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MC92460EC/D Rev. 1.0, 7/2002 MC92460 HDLC Controller Hardware Specifcations
NCSD Applications
Freescale Semiconductor, Inc.
This document contains detailed information power considerations, DC/AC electrical characteristics, timing specifications MC92460 Multichannel HDLC Controller. following topics addressed: Topic Section 1.1, "Features" Section 1.2, "Electrical Thermal Characteristics" Section 1.2.1, Electrical Characteristics" Section 1.2.2, "Thermal Characteristics" Section 1.2.3, "Power Considerations" Section 1.2.4, "Power Dissipation" Section 1.2.5, Specifications" Section 1.2.5.1, "SYSCLK Timing" Section 1.2.5.2, "EXCLK Timing" Section 1.2.5.3, Timing" Section 1.3, "Pinout" Page
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Features
Figure shows block diagram MC92460.
64-bit 66.7 3.3V
Master Interface Unit Interface Arbiter
MPC8260
Freescale Semiconductor, Inc.
Register interrupt dual-port Kbyte
32-byte FIFO 64-bit
SRAM Communication Buffer (64-bit 4kW) BIST
FIFO PLLs more MC92460s
FIFO
HDLC Flag/Abort/Idle 0-Insert/Delete RxSD RxCK TxCK TxSD JTAG Channels
MC92460
Figure MC92460 Block Diagram
Features
following overview MC92460 feature set: Channels full-duplex HDLC channels Programmable channel assignment (any logical channel signal) Each channel default buffer descriptors number buffer descriptors channel configurable Controllers Maximum throughput 1919 Mbps; individual controllers operate 66.7 Mbps communication controllers operate asynchronously Programmable frame size (maximum 65,535 bytes) Transparent memory access with internal memory controller MC92460 directly connects with 64-bit data 32-bit address Supports 66.7 speed, with aggregate bandwidth 1919 Mbps depending
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type main memory used four MC92460's connected parallel supports multiple master design Communication Buffers Data Buffer Kbits on-chip memory data buffers Kbit communication buffer store bytes frame.
Features
channel virtual functionality executes between off-chip memory communication buffer Buffer Kbyte on-chip dual-port buffer descriptors
Freescale Semiconductor, Inc.
total 4096 buffer descriptors (2048 TxBD 2048 RxBD) JTAG Support Supports IEEE1149.1 JTAG controller standard Power Clocks Supports single-beat burst accesses On-chip baud rate generator (maximum 66.7 MHz) Separate power supplies core internal logic (1.8V) (3.3V) Package TPGA, 1.27 pitch
MOTOROLA
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Electrical Thermal Characteristics
1.2.1
Electrical Thermal Characteristics
Electrical Characteristics
This section provides electical specifications thermal characteristics MC92460.
This section describes electrical characteristics MC92460. Table shows maximum electrical ratings.
Table Maximum Temperatures Voltages
Rating Core supply voltage Symbol VDDH TSTG Value Name -0.3 -0.3 GND-0.3 Unit
Freescale Semiconductor, Inc.
supply voltage Input voltage Junction temperature Storage temperature range Ambient temperature
Table lists recommended operational voltage conditions.
Table Recommended Operating Conditions
Rating Core supply voltage supply voltage Input voltage Junction temperature Symbol VDDH Value 1.65 1.95 3.15 3.465 -0.3 Unit
This device contains circuitry protecting against damage high static voltage electrical fields; however, advised that normal precautions taken avoid application voltages higher than maximum-rated voltages this high-impedance circuit. Reliability operation enhanced unused inputs tied appropriate logic voltage level (either VCC). Table shows electrical characteristics.
Table Electrical Characteristics
TA=0 85°C; VDD=2.0±5% Vdc; VDDH=3.3±5% Vdc; GND=0Vdc; Load Capacitance 10pF Characteristics Input high voltage Input voltage Input leakage current HI-Z leakage current Signal input current Signal high input current Output high voltage VIN=VDDH VIN=VDDH, VIL=0.8V VIH=2.0V IOH=-7.0mA Conditions Symbol 3.465 Unit
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MOTOROLA
Table Electrical Characteristics (continued)
Electrical Thermal Characteristics
TA=0 85°C; VDD=2.0±5% Vdc; VDDH=3.3±5% Vdc; GND=0Vdc; Load Capacitance 10pF Output voltage A[0-31] AP[0-3] TT[0-4] TBST TSIZ[0-2] LBCLAIM TC[0-1] AACK ARTRY DBWO DH[0-31],DL[0-31] DP[0-7] DBDIS DRTRY Output voltage CLK[0-39] CLK[0-39] SD[0-39] SDBG SIRQ
Freescale Semiconductor, Inc.
IOL=7.0mA
IOL=5.0mA
MOTOROLA
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Electrical Thermal Characteristics
1.2.2
Thermal Characteristics
Table Maximum Temperatures Voltages
Characteristics Symbol Thermal Resistance Value 10.48 8.61 Unit
oC/W oC/W oC/W oC/W oC/W
Table describes thermal characteristics.
Flow
Thermal resistance TBGA
7.78 6.89
Freescale Semiconductor, Inc.
5.52 Linear Feet Minute
1.2.3
Power Considerations
average chip-junction temperature, obtained from following:
where
package thermal resistance, junction ambient, oC/W ambient temperature,
Power equations following:
VDDH chip total power dissipation, chip core power, VDDH VDDH
user-determined power dissipation input/output pins,
1.2.4
Power Dissipation
Table Maximum Core Power Dissipation (PVDD)
VDD(V) 1.95 SYSCLK Frequency (MHz) 66.7 IVDD (mA) PVDD (mW) PVDDH(mW)
Table describes maximum chip core power dissipation.
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Electrical Thermal Characteristics
1.2.5
1.2.5.1
Specifications
SYSCLK Timing
Table Clock Timing
Characteristics Symbol 60.0 15.0 tCL,tCH VIHC VILC 66.7 16.7 3.465 Unit
These specifications target specifications.
Table shows system clock timing.
Operation Frequency Clock period Clock pulse width
Freescale Semiconductor, Inc.
SYSCLK input high voltage SYSCLK input voltage SYSCLK Jitter
±200
Figure shows SYSCLK.
SYSCLK
tcyc
Figure SYSCLK
1.2.5.2
EXCLK Timing
Table Clock Timing
Table shows external clock timing.
Characteristics Operation Frequency Clock duty Clock Pulse width EXCLK input high voltage EXCLK input voltage EXCLK Jitter
Symbol
14.0
16.0 42.8 3.465 +200
Unit
tCL,tCH VIHC VILC
MOTOROLA
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Electrical Thermal Characteristics
Figure shows EXCLK.
EXSCLK
tcyc
Figure EXCLK
1.2.5.3
Timing
Freescale Semiconductor, Inc.
Figure shows HDLC external clock with polarity inverted. time specifications were measured expected load capacitance CL=8pF.
Serial
RxCK0-39 TxCK0-39
Input signal
RxSD0-39
Output signal
TxSD0-39
Figure HDLC External Clock
Figure shows HDLC internal clock (TxCK/RxCK output mode) whose polarity inverted.
Serial
RxCK0-39 TxCK0-39
Input signal
RxSD0-39
Output signal
TxSD0-39
Figure HDLC Internal Clock
Table shows electrical characteristics. frequency MHz.
Table Electrical Characteristics
Spec Characteristic HDLC input- external clock setup time Unit
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MOTOROLA
Table Electrical Characteristics
HDLC input -external clock hold time HDLC output- external clock setup time HDLC input- internal clock setup time HDLC input- internal clock hold time HDLC output- internal clock setup time
Electrical Thermal Characteristics
Figure shows interaction several signals.
SYSCLK
Freescale Semiconductor, Inc.
input signal
Data input All_other_ Input
S13, S13' AACK/TA/TEA_output
BR/BG/DBG/SBG/SDBG_output Data output All_other_output
Figure Signals
MOTOROLA
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Electrical Thermal Characteristics
Table shows signal characteristics. frequency MHz.
Table Input/Output Characteristics
Spec Characteristic TA/TEA input TA/TEA input Data input signals Data input signals other input signals other input signals AACK/TEA output output BR/BG/DBG/SBG/SDBG output Data output signals other output signals Unit
Freescale Semiconductor, Inc.
S13'
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MOTOROLA
Freescale Semiconductor, Inc.
Ball
CoreVdd23 CoreVdd17 PowGnd33 CoreGnd19 PowVdd29 PowVdd7 PowVdd5
scan_out_k CoreGnd15 scan_out_h CoreGnd16 PowGnd27 PowGnd28 CoreGnd17 PowGnd30 PowGnd32 PowVdd4 PowVdd6
PowVdd26
PowVdd28
PowVdd36 scan_out_e PowGnd23 CoreGnd23 PowGnd24
MOTOROLA
PowGnd22 scan_out_j CoreVdd15 scan_out_g PowGnd25 CoreVdd16 CoreVdd24 PowGnd29 CoreGnd25 PowGnd34 CoreVdd25 PowVdd3 PowVdd30 PowVdd23 scan_out_l CSA2 scan_out_f CoreGnd24 PowGnd31 CoreGnd18 CoreVdd18 PowGnd35 PowVdd2
PowVdd27
PowVdd25
TEST0
PowVdd35
TEST2
PowVdd24
SMODE1 PowVdd22 PowGnd26 scan_out_i CoreVdd19 PowVdd1 TSIZ0
SMODE0
CoreGnd0
scan_out_d AMODE TBST TSIZ1
CSA5
CSA3
TEST3
PowGnd0
CoreVdd0
Pinout
CoreGnd14 CoreVdd14 TSIZ2 G_DBG
CSA1
PowGnd21
DBWO
AACK ARTRY
HRESET CSA0
PCMD
TEST1
DBDIS
PowGnd1
TRST
SDBG PowGnd2
RxCK39 ACoreGnd2
PLL2O
ACoreVdd2
EXCLK
CoreGnd1
CoreGnd13 TxCK39
scan_out_c
RxSD39
CoreVdd13
CoreVdd1 PowGnd3
PowGnd20 TxCK38
RxSD38
RxCK38
TxSD39
TxSD37 TxCK37
RxSD37
RxCK37
TxSD38
PowGnd4
RxSD35 RxCK35
TxCK36
RxSD36
RxCK36
PowGnd5
RxSD34 RxCK34
CoreVdd12
TxSD36
TxCK35
CoreGnd20 CoreGnd2 CoreVdd2
PowGnd19 RxCK33
TxSD35
CoreGnd12 scan_out_b
PowGnd6
RxSD32 TxCK32
TxCK34
RxSD33
TxSD34
PowGnd7 CoreVdd20
TxCK31 TxSD31
TxCK33
TxSD33
RxCK32
CoreVdd11 TxCK30
TxSD32
RxCK31
RxSD31
CoreGnd3 PowGnd8
Table Assignments
RxCK29 TxCK29
RxCK30
scan_out_a
RxSD30
DRTRY LBCLAIM SIRQ CoreVdd3
RxSD28 RxCK27
CoreGnd11
TxSD30
PowGnd18
PowGnd9 CSA6
TxCK27 scan_in_k
RxSD29
TxSD29
RxCK28
MC92460 HDLC Controller Hardware Specifications
CoreVdd10 CoreGnd10 TxCK25 TxCK24 PLL1O TxSD24 PowVdd15 RxSD22 CoreVdd9 RxSD20 TxSD19 PowGnd15 RxCK16 RxCK15 RxSD14 RxSD13 TxCK12 TxSD11 PowGnd13 RxCK8 RxCK7 RxSD6 RxSD5 TxSD4 CoreGnd5 PowGnd11 PowVdd8 PowVdd16 RxCK22 PowGnd16 TxSD21 RxSD19 CoreVdd22 RxSD17 CoreGnd8 RxSD15 CoreGnd22 TxCK13 CoreGnd7 TxCK11 TxSD10 TxSD9 CoreVdd6 TxSD7 TxSD6 TxSD5 RxSD3 RxSD2 RxCK1 TxSD23 TxSD22 CoreGnd9 TxCK20 TxCK19 TxCK18 TxCK17 RxSD16 TxCK15 TxCK14 TxSD13 RxSD12 RxSD11 TxCK10 TxCK9 TxSD8 TxCK7 TxCK6 TxCK5 TxCK4 CoreVdd5 CSA8 TxCK22 RxCK21 TxCK21 TxSD20 RxCK18 TxSD18 CoreVdd8 TxCK16 TxSD15 TxSD14 RxCK13 TxSD12 RxCK10 CoreVdd21 RxSD9 TxCK8 CoreGnd6 CoreGnd21 RxCK5 RxSD4 TxCK3 RxCK2 scan_in_j RxSD21 RxCK20 RxCK19 RxSD18 RxCK17 TxSD17 TxSD16 RxCK14 PowGnd14 RxCK12 CoreVdd7 RxCK11 RxSD10 RxCK9 RxSD8 RxSD7 RxCK6 PowGnd12 RxCK4 RxCK3 TxSD3
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TxCK28
TxSD28
RxSD27
MODE PowGnd10 CSA4
TxSD27
RxCK26
RxSD26
TxCK0 CoreGnd4 CSA7
TxCK26
PowGnd17
TxSD26
RxSD0 ACoreVdd1 SYSCLK CoreVdd4
RxCK25
RxSD25
TxSD25
PowVdd9 RxCK0 ACoreGnd1 TxSD0
RxSD24
RxCK24
RxCK23
RxSD1 PowVdd10 TxSD1 PowVdd31
PowVdd34
RxSD23
PowVdd17
TxCK2 TxCK1 PowVdd11 PowVdd13
PowVdd21
PowVdd18
TxCK23
TxSD2 PowVdd32 PowVdd14 PowVdd12
PowVdd19
PowVdd20
PowVdd33
Ball
Pinout
REACH USA/EUROPE/LOCATIONS LISTED: Motorola Literature Distribution P.O. 5405, Denver, Colorado 80217 1-303-675-2140 1-800-441-2447 JAPAN: Motorola Japan Ltd. SPS, Technical Information Center 3-20-1, Minami-Azabu Minato-ku Tokyo 106-8573 Japan 81-3-3440-3569 ASIA/PACIFIC:
Information this document provided solely enable system software implementers Motorola products. There express implied copyright licenses granted hereunder design fabricate integrated circuits integrated circuits based information this document. Motorola reserves right make changes without further notice products herein. Motorola makes warranty, representation guarantee regarding suitability products particular purpose, does Motorola assume liability arising application product circuit, specifically disclaims liability, including without limitation consequential incidental damages. "Typical" parameters which provided Motorola data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. Motorola does convey license under patent rights rights others. Motorola products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure Motorola product could create situation where personal injury death occur. Should Buyer purchase Motorola products such unintended unauthorized application, Buyer shall indemnify hold Motorola officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that Motorola negligent regarding design manufacture part.
Freescale Semiconductor, Inc.
Motorola Semiconductors H.K. Ltd. Silicon Harbour Centre, King Street Industrial Estate, N.T., Hong Kong 852-26668334 TECHNICAL INFORMATION CENTER: 1-800-521-6274 HOME PAGE: DOCUMENT COMMENTS: (512) 933-2625 Attn: NCSD Applications Engineering
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MC92460EC/DEC/D
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