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µPA1758 DESCRIPTION This product Dual N-Channel Field Effect
Top Searches for this datasheetFIELD EFFECT TRANSISTOR µPA1758 DESCRIPTION This product Dual N-Channel Field Effect Transistor designed power management application notebook computers, Li-ion battery application. FEATURES Dual chips small package gate drive type on-state resistance RDS(on)1 (MAX.) (VGS RDS(on)2 (MAX.) (VGS Ciss Ciss 1100 (TYP.) Built-in protection diode Small surface mount package (Power SOP8) PACKAGE DRAWING (Unit Source Gate Drain Source Gate Drain 5.37 Max. +0.10 -0.05 ±0.3 0.15 ORDERING INFORMATION PART NUMBER PACKAGE Power SOP8 Max. 1.44 0.05 Min. ±0.2 0.10 1.27 0.40 0.78 Max. 0.12 µPA1758G +0.10 -0.05 ABSOLUTE MAXIMUM RATINGS Drain Source Voltage (VGS Gate Source Voltage (VDS Drain Current (DC) Drain Current (Pulse) Note1 Note2 Note2 EQUIVALENT CIRCUIT ±12.0 ±6.0 Gate Body Diode Drain VDSS VGSS ID(DC) ID(pulse) Tstg Total Power Dissipation unit) Total Power Dissipation unit) Channel Temperature Storage Temperature Gate Protection Diode Source Notes Duty cycle Mounted ceramic substrate 2000 Remark diode connected between gate source transistor serves protector against ESD. When this device actually used, additional protection circuit externally required voltage exceeding rated voltage applied this device. information this document subject change without notice. Document D12911EJ1V0DS00 (1st edition) Date Published October 1998 CP(K) Printed Japan 1998 µPA1758 ELECTRICAL CHARACTERISTICS CHARACTERISTICS Drain Source On-state Resistance SYMBOL RDS(on)1 RDS(on)2 Gate Source Cutoff Voltage Forward Transfer Admittance Drain Leakage Current Gate Source Leakage Current Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate Source Charge Gate Drain Charge Body Diode forward Voltage VGS(off) IDSS IGSS Ciss Coss Crss td(on) td(off) VF(S-D) VGS(on) TEST CONDITIONS ±12.0 1100 15.0 MIN. TYP. MAX. UNIT TEST CIRCUIT SWITCHING TIME D.U.T. Wave Form TEST CIRCUIT GATE CHARGE D.U.T. (on) Duty Cycle Wave Form (on) (off) toff µPA1758 TYPICAL CHARACTERISTICS TRANSIENT THERMAL RESISTANCE PULSE WIDTH rth(t) Transient Thermal Resistance °C/W 0.01 0.001 Mounted ceramic Single Pulse substrate 2000mm2 1.1mm Single Pulse unit Pulse Width RDS(on) Drain Source On-state Resistance FORWARD TRANSFER ADMITTANCE DRAIN CURRENT DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed |yfs| Forward Transfer Admittance TA=-50°C TA=-25°C TA=25°C VDS=10V Pulsed ID=3 TA=75°C TA=125°C TA=150°C Drain Current Gate Source Voltage RDS(on) Drain Source On-state Resistance VGS(off) Gate Source Cut-off Voltage DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT Pulsed VGS=4.5V VGS=2.5V GATE SOURCE CUTOFF VOLTAGE CHANNEL TEMPERATURE VDS=10 ID=1 Drain Current Channel Temperature µPA1758 RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE SOURCE DRAIN DIODE FORWARD VOLTAGE Pulsed Diode Forward Current VGS=2.5V VGS=2.5V VGS=4.5V VGS=0V Channel Temperature Source Drain Voltage CAPACITANCE DRAIN SOURCE VOLTAGE 10000 SWITCHING CHARACTERISTICS td(on), td(off), Switching Time Ciss, Coss, Crss Capacitance td(off) td(on) Ciss 1000 Coss Crss VDS=15V VGS=4V Drain Current Drain Source Voltage REVERSE RECOVERY TIME DRAIN CURRENT Reverse Recovery Diode Drain Source Voltage VDD=24 VDD=15 VDD=6 Drain Current Gate Charge Gate Source Voltage di/dt =100A/µ DYNAMIC INPUT/OUTPUT CHARACTERISTICS ID=6.0 µPA1758 DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA TOTAL POWER DISSIPATION AMBIENT TEMPERATURE Total Power Dissipation W/package unit unit Mounted ceramic substrate Percentage Rated Power Ambient Temperature Ambient Temperature FORWARD BIAS SAFE OPERATING AREA Mounted ceramic substrate ID(pulse) 2000mm unit ID(DC)=6 DRAIN CURRENT DRAIN SOURCE VOLTAGE Pulsed Drain Current Drain Current VGS=4.5 VGS=2.5 Single Pulse Drain Source Voltage Drain Source Voltage FORWARD TRANSFER CHARACTERISTICS Pulsed Drain Current TA=150°C TA=125°C TA=75°C TA=25°C TA=-25°C TA=-50°C Gate Source Voltage µPA1758 [MEMO] µPA1758 [MEMO] µPA1758 [MEMO] part this document copied reproduced form means without prior written consent Corporation. Corporation assumes responsibility errors which appear this document. Corporation does assume liability infringement patents, copyrights other intellectual property rights third parties arising from device described herein other liability arising from such device. license, either express, implied otherwise, granted under patents, copyrights other intellectual property rights Corporation others. While Corporation been making continuous effort enhance reliability semiconductor devices, possibility defects cannot eliminated entirely. minimize risks damage injury persons property arising from defect semiconductor device, customers must incorporate sufficient safety measures design, such redundancy, fire-containment, anti-failure features. devices classified into following three quality grades: "Standard", "Special", "Specific". Specific quality grade applies only devices developed based customer designated "quality assurance program" specific application. recommended applications device depend quality grade, indicated below. Customers must check quality grade each device before using particular application. Standard: Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade devices "Standard" unless otherwise specified NEC's Data Sheets Data Books. customers intend devices applications other than those specified Standard quality grade, they should contact sales representative advance. Anti-radioactive design implemented this product. 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