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N-Channel Reduced Fast Switching MOSFET FEATURES PRODUCT SUMMARY


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Si7860ADP
N-Channel Reduced Fast Switching MOSFET
FEATURES PRODUCT SUMMARY
rDS(on)
0.0095 0.0125
TrenchFETr Power MOSFET Optimized High Efficiency Thermal Resistance PowerPAKr Package with 1.07-mm Profile 100% Tested
APPLICATIONS
Buck Converter High Side Side Synchronous Rectifier Secondary Rectifier
PowerPAK SO-8
6.15
5.15
Bottom View Ordering Information: Si7860ADP-T1-E3
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current 150_C)a Pulsed Drain Current Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction Storage Temperature Range 25_C 70_C 25_C 70_C
Symbol
secs
Steady State
Unit
Tstg
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction Ambient (MOSFET)a Junction-to-Ambient Maximum Junction-to-Case (Drain) Notes Surface Mounted Board. Document Number: 72651 S-32674-Rev. 29-Dec-03 www.vishay.com Steady State Steady State RthJA RthJC
Symbol
Typical
Maximum
Unit
_C/W
Si7860ADP
MOSFET SPECIFICATIONS 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltagea VGS(th) IGSS IDSS ID(on) rDS(on) VGS, 70_C 0.0079 0.0105 0.70 0.0095 0.0125 "100
Symbol
Test Condition
Unit
Dynamicb
Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate-Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time td(on) td(off) di/dt A/ms VGEN
Notes Pulse test; pulse width duty cycle Guaranteed design, subject production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
thru Drain Current Drain Current
Transfer Characteristics
125_C 25_C -55_C
Drain-to-Source Voltage
Gate-to-Source Voltage
www.vishay.com
Document Number: 72651 S-32674-Rev. 29-Dec-03
Si7860ADP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance Drain Current
0.015 2500
Capacitance
DS(on) On-Resistance
0.012
Capacitance (pF)
2000
Ciss
0.009
1500
0.006
1000 Coss Crss
0.003
0.000
Drain Current
Drain-to-Source Voltage
Gate Charge
Gate-to-Source Voltage 2.00
On-Resistance Junction Temperature
DS(on) On-Resistance (Normalized)
1.75
1.50
1.25
1.00
0.75
0.50
Total Gate Charge (nC)
Junction Temperature (_C)
Source-Drain Diode Forward Voltage
0.040
On-Resistance Gate-to-Source Voltage
150_C
DS(on) On-Resistance
0.032
Source Current
0.024
0.016 0.008
25_C
0.00
0.000
Source-to-Drain Voltage
Gate-to-Source Voltage
Document Number: 72651 S-32674-Rev. 29-Dec-03
www.vishay.com
Si7860ADP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
GS(th) Variance
Single Pulse Power, Juncion-To-Ambient
Power
-0.3
-0.6
-0.9
0.001 0.01 Time (sec) Temperature (_C)
Safe Operating Area, Junction-to-Case
Limited rDS(on) Drain Current 25_C Single Pulse
0.01 0.01
Drain-to-Source Voltage
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient Thermal Impedance Duty Cycle
Notes:
0.05
0.02
Duty Cycle,
Unit Base RthJA 125_C/W
Single Pulse 0.01 Square Wave Pulse Duration (sec)
PDMZthJA(t) Surface Mounted
www.vishay.com
Document Number: 72651 S-32674-Rev. 29-Dec-03
Si7860ADP
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient Thermal Impedance Duty Cycle
0.05 0.02 Single Pulse 0.01 Square Wave Pulse Duration (sec)
Document Number: 72651 S-32674-Rev. 29-Dec-03
www.vishay.com

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