA+
VOUTB VINB_ VINB+
MCP6273 PDIP, SOIC, MSOP
VIN_ VIN+ VOUT VOUT VIN+
MCP6273 SOT-23-6
MCP6274 PDIP, SOIC, TSSOP
VOUTA VINA_ VINA+ VINB+ VINB_ VOUTB
VOUTD
MCP6275 PDIP, SOIC, MSOP
VOUTA/VINB+ VINA_ VINA+
VIND_
VIND+ VINC+
VOUTB
VINB
VOUTC
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
Absolute Maximum Ratings
.7.0V Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current Continuous Current Input Pins Current Output Supply Pins .±30 Storage Temperature.-65°C +150°C Junction Temperature (TJ) .+150°C Protection Pins (HBM/MM) kV/400V
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VDD/2 VOUT VDD/2. Parameters Input Offset Input Offset Voltage Input Offset Voltage (Extended Temperature) Input Offset Temperature Drift Power Supply Rejection Ratio Input Bias Current Impedance Input Bias Current Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode (Note Common Mode Input Range Common Mode Rejection Ratio Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (Large Signal) Output Maximum Output Voltage Swing Output Short-Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note VOL, VOUT 0.2V 0.2V, VSS, (Note VCMR CMRR CMRR Note -0.3V 2.5V, -0.3V 5.3V, ZDIFF ±1.0 ±1.0 1013||6 1013||3 ||pF ||pF Note +85°C (Note +125°C (Note Note Note Note VOS/TA PSRR -3.0 -5.0 ±1.7 +3.0 +5.0 (Note -40°C +125°C, (Note Units Conditions
µV/°C -40°C +125°C, (Note (Note
MCP6275's (pins VOUTA/VINB+ VINB-) current MCP6275's VINB- specified only. This specification does apply MCP6275's VOUTA/VINB+ pin. MCP6275's VINB- common mode range (VCMR) MCP6275's VOUTA/VINB+ voltage range specified VOL.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2 Parameters Response Gain Bandwidth Product Phase Margin Unity-Gain Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVP-P nV/Hz fA/Hz GBWP V/µs Units Conditions
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +2.0V +5.5V GND. Parameters Temperature Ranges Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SOT-23 Thermal Resistance, 6L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note: °C/W °C/W °C/W °C/W °C/W °C/W °C/W °C/W +125 +150 Note Units Conditions
Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
MCP6273/MCP6275 CHIP SELECT (CS) SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2 Parameters Specifications Logic Threshold, Input Current, High Specifications Logic Threshold, High Input Current, High Current Amplifier Amplifier Output Leakage Dynamic Specifications (Note Valid Amplifier Output, Turn-on Time High Amplifier Output High-Z Hysteresis Note VDD, V/V, VDD/2, VOUT VDD/2, 5.0V High VDD, V/V, VDD/2, VOUT VDD/2 ICSH 0.8VDD -0.7 0.01 ICSL 0.01 0.2VDD Units Conditions
tOFF VHYST
0.01
input condition (VIN) specified applies both MCP6275. dynamic specification tested output (VOUTB).
tOFF Hi-Z -0.7 (typ.) -170 (typ.) (typ.) (typ.)
VOUT
Hi-Z -0.7 (typ.)
(typ.)
FIGURE 1-1: Timing Diagram Chip Select (CS) MCP6273 MCP6275.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
Percentage Occurrences
Percentage Occurrences
Samples
Samples -40°C +125°C
-3.0
-2.4
-1.8
-1.2
-0.6
Input Offset Voltage (mV)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4:
Percentage Occurrences
Percentage Occurrences
Samples +85°C
Input Bias Current (pA)
Input Bias Current (nA)
FIGURE 2-2: +85°C.
2.0V
Input Bias Current
FIGURE 2-5: +125°C.
5.5V
Input Bias Current
Input Offset Voltage (µV)
-100 -0.4 -0.2 +125°C +85°C +25°C -40°C
Input Offset Voltage (µV)
-100
-0.5
+125°C +85°C +25°C -40°C
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-3: Input Offset Voltage Common Mode Input Voltage 2.0V.
FIGURE 2-6: Input Offset Voltage Common Mode Input Voltage 5.5V.
2004 Microchip Technology Inc.
DS21810D-page
Input Offset Voltage Drift (µV/°C)
Input Offset Voltage Drift.
Samples +125°C
MCP6271/2/3/4/5
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
10,000
Input Offset Voltage (µV)
-100 2.0V 5.5V
Input Bias, Offset Currents (pA)
Representative Part
5.5V 1,000
Input Bias Current Input Offset Current
Output Voltage
Ambient Temperature (°C)
FIGURE 2-7: Output Voltage.
Input Offset Voltage
FIGURE 2-10: Input Bias, Input Offset Currents Ambient Temperature.
CMRR PSRRPSRR+
CMRR, PSRR (dB)
PSRR, CMRR (dB)
CMRR
PSRR
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-8: Frequency.
CMRR, PSRR
FIGURE 2-11: Temperature.
CMRR, PSRR Ambient
Input Bias, Offset Currents (pA)
Input Bias, Offset Currents (nA)
Input Offset Current +85°C 5.5V Input Bias Current
-0.5 -1.0
+125°C 5.5V Input Bias Current
Input Offset Current
Common Mode Input Voltage
Common Mode Input Voltage
FIGURE 2-9: Input Bias, Offset Currents Common Mode Input Voltage +85°C.
FIGURE 2-12: Input Bias, Offset Currents Common Mode Input Voltage +125°C.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
1000
Ouput Voltage Headroom (mV)
Quiescent Current (µA/amplifier)
+125°C +85°C +25°C -40°C
0.01
Power Supply Voltage
Output Current Magnitude (mA)
FIGURE 2-13: Quiescent Current Power Supply Voltage.
Gain Phase
1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
FIGURE 2-16: Output Voltage Headroom Output Current Magnitude.
Gain Bandwidth Product 5.5V Phase Margin 2.0V 5.5V 2.0V
Gain Bandwidth Product (MHz)
Open-Loop Gain (dB)
Open-Loop Phase
-120 -150 -180 -210 100k 100M
1.E+08 1.E-01
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-14: Frequency.
Open-Loop Gain, Phase
FIGURE 2-17: Gain Bandwidth Product, Phase Margin Ambient Temperature.
Maximum Output Voltage Swing (VP-P)
5.5V
Falling Edge, 5.5V Falling Edge, 2.0V
Slew Rate (V/µs)
2.0V
Rising Edge, 5.5V Rising Edge, 2.0V
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
100k
Frequency (Hz)
Ambient Temperature (°C)
FIGURE 2-15: Maximum Output Voltage Swing Frequency.
FIGURE 2-18: Temperature.
Slew Rate Ambient
2004 Microchip Technology Inc.
DS21810D-page
Phase Margin
MCP6271/2/3/4/5
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
1,000
Input Noise Voltage Density (nV/
Input Noise Voltage Density (nV/
5.0V
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
100k
Frequency (Hz)
Common Mode Input Voltage
FIGURE 2-19: Frequency.
Input Noise Voltage Density
FIGURE 2-22: Input Noise Voltage Density Common Mode Input Voltage kHz.
Channel-to-Channel Separation (dB)
Ouptut Short Circuit Current (mA)
+125°C +85°C +25°C -40°C
Power Supply Voltage
Frequency (kHz)
FIGURE 2-20: Output Short-Circuit Current Power Supply Voltage.
FIGURE 2-23: Channel-to-Channel Separation Frequency (MCP6272 MCP6274).
Op-Amp shuts here
5.5V
Quiescent Current (µA/Amplifier)
Quiescent Current (µA/Amplifier)
Op-Amp turns here
Hysteresis swept high
swept high
swept high
toggles On/Off here
Chip Select Voltage
Chip Select Voltage
FIGURE 2-21: Quiescent Current Chip Select (CS) Voltage 2.0V (MCP6273 MCP6275 only).
FIGURE 2-24: Quiescent Current Chip Select (CS) Voltage 5.5V (MCP6273 MCP6275 only).
DS21810D-page
2004 Microchip Technology Inc.
swept high
Hysteresis
MCP6271/2/3/4/5
TYPICAL PERFORMANCE CURVES (Continued)
Note: Unless otherwise indicated, +25°C, +2.0V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
+1V/V 5.0V -1V/V 5.0V
Output Voltage
Output Voltage
Time µs/div)
Time µs/div)
FIGURE 2-25: Pulse Response.
Large-Signal Non-inverting
FIGURE 2-28: Response.
Large-Signal Inverting Pulse
+1V/V
-1V/V
Output Voltage mV/div)
Time µs/div)
Output Voltage mV/div)
Time µs/div)
FIGURE 2-26: Pulse Response.
Small-Signal Non-inverting
FIGURE 2-29: Response.
Small-Signal Inverting Pulse
Chip Select, Output Voltages
Chip Select, Output Voltages
Voltage
2.0V +1V/V
Voltage
5.5V +1V/V
VOUT Output
VOUT
Output High-Z
-5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0
Output High-Z
Output
Time µs/div)
Time µs/div)
FIGURE 2-27: Chip Select (CS) Amplifier Output Response Time 2.0V (MCP6273 MCP6275 only).
FIGURE 2-30: Chip Select (CS) Amplifier Output Response Time 5.5V (MCP6273 MCP6275 only).
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
DESCRIPTIONS
FUNCTION TABLE SINGLE AMPS
MCP6271 (SOT-23-5) MCP6271R (SOT-23-5) MCP6273 (PDIP, SOIC, MSOP) MCP6273 (SOT-23-6) Symbol VOUT VIN- VIN+ Description Analog Output Inverting Input Non-inverting Input Positive Power Supply Negative Power Supply Chip Select Internal Connection
Descriptions pins listed Table (single amps) Table (dual quad amps).
TABLE 3-1:
MCP6271 (PDIP, SOIC, MSOP) 1,5,8
TABLE 3-2:
MCP6272
FUNCTION TABLE DUAL QUAD AMPS.
MCP6274 MCP6275 Symbol VOUTA VINA- VINA+ VINB+ VINB- VOUTB VOUTC VINC- VINC+ VIND+ VIND- VOUTD VOUTA VINB+ Analog Output Inverting Input Non-inverting Input Positive Power Supply Non-inverting Input Inverting Input Analog Output Analog Output Inverting Input Non-inverting Input Negative Power Supply Non-inverting Input Inverting Input Analog Output Analog Output A)/Non-inverting Input Chip Select Description
Analog Outputs
Digital Input
output pins low-impedance voltage sources.
This CMOS, Schmitt-triggered input that places part into low-power mode operation.
Analog Inputs
Power Supply (VSS VDD)
non-inverting inverting inputs highimpedance CMOS inputs with bias currents.
MCP6275's VOUTA/VINB+
positive power supply (VDD) 2.0V 5.5V higher than negative power supply (VSS). normal operation, other pins between VDD. Typically, these parts used single (positive) supply configuration. this case, connected ground connected supply. will need local bypass capacitor (typically 0.01 within pin. These parts need bulk capacitor (within mm), which shared with nearby analog parts.
MCP6275 only, output connected directly non-inverting input this VOUTA/VINB+ pin. This connection makes possible provide duals 8-pin packages.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
APPLICATION INFORMATION
MCP627X VOUT MCP6271/2/3/4/5 family amps manufactured using Microchip's state-of-the-art CMOS process, specifically designed low-cost, low-power general purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6271/2/3/4/5 ideal battery-powered applications.
Rail-to-Rail Inputs
MCP6271/2/3/4/5 amps designed prevent phase reversal when input pins exceed supply voltages. Figure shows input voltage exceeding supply voltage without phase reversal.
Maximum expected Minimum expected
FIGURE 4-2: Resistor (RIN).
Input Current Limiting
Input, Output Voltage
Rail-to-Rail Output
5.0V
VOUT
output voltage range MCP6271/2/3/4/5 amps (min.) (max.) when connected VDD/2 5.5V. Refer Figure 2-16 more information.
Capacitive Loads
Time ms/div)
FIGURE 4-1: MCP6271/2/3/4/5 Show Phase Reversal.
input stage MCP6271/2/3/4/5 amps differential CMOS input stages parallel. operates common mode input voltage (VCM) other high VCM. With this topology, device operates with 0.3V above 0.3V below VSS. Input Offset Voltage (VOS) measured 0.3V 0.3V ensure proper operation. Input voltages that exceed absolute maximum voltage (VSS 0.3V 0.3V) cause excessive current flow into input pins. Current beyond cause reliability problems. Applications that exceed this rating must externally limited with resistor, shown Figure 4-2.
Driving large capacitive loads cause stability problems voltage-feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, though gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 4-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. bandwidth will generally lower than bandwidth with capacitive load.
MCP627X
RISO VOUT
FIGURE 4-3: Output Resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, Signal Gain equal. inverting gains, 1+|Signal Gain| (e.g., gives V/V).
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
1,000 Recommended RISO
VOUTA/VINB+ VINA-
VINB-
1,000 10,000 Normalized Load Capacitance; (pF)
MCP6275
VOUTB
VINA+
FIGURE 4-4: Recommended RISO Values Capacitive Loads.
After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Modify RISO's value until response reasonable. Bench evaluation simulations with MCP6271/2/3/4/5 SPICE macro model helpful.
FIGURE 4-5:
Cascaded Gain Amplifier.
output loaded input impedance which typically 10136 specified specification table (Refer Section "Capacitive Loads" further details regarding capacitive loads). common mode input range these amps specified data sheet However, since output limited from rails with load), non-inverting input range limited common mode input range
MCP6273/5 Chip Select (CS)
MCP6273 MCP6275 single dual amps with Chip Select (CS), respectively. When pulled high, supply current drops (typ.) flows through VSS. When this happens, amplifier output into high-impedance state. pulling low, amplifier enabled. left floating, amplifier operate properly. Figure shows output voltage supply current response pulse.
Supply Bypass
Cascaded Dual Amps (MCP6275)
With this family operational amplifiers, power supply (VDD single supply) should have local bypass capacitor (i.e., 0.01 within good, high-frequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with other analog parts.
MCP6275 dual with Chip Select (CS). Chip Select input available what would non-inverting input standard dual (pin This available because output connects non-inverting input shown Figure 4-5. Chip Select input, which connected microcontroller line, puts device Low-power mode. Refer Section "MCP6273/5 Chip Select (CS)".
Surface Leakage
applications where input bias current critical, Printed Circuit Board (PCB) surface-leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current flow. This greater than MCP6271/2/3/4/5 family's bias current 25°C typ.). easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout illustrated Figure 4-6.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
VIN- VIN+
Application Circuits
ACTIVE FULL-WAVE RECTIFIER
4.8.1
Guard Ring
FIGURE 4-6: Inverting Gain.
Example Guard Ring Layout
Inverting Gain Transimpedance Amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface. Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage.
MCP6271/2/3/4/5 family amplifiers used applications such Active Full-Wave Rectifier Absolute Value circuit, shown Figure 4-7. amplifier feedback loops this active voltage rectifier circuit eliminate diode drop problem that exists passive voltage rectifier. This circuit behaves follower (the output follows input) long input signal more positive than reference voltage. input signal more negative than reference voltage, however, circuit behaves inverting amplifier. Therefore, output voltage will always above reference voltage, regardless input signal.
VOUT MCP6272 VREF VREF -2R3
MCP6272
VREF
Input
Output
VREF
VREF
time
time
FIGURE 4-7:
Active Full-wave Rectifier.
design equations give gain from VOUT, produce rail-to-rail outputs.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
4.8.2 LOSSY NON-INVERTING INTEGRATOR 4.8.3 CASCADED APPLICATIONS
non-inverting integrator shown Figure easy build. saves over typical Miller integrator plus inverting amplifier configuration. phase accuracy this integrator depends matching input feedback resistors, capacitor's time constants. used provide feedback frequencies 1/(2 R1C1) makes this lossy integrator infinite gain DC). MCP6275 provides flexibility Low-power mode dual amps 8-pin package. MCP6275 eliminates added cost space battery-powered application using single amps with Chip Select (CS) lines 10-pin device with line both amps. Since amps internally cascaded, this device cannot used circuits that require active passive elements between amps. However, there several applications where this configuration with line becomes suitable. circuits below show possible applications this device.
MCP6271 VOUT
4.8.3.1
Load Isolation
With cascaded configuration, used isolate load from applications where driving capacitive resistive loads feedback loop (such integrator filter circuit) have sufficient source current drive load. this case, used buffer.
FIGURE 4-8:
Non-Inverting Integrator.
MCP6275
VOUTB Load
FIGURE 4-9: Buffer. 4.8.3.2
Isolating Load with
Cascaded Gain
Figure 4-10 shows cascaded gain circuit configuration with Chip Select. amps configured non-inverting amplifier configuration. this configuration, important note that input offset voltage amplified gain shown below: Where: gain gain VOSA input offset voltage VOSB input offset voltage Therefore, recommended that most gain with with relatively small gain (e.g., unity-gain buffer).
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
VOUT
MCP6275
VOUT
MCP6275
FIGURE 4-10: Configuration. 4.8.3.3
Cascaded Gain Circuit
FIGURE 4-12: Compensation. 4.8.3.5
Integrator Circuit with Active
Difference Amplifier
Figure 4-11 shows configured difference amplifier with Chip Select. this configuration, recommended that well-matched resistors (e.g., 0.1%) used increase Common Mode Rejection Ratio (CMRR). used provide additional gain isolate load from difference amplifier.
VIN2 VIN1 VOUT
Second-Order with extra pole-zero pair
Figure 4-13 second-order multiple feedback lowpass filter with Chip Select. FilterLab® software from Microchip determine values second-order filter. used pole-zero pair using
VOUT
MCP6275
MCP6275
FIGURE 4-11: 4.8.3.4
Difference Amplifier Circuit.
Inverting Integrator with Active Compensation Chip Select
FIGURE 4-13: Second-Order Multiple Feedback Low-Pass Filter with Extra PoleZero Pair.
Figure 4-12 uses active compensator compensate non-ideal characteristics introduced higher frequencies. This circuit uses unity-gain buffer isolate integration capacitor from drives capacitor with low-impedance source. Since both amps matched very well, they provide high-quality integrator.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
4.8.3.6 Second-Order Sallen-Key with Extra Pole-Zero Pair 4.8.3.7 Capacitorless Second-Order Low-Pass filter with Chip Select
Figure 4-14 second-order Sallen-Key low-pass filter with Chip Select. Filterlab® software from Microchip determine values second-order filter. used pole-zero pair using
VOUT
low-pass filter shown Figure 4-15 does require external capacitors uses only three external resistors; amp's GBWP sets corner frequency. used circuit gain. used avoid gain-peaking frequency response, needs (lower values need selected R3). Note that amplifier bandwidth varies greatly over temperature process. This configuration, however, provides lowcost solution applications with high bandwidth requirements. VREF MCP6275 VOUT
MCP6275
FIGURE 4-14: Second-Order Sallen-Key Low-Pass Filter with Extra Pole-Zero Pair Chip Select.
FIGURE 4-15: Capacitorless Second-Order Low-Pass Filter with Chip Select.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
DESIGN TOOLS
Microchip provides basic design tools needed MCP6271/2/3/4/5 family amps.
SPICE Macro Model
latest SPICE macro model MCP6271/2/3/4/5 amps available site www.microchip.com. This model intended initial design tool that works well amp's linear region operation room temperature. macro model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
FilterLab® Software
Microchip's FilterLab software innovative tool that simplifies analog active filter (using amps) design. available free charge from site www.microchip.com. FilterLab software tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 (MCP6271 MCP6271R) Example:
Device
Code CGNN ETNN
XXNN
MCP6271 MCP6271R
CG25
Note: Applies 5-Lead SOT-23
6-Lead SOT-23 (MCP6273)
Example:
XXNN
CK25
8-Lead MSOP XXXXXX YWWNNN
Example: 6271E 437256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6271 E/P256 0437
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6271 E/SN0437
Legend:
XX.X
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
Note:
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, traceability code (facility code, mask rev#, assembly code). marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6274) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN Example:
MCP6274-E/P 0437256
14-Lead SOIC (150 mil) (MCP6274)
Example:
XXXXXXXXXX XXXXXXXXXX YYWWNNN
MCP6274ESL 0437256
14-Lead TSSOP (MCP6274)
Example:
XXXXXX YYWW
6274EST 0437
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
5-Lead Plastic Small Outline Transistor (OT) (SOT-23)
Number Pins Pitch Outside lead pitch (basic) Overall Height .035 .057 0.90 Molded Package Thickness .035 .051 0.90 Standoff .000 .006 0.00 Overall Width .102 .118 2.60 Molded Package Width .059 .069 1.50 Overall Length .110 .122 2.80 Foot Length .014 .022 0.35 Foot Angle Lead Thickness .004 .008 0.09 Lead Width .014 .020 0.35 Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. EIAJ Equivalent: SC-74A
Drawing C04-091
Units Dimension Limits
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
MILLIMETERS 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0.15 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
Number Pins Pitch Outside lead pitch (basic) Overall Height .035 .057 Molded Package Thickness .035 .051 Standoff .000 .006 Overall Width .102 .118 Molded Package Width .059 .069 Overall Length .110 .122 Foot Length .014 .022 Foot Angle Lead Thickness .004 .008 Lead Width .014 .020 Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEITA (formerly EIAJ) equivalent: SC-74A
Drawing C04-120
Units Dimension Limits
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
MILLIMETERS 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0.09 0.15 0.35 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Number Pins .026 Pitch .043 Overall Height .030 .033 .037 Molded Package Thickness .000 .006 Standoff .193 TYP. Overall Width .118 Molded Package Width .118 Overall Length .016 .024 .031 Foot Length Footprint (Reference) .037 Foot Angle Lead Thickness .003 .006 .009 Lead Width .009 .012 .016 Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side.
Units Dimension Limits
INCHES
MILLIMETERS* 0.65 0.75 0.85 0.00 4.90 3.00 3.00 0.40 0.60 0.95 0.08 0.22
1.10 0.95 0.15
0.80 0.23 0.40
JEDEC Equivalent: MO-187
Drawing C04-111
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
14-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane .140 .170 Molded Package Thickness .115 .145 Base Seating Plane .015 Shoulder Shoulder Width .300 .313 .325 Molded Package Width .240 .250 .260 Overall Length .740 .750 .760 Seating Plane .125 .130 .135 Lead Thickness .008 .012 .015 Upper Lead Width .045 .058 .070 Lower Lead Width .014 .018 .022 Overall Spacing .310 .370 .430 Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-005
Units Dimension Limits
INCHES* .100 .155 .130
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
14-Lead Plastic Small Outline (SL) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .150 .337 .010 .016 .008 .014
INCHES* .050 .061 .056 .007 .236 .154 .342 .015 .033 .009 .017
.069 .061 .010 .244 .157 .347 .020 .050 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0.20 0.23 0.36 0.42
1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-065
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
14-Lead Plastic Thin Shrink Small Outline (ST) (TSSOP)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES .026 .035 .004 .251 .173 .197 .024 .006 .010
.033 .002 .246 .169 .193 .020 .004 .007
.043 .037 .006 .256 .177 .201 .028 .008 .012
MILLIMETERS* 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0.09 0.15 0.20 0.19 0.25 0.30
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEDEC Equivalent: MO-153 Drawing C04-087
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
NOTES:
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
APPENDIX REVISION HISTORY
Revision (June 2003)
Original data sheet release.
Revision (October 2003) Revision (June 2004) Revision (December 2004)
following list modifications: Added SOT-23-5 packages MCP6271 MCP6271R single amps. Added SOT-23-6 packages MCP6273 single amp. Added Section "Pin Descriptions". Corrected application circuits (Section "Application Circuits"). Added SOT-23-5 SOT-23-6 packages corrected package marking information (Section "Packaging Information"). Added Appendix Revision History.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
NOTES:
DS21810D-page
2004 Microchip Technology Inc.
MCP6271/2/3/4/5
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device
Package
Examples:
MCP6271-E/SN: MCP6271-E/MS: MCP6271-E/P: MCP6271T-E/OT: Extended Temperature, SOIC package. Extended Temperature, MSOP package. Extended Temperature, PDIP package. Tape Reel, Extended Temperature, SOT-23 package.
Temperature Range
Device:
MCP6271: MCP6271T:
MCP6271RT: MCP6272: MCP6272T: MCP6273: MCP6273T:
MCP6274: MCP6274T: MCP6275: MCP6275T:
Single Single (Tape Reel) (SOIC, MSOP, SOT-23-5) Single (Tape Reel) (SOT-23-5) Dual Dual (Tape Reel) (SOIC, MSOP) Single with Chip Select Single with Chip Select (Tape Reel) (SOIC, MSOP, SOT-23-6) Quad Quad (Tape Reel) (SOIC, TSSOP) Dual with Chip Select Dual with Chip Select (Tape Reel) (SOIC, MSOP)
Extended Temperature, SOIC package. MCP6272-E/MS: Extended Temperature, MSOP package. MCP6272-E/P: Extended Temperature, PDIP package. MCP6272T-E/SN: Tape Reel, Extended Temperature, SOIC package. Extended Temperature, SOIC package. MCP6273-E/MS: Extended Temperature, MSOP package. MCP6273-E/P: Extended Temperature, PDIP package. MCP6273T-E/CH: Extended Temperature, SOT-23 package. MCP6274-E/P: MCP6274T-E/SL: Extended Temperature, 14LD PDIP package. Tape Reel, Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD SOIC package. Extended Temperature, 14LD TSSOP package. MCP6273-E/SN:
MCP6272-E/SN:
Temperature Range:
-40°C +125°C
Package:
Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6271, MCP6271R) Plastic Small Outline Transistor (SOT-23), 6-lead (MCP6273) Plastic MSOP, 8-lead Plastic (300 Body), 8-lead, 14-lead Plastic SOIC, (150 Body), 8-lead Plastic SOIC (150 Body), 14-lead Plastic TSSOP (4.4mm Body), 14-lead
MCP6274-E/SL: MCP6274-E/ST:
Extended Temperature, SOIC package. MCP6275-E/MS: Extended Temperature, MSOP package. MCP6275-E/P: Extended Temperature, PDIP package. MCP6275T-E/SN: Tape Reel, Extended Temperature, SOIC package.
MCP6275-E/SN:
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com) receive most current information products.
2004 Microchip Technology Inc.
DS21810D-page
MCP6271/2/3/4/5
NOTES:
DS21810D-page
2004 Microchip Technology Inc.
Note following details code protection feature Microchip devices: Microchip products meet specification contained their particular Microchip Data Sheet. Microchip believes that family products most secure families kind market today, when used intended manner under normal conditions. There dishonest possibly illegal methods used breach code protection feature. these methods, knowledge, require using Microchip products manner outside operating specifications contained Microchip's Data Sheets. Most likely, person doing engaged theft intellectual property. Microchip willing work with customer concerned about integrity their code. Neither Microchip other semiconductor manufacturer guarantee security their code. Code protection does mean that guaranteeing product "unbreakable."
Code protection constantly evolving. Microchip committed continuously improving code protection features products. Attempts break Microchip's code protection feature violation Digital Millennium Copyright Act. such acts allow unauthorized access your software other copyrighted work, have right relief under that Act.
Information contained this publication regarding device applications like provided only your convenience superseded updates. your responsibility ensure that your application meets with your specifications. MICROCHIP MAKES REPRESENTATIONS WARRANTIES KIND WHETHER EXPRESS IMPLIED, WRITTEN ORAL, STATUTORY OTHERWISE, RELATED INFORMATION, INCLUDING LIMITED CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY FITNESS PURPOSE. Microchip disclaims liability arising from this information use. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under Microchip intellectual property rights.
Trademarks Microchip name logo, Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, MATE, PowerSmart, rfPIC, SmartShunt registered trademarks Microchip Technology Incorporated U.S.A. other countries. AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel Total Endurance trademarks Microchip Technology Incorporated U.S.A. other countries. SQTP service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2004, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved. Printed recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona Mountain View, California October 2003. Company's quality system processes procedures PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001:2000 certified.
2004 Microchip Technology Inc.
DS21810D-page
WORLDWIDE SALES SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Address: www.microchip.com Atlanta Alpharetta, Tel: 770-640-0034 Fax: 770-640-0307 Boston Westford, Tel: 978-692-3848 Fax: 978-692-3821 Chicago Itasca, Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, Tel: 765-864-8360 Fax: 765-864-8387 Angeles Mission Viejo, Tel: 949-462-9523 Fax: 949-462-9608 Jose Mountain View, Tel: 650-215-1444 Fax: 650-961-0286 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China Chengdu Tel: 86-28-8676-6200 Fax: 86-28-8676-6599 China Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 China Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China Qingdao Tel: 86-532-502-7355 Fax: 86-532-502-7205
ASIA/PACIFIC
India Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India Delhi Tel: 91-11-5160-8631 Fax: 91-11-5160-8632 Japan Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Drunen Tel: 31-416-690399 Fax: 31-416-690340 England Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/20/04
DS21810D-page
2004 Microchip Technology Inc.

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