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Quality Reliability Assurance Handling Precautions recent years,


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Quality Reliability Assurance Handling Precautions
Quality Reliability Assurance Handling Precautions
recent years, technical revolutions have become almost daily occurrence electronics industry. This accompanied increasing application semiconductors both consumer industrial sectors, demands higher quality higher reliability. Toshiba making every effort improve both quality reliability with following quality control system which incorporates product design, quality assurance parts materials received, manufacturing process quality assurance, shipping quality reliability assurance, quality after-service based user demands market survey data.
Quality Reliability Assurance
Quality Assurance
Trying sense customer's needs, best incorporate quality reliability required customer into design, while considering safety (Product Liability) products. Quality reliability evaluation performed developed products according Toshiba's reliability test standard which prepared conformity with JIS, EIAJ, MIL, etc., thereby certifying design. parts materials standardized through engineering department quality assurance department. After design accepted, standardization performed engineering department parts materials, process plan, inspection plan. Engineering Institution Works (EW) then established working detail. quality reliability evaluation performed mass-produced products experimental basis. mass production, production department control manufacturing process, environment facility, quality assurance department. Quality assurance performs incoming inspection parts materials, modification control, instrument control, periodical reliability test line audit. production technology divisions also participate process improvement, automatization, etc. Education training quality reliability, given workers, inspectors, engineers small groups (QC/ZD movement). shipping finished products, quality assurance test performed quality assurance department. then commence preparation specifications meeting pre-arranged quality reliability standards inspection reports discrepant products "quick action" motto. Figure shows quality assurance system semiconductor.
030901
QUA-1
2002-02-20
Quality Reliability Assurance Handling Precautions
Quality Assurance Level Semiconductor Products
Quality Assurance (AQL display: accordance with ANSI 1.4-1993)
Table
Item Electrical Characteristics Appearance Serious Defect Minor Defect
0.15% 0.15% 0.25%
Table shows quality assurance level, which complied with sampling inspection method (AGL) MIL-STD-105E.
030901
QUA-2
2002-02-20
Quality Reliability Assurance Handling Precautions
Department Step Planning
Market Customers
Marketing
Application Engineering
Manufacturing Engineering
Manufacturing
Production Control
Subcontractors
DR/AT
Control System Check Sheets Meetings Development Development Planning Meeting
Market Research Review Specifications Determine Development Plan Determine Specification Product Design Design Review, Safety Check Parts Materials Approval Trial Production Developed Product, Evaluation Characteristics Evaluation Developed Product Design Approval Execution Plan Execution Meeting Development Design Planning Meeting
Development Design
Trial Production
Standardization (Parts Materials, Process Plan, Inspection Plan) Qualification Preparation Parts Engineering Materials Instructions Trial Production Evaluation Trial Production Approval Production Quality Transfer Full Production Execution Plan
Execution Meeting
Execution Meeting Review Meeting Transfer Meeting
Full Production
Full Production Subcontracting Control Changes Evaluation Production Product Approval Production Product Meeting Confirmation Shipped Quality Delivery Quality, Engineering Complaint Service Failure Analysis Complaint Complaint Handling Shipment Execution Plan Execution Meeting Review Meeting
DAT: QAT:
Design Review Design Approval Test Quality Approval Test Check Sheet
Improvement Manufacturing Technology Promotion Automatization Inspection Incoming Parts Line Audit Reliability Test Measurement Control Quality Training Education Manufacturing Control Environmental Control Facility Control Assurance Quality, Cost Delivery Control Delivery Quantity
Figure
Quality Assurance (QA) System Procedural Flow
030901
QUA-3
2002-02-20
Quality Reliability Assurance Handling Precautions
Reliability Microcontrollers
microcontroller products, reliability estimated within following temperature range. 85°C (junction temperature) calculated using following formula: Operating environment temperature product [°C] operating environment temperature temperature surrounding environment. thermal effects operation product taken into account. Average power consumption product
Thermal resistance package
Note When operating device outside range 85°C extended periods, please contact your nearest Toshiba office authorized Toshiba dealer. Note details value please contact your nearest Toshiba office authorized Toshiba dealer.
030901
QUA-4
2002-02-20
Quality Reliability Assurance Handling Precautions
Handling Precautions Microcontrollers
Mounting Precautions
Plastics have basically porous feature. When chip (especially which thin plastic surface) heated state moisturized soldered reflow soldering method, moisture vaporized temperature rises cause package expanded. borderd surface between lead frame plastic material peeled cause crack. These bring serious troubles reliability. order prevent hygroscopity enable high heat treatment after absorbing moisture, Toshiba uses dampproof packing and/or heat proof tray. Recommended Methods Soldering Flat Packages Table lists recommended method soldering flat packages. have question request, please refer PACKAGE MANUAL" contact your local offices. overall heating method, recommended mounting methods conditions after opening pack differ depending products used. Table details. locally heating lead part, soldering iron method recommended. other localized heating methods, refer PACKAGE MANUAL" contact your Toshiba local offices.
030901
QUA-5
2002-02-20
Quality Reliability Assurance Handling Precautions
Table Soldering method Localized heating method
Recommended soldering methods precautions when mounting Mounting method Soldering iron method Mounting precaution recommended soldering conditions follows: EIAJ ED-4701A-133 Standard: Environment test, soldering heatresistance test (SMD) Soldering method: Soldering (lead only) Soldering condition: 350°C seconds. 260°C seconds.
Overall heating method
Wave soldering method Apply preheating seconds (Solder flow) temperature 150°C.
lead insertion-type packages, complete solder flow within seconds with temperature stopper (or, there stopper, location more than from body) which does exceed 260°C. surface-mount packages, complete soldering within seconds temperature 250°C less order prevent thermal stress device.
Short infrared reflow method middle infrared reflow details, contact your local Toshiba dealer. Because thermal stress severe, with solder dipping, infrared reflow method recommended some products. details, contact your local Toshiba dealer. recommended conditions reflow follows: EIAJ ED-4701 A-133 Standard: Environment test Soldering method: reflow (with optional middle infrared reflow process) middle infrared reflow Pre-heating: 160°C, seconds. Reflow: 240°C more than 210°C, seconds. Number reflows: Maximum times within allowable period specified soldering temperatures based temperature package surface. sample recommended temperature profile, refer Figure 2.1.
030901
QUA-6
2002-02-20
Quality Reliability Assurance Handling Precautions
(°C) Package Surface Temperature
seconds seconds TIME seconds)
Figure
Sample recommended temperature profile infrared reflow method
030901
QUA-7
2002-02-20
Quality Reliability Assurance Handling Precautions
Method
Heat-proof tray (occasionally non-heat-proof)
2.1.1
Precaution Pack
Figure shows tray type pack form. Precaution handling pack products follows. toss drop avoid damaging devices and/or moisture proof bag. Desiccant form granulated silica includes blue indicator beads which become transparent when moisture present, such torn opened. this case, devices must high temperature baked remove moisture prior solder mounting. Store pack 30°C 90%RH. After opening pack mount device within months date seal. humidity indicator entirely pink when device unpacked, when 12month duration expired treat device before high temperature (bake more than 125°C 20h) remove moisture. quickly product should used after pack opened depends product. Tables details. time limit expired when devices unpacked, they should baked. Devices heat-proof trays should baked 125°C least 20h. Heat-proof trays bear mold marking "HEAT PROOF" careful bend leads when baking devices. Binding trays using plastic tapes trays rebound with plastic tapes after having been untied, tapes should used shown Figure (a). tape tied lengthwise along trays tray edges break.
Silica
Indicator
Heat proof tray
Plastic band Moisture proof (Aluminum laminate)
Label Heat seal Turn under
Corrugated cardboard
Shipping carton
Corrugated cardboard
Sealing tape
Figure
SMDs pack Form
030901
QUA-8
2002-02-20
Quality Reliability Assurance Handling Precautions
Table SYMBOL 168h
Usable period after opening moisture proof bags
Usable period after opening moisture proof bags Products sealed moisture proof packing should stored temperature below 30°C relative humidity below 60%, should used within hours week), after opened. products kept beyond hours week) after opened, products should baked least hours 125°C before mounted. After baked, products should stored temperature below 30°C relative humidity below 60%, should used within hours. Products sealed moisture proof packing should stored temperature below 30°C relative humidity below 60%, should used within hours days), after opened. products kept beyond hours (3days) after opened, products should stored temperature below 30°C relative humidity below 60%, should used within hours days). Products sealed moisture proof packing should stored temperature below 30°C relative humidity below 60%, should used within hours days), after opened. products kept beyond hours days) after opened, products should baked least hours 125°C before mounted. After baked, products should stored temperature below 30°C relative humidity below 60%, should used within hours days). Products sealed moisture proof packing should stored temperature below 30°C relative humidity below 60%, should used within hours day), after opened. products kept beyond hours day) after opened, products should baked least hours 125°C before mounted. After baked, products should stored temperature below 30°C relative humidity below 60%, should used within hours days). Products sealed moisture proof packing should stored temperature below 30°C relative humidity below 60%, should used within hours, after opened. products kept beyond hours after opened, products should baked least hours 125°C before mounted. After baked, products should stored temperature below 30°C relative humidity below 60%, should used within hours. details, contact your Toshiba local offices. Overall heating method recommended mounting soldering iron method localized heating method.
030901
QUA-9
2002-02-20
Quality Reliability Assurance Handling Precautions
900, 900/H, 900/L, 900/H2, 900/L1 Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (1/2) Products Name
TMP96C141BF TMP96C041BF TMP96CM40F TMP96PM40F TMP96C031ZF TMP93CM40F TMP93CS40F TMP93CS41F TMP93PS40F TMP93CS40DF TMP93CS41DF TMP93PS40DF TMP93CW40DF TMP93CW41DF TMP93PW40DF TMP93CS42AF TMP93PS42AF TMP93CW46AF TMP93PW46AF TMP93CS44F TMP93CS45F TMP93PS44F TMP93CU44DF TMP93CW44DF TMP93PW44ADF TMP93CS32F TMP93PW32F TMP93CS20F TMP93PW20AF TMP93CT76F TMP93CU76F TMP93CW76F TMP93CF76F TMP93CF77F TMP93PW76F TMP93PF76F TMP93C071F TMP95C061BF TMP95C063F TMP95C001F TMP95CS64F TMP95C265F
Table
Package
P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP100-1414-0.50 P-QFP100-1414-0.50 P-QFP100-1414-0.50 P-QFP100-1414-0.50 P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-QFP100-1414-0.50 P-QFP100-1414-0.50 P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP80-1212-0.50A P-LQFP80-1212-0.50A P-LQFP80-1212-0.50A P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP64-1414-0.80A P-QFP64-1414-0.80A P-LQFP144-1616-0.40 P-LQFP144-1616-0.40 P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP-100-1420-0.65A P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP120-2828-0.80B P-QFP100-1414-0.50 P-QFP144-2020-0.50 P-QFP64-1414-0.80A P-LQFP100-1414-0.50D P-LQFP100-1414-0.50C
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) C(48h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) C(48h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h)
A(168h) A(168h) A(168h) B(72h) A(168h) A(168h)
A(168h) A(168h) A(168h) B(72h) A(168h) A(168h)
Note Note
September, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-10
2002-02-20
Quality Reliability Assurance Handling Precautions
Table Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (2/2) Products Name
TMP95CW64F TMP95CW65F TMP95PW64F TMP95FY64F TMP95CS66F TMP95CS54F TMP95PS54F TMP95CU54AF TMP95CW54AF TMP95FW54AF TMP94C241CF TMP94C251AF TMP94FU81F TMP91CW18AF TMP91PW18AF TMP91CW12F TMP91PW12F TMP91CW12AF TMP91FY12AF TMP91CY22F TMP91FY22F TMP91CU10F TMP91PW10F TMP91CW11F TMP91PW11F TMP91C219F TMP91C219F TMP91C829F TMP91C829F TMP91C815F TMP91C016F TMP91C025F TMP91C824F
Package
P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-QFP100-1414-0.50E P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50E P-QFP160-2828-0.65A P-QFP144-2020-0.50 P-LQFP100-1414-0.50C P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-LQFP100-1414-0.50C P-LQFP100-1414-0.50C P-LQFP100-1414-0.50D P-LQFP100-1414-0.50E P-LQFP100-1414-0.50D P-LQFP100-1414-0.50E P-LQFP100-1414-0.50C P-LQFP100-1414-0.50D P-LQFP100-1414-0.50C P-LQFP100-1414-0.50C P-LQFP100-1414-0.50B P-LQFP100-1414-0.50D P-LQFP100-1414-0.50B P-LQFP100-1414-0.50D P-TQFP128-1414-0.40 P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D P-LQFP100-1414-0.50D
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
February, 2002 Symbols (168h), (72h), (48h), (24h), (12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-11
2002-02-20
Quality Reliability Assurance Handling Precautions
Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (1/2) Products Name
TMP90C840AF TMP90C841AF TMP91C640F TMP91C641F TMP90CM40AF TMP90C041AF TMP90C141F TMP90C441F TMP90C802AM TMP90C803AM TMP90CH02M TMP90CH03M TMP90C400F TMP90C401F TMP90C800F TMP90C801F TMP90C844AF TMP90CH44F TMP90C845AF TMP90CH45F TMP90CM36F TMP90CM37F TMP90CM38F TMP90CM39F TMP90C051F TMP90CS36F TMP90CS37F TMP90CS38F TMP90CS39F TMP90C848F TMP91P640F TMP90PM40F TMP90P802AM TMP90PH02M TMP90P800F TMP90PH44F TMP90PM36F TMP90PM38F TMP90PS36F TMP90PS38F
Table
Package
P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-SSOP40-450-0.80 P-SSOP40-450-0.80 P-SSOP40-450-0.80 P-SSOP40-450-0.80 P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1420-0.80B P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-SSOP40-450-0.80 P-SSOP40-450-0.80 P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP80-1414-0.65A P-QFP80-1414-0.65A P-QFP44-1414-0.65A P-QFP44-1414-0.65A
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
Note
September, 2001 Ensure that conditions top/bottom heating using long/medium infrared reflow method strictly adhered even when this method used combination with reflow method. Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-12
2002-02-20
Quality Reliability Assurance Handling Precautions
Table
Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (2/2) Products Name Package
P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP100-2222-0.80A P-QFP100-1420-0.65A P-QFP100-2222-0.80A P-QFP100-1420-0.65A P-QFP100-2222-0.80A P-QFP100-2222-0.80A P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27 P-QFJ84-S115-1.27
reflow
A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
TMP90PH48F TMP91P642F TMP91C642AF TMP90PM42F TMP90PM42DF TMP90CH42F TMP90CH42DF TMP90CK42F TMP90CK42DF TMP90PS74DF TMP90CM36T TMP90CM37T TMP90PM36T TMP90CM38T TMP90CM39T TMP90PM38T TMP90CS36T TMP90CS37T TMP90PS36T TMP90CS38T TMP90CS39T TMP90PS38T
Note Note
Note
September, 2001 Ensure that conditions top/bottom heating using long/medium infrared reflow method strictly adhered even when this method used combination with reflow method. Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-13
2002-02-20
Quality Reliability Assurance Handling Precautions
Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (1/3) Products Name
TMP87C800F TMP87CH00F TMP87PH00F TMP87C800DF TMP87CH00DF TMP87CH00LF TMP87PH00DF TMP87PH00LF TMP87C807U TMP87C408M TMP87C408LM TMP87C808M TMP87C808LM TMP87C408DM TMP87P808M TMP87P808LM TMP87C814F TMP87CH14F TMP87CK14F TMP87CM14F TMP87PM14F TMP87CC20F TMP87CH20F TMP87PH20F TMP87CK20AF TMP87CM20AF TMP87PM20F TMP87CH21F TMP87CH21BF TMP87CH21DF TMP87CH21BDF TMP87CM21F TMP87CM21DF TMP87PP21F TMP87PP21DF TMP87CM23F TMP87CP23F TMP87PP23F TMP87CM24AF TMP87CP24AF TMP87PP24AF TMP87CH29U TMP87CK29U TMP87CM29U TMP87PM29U
Table
reflow
A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-14
2002-02-20
Quality Reliability Assurance Handling Precautions
Table
Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (2/3) Products Name
TMP87CH38F TMP87CK38F TMP87CM38F TMP87CP38F TMP87CS38F TMP87PS38F TMP87CM39F TMP87CP39F TMP87CS39F TMP87PS39F TMPA8700CHF TMPA8700CKF TMPA8700CMF TMPA8700CPF TMPA8700CSF TMPA8700PSF TMPA8701CHF TMPA8701CKF TMPA8701CMF TMP87C840F TMP87CC40F TMP87CH40F TMP87PH40AF TMP87CK40AF TMP87CK40F TMP87CM40AF TMP87PM40AF TMP87C841F TMP87CC41F TMP87CH41F TMP87CK41F TMP87CM41F TMP87PM41F TMP87C841U TMP87CC41U TMP87CH41U TMP87CK41U TMP87CM41U TMP87PM41U TMP87C447U TMP87C847U TMP87C847LU TMP87CH47U TMP87CH47LU TMP87PH47U TMP87PH47LU TMP87CH48U
reflow
A(168h) A(168h) D(24h) D(24h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) D(24h) D(24h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-15
2002-02-20
Quality Reliability Assurance Handling Precautions
Table
Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (3/3) Products Name
TMP87CH48DF TMP87PH48U TMP87PH48DF TMP87CM53F TMP87PM53F TMP87CM64F TMP87CP64F TMP87CS64F TMP87PS64F TMP87CS68DF TMP87PS68DF TMP87CC70F TMP87CH70F TMP87CK70AF TMP87CM70AF TMP87CH70BF TMP87CM70BF TMP87PM70F TMP87CM71F TMP87CN71F TMP87CP71F TMP87CS71F TMP87PS71F TMP87CH74AF TMP87CM74AF TMP87PM74F TMP87CH75F TMP87CM75F TMP87PM75F TMP87CC78F TMP87CH78F TMP87CK78F TMP87CM78F TMP87PM78F
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-16
2002-02-20
Quality Reliability Assurance Handling Precautions
870/C Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method Products Name
TMP86CH06U TMP86PH06U TMP86C420F TMP86C420U TMP86C820F TMP86C820U TMP86C829AF TMP86C829AU TMP86CH29AF TMP86CH29AU TMP86CM29AF TMP86CM29AU TMP86PM29AF TMP86PM29AU TMP86CM41F TMP86FS41F
Table
Package
P-QFP44-1010-0.80 P-QFP44-1010-0.80 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-LQFP64-1010-0.50 P-QFP64-1414-0.80A P-QFP64-1414-0.80B
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-17
2002-02-20
Quality Reliability Assurance Handling Precautions
870/X Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method Products Name
TMP88CK48F TMP88CM48F TMP88CS48AF TMP88CK49F TMP88CM49F TMP88PS49F TMP88C060F TMP88CU74F TMP88PU74F TMP88CP76F TMP88CS76F TMP88PS76F TMP88CP77F TMP88CS77F TMP88PU77F
Table
Package
P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-LQFP80-1212-0.50A P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP100-1420-0.65A
reflow
A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) B(72h) A(168h) B(72h)
Infrared reflow
A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) A(168h) A(168h) B(72h) B(72h) A(168h) B(72h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-18
2002-02-20
Quality Reliability Assurance Handling Precautions
Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (1/3) Products Name
TMP47C101M TMP47C201M TMP47C102M TMP47C202M TMP47P202VM TMP47C103M TMP47C203M TMP47C206M TMP47P206VM TMP47C241VM TMP47P241VM TMP47P403VM TMP47C222F TMP47C422F TMP47P422VF TMP47C243M TMP47C243DM TMP47C443M TMP47C443DM TMP47P443VM TMP47P443VDM TMP47E186M TMP47E187M TMP47P186M TMP47P187M TMP47E885AIF TMP47E885AWF TMP47P885F TMP47C200BF TMP47C400BF TMP47P400VF TMP47C407AF TMP47P407VF TMP47C210AF TMP47C410AF TMP47P410AF TMP47C216F TMP47C416F TMP47P416VF TMP47C221ADF TMP47C421ADF TMP47P421ADF TMP47C423ADF
Table
Package
P-SOP16-300-1.27 P-SOP16-300-1.27 P-SOP20-300-1.27 P-SOP20-300-1.27 P-SOP20-300-1.27 P-SOP28-450-1.27 P-SOP28-450-1.27 P-SOP20-300-1.27 P-SOP20-300-1.27 P-SOP28-450-1.27 P-SOP28-450-1.27 P-SOP28-450-1.27 P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-SOP28-450-1.27 P-SSOP30-56-0.65 P-SOP28-450-1.27 P-SSOP30-56-0.65 P-SOP28-450-1.27 P-SSOP30-56-0.65 P-SOP16-300-1.27 P-SOP16-300-1.27 P-SOP16-300-1.27 P-SOP16-300-1.27 P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) C(48h) C(48h) C(48h) C(48h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) D(24h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) C(48h) C(48h) C(48h) C(48h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) D(24h) A(168h) A(168h) A(168h) A(168h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2. QUA-19 2002-02-20
030901
Quality Reliability Assurance Handling Precautions
Table
Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (2/3) Products Name Package
P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP80-1420-0.80B P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP44-1414-0.80D P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP100-1420-0.65A
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) B(72h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
TMP47C440BF TMP47P440VF TMP47C441AF TMP47P441AF TMP47C446ADF TMP47P446VDF TMP47C452BF TMP47P452VF TMP47C453AF TMP47P453VF TMP47C456ADF TMP47C434AF TMP47C634AF TMP47C800F TMP47P800F TMP47C620DF TMP47C820DF TMP47P820VDF TMP47C623F TMP47C823F TMP47P823VF TMP47C834F TMP47P834F TMP47C640F TMP47C840F TMP47P840VF TMP47C647F TMP47C847F TMP47P847VF TMP47C850F TMP47P850VF TMP47C853F TMP47P853VF TMP47C857F TMP47C457F TMP47P857F TMP47C655F TMP47C855F TMP47P855VF TMP47C858F
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-20
2002-02-20
Quality Reliability Assurance Handling Precautions
Table
Storage conditions, permissible usage Period after unpacking baking requirements each soldering method (3/3) Products Name Package
P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP80-1420-0.80B P-QFP64-1420-1.00A P-QFP64-1420-1.00A P-QFP64-1420-1.00A
reflow
A(168h) A(168h)
Infrared reflow
A(168h) A(168h)
TMP47C660AF TMP47C860AF TMP47P860VF TMP47C1220F TMP47C1620F TMP47P1620VF TMP47C1260F TMP47C1660F TMP47P1660VF
A(168h) A(168h) B(72h) A(168h) A(168h) B(72h)
A(168h) A(168h) B(72h) A(168h) A(168h) B(72h)
Note Note
March, 2001 Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-21
2002-02-20
Quality Reliability Assurance Handling Precautions
68000 Series Storage conditions, permissible usage Period after unpacking baking requirements each soldering method Products Name
TMP68301AF-xx TMP68301AKF-xx TMP68303DF-xx TMP68305F-xx TMP68301AFR-xx TMP68301AKFR-xx TMP68HC003F-xx TMP68204F-xx
Table
Package
P-QFP100-2222-0.80A P-QFP100-2222-0.80A P-QFP100-2222-0.80A P-QFP100-2222-0.80A P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFP80-1420-0.80B P-QFP160-2828-0.65A
reflow
A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
A(168h) A(168h) A(168h) A(168h)
Note Note
Note
February, 1998 Ensure that conditions top/bottom heating using long/medium infrared reflow method strictly adhered even when this method used combination with reflow method. Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
Series Table 2.10 Storage conditions, permissible usage Period after unpacking baking requirements each soldering method Products Name
TMPZ84C011BF TMPZ84C015BF TMPZ84C013AT TMPZ84C112AF TMPZ84C711AF TMPZ84C810AF
Package
P-QFP100-1420-0.65A P-QFP100-1420-0.65A P-QFJ84-S115-1.27 P-QFP64-1420-1.00A P-QFP144-2626-0.65B P-QFP100-1420-0.65A
reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Infrared reflow
A(168h) A(168h) A(168h) A(168h) A(168h) A(168h)
Note Note
Note
September, 1994 Ensure that conditions top/bottom heating using long/medium infrared reflow method strictly adhered even when this method used combination with reflow method. Symbols (168h), (72h), (48h), (24h), E(12h), indicate maximum permissible period between unpacking mounting device, required storage conditions device. details these conditions, please refer Table 2.2.
030901
QUA-22
2002-02-20
Quality Reliability Assurance Handling Precautions
2.1.2
Writing type Microcontrollers-Recommended Flow
case blank (One Time PROM) type MCU, completely possible screen defect parts that occur during assembly process, because possible perform programming test after chip assembled plastic package. result, recommended following screening process maintain quality reliability type after data programmed.
Programming verification with EPROM programmer.
Stored high temperature. 125°C, more than hours.
Data verification with EPROM programmer
Board assembly
details initial failure rate OTP-type microcontrollers when screening performed 125°C hours more after programming, please contact your Toshiba local offices.
Figure Recommended Screening flow chart type
030901
QUA-23
2002-02-20
Quality Reliability Assurance Handling Precautions
Transport Precautions
device packaging material should handled with care. avoid damage device, toss drop During transport, ensure that device subjected mechanical vibration shock. Avoid getting devices wet. Moisture also adversely affect packaging nullifying effect anti-static agent.
Using Toshiba Semiconductor Safely
TOSHIBA continually working improve quality reliability products. Nevertheless, semiconductor devices general malfunction fail their inherent electrical sensitivity vulnerability physical stress. responsibility buyer, when utilizing TOSHIBA products, comply with standards safety making safe design entire system, avoid situations which malfunction failure such TOSHIBA products could cause loss human life, bodily injury damage property. developing your designs, please ensure that TOSHIBA products used within specified operating ranges forth most recent TOSHIBA products specifications. Also, please keep mind precautions conditions forth "Handling Guide Semiconductor Devices," "TOSHIBA Semiconductor Reliability Handbook" etc. TOSHIBA products listed this document intended usage general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products neither intended warranted usage equipment that requires extraordinarily high quality and/or reliability malfunction failure which cause loss human life bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, types safety devices, etc. Unintended Usage TOSHIBA products listed this document shall made customer's risk.
030901
QUA-24
2002-02-20
Quality Reliability Assurance Handling Precautions
Product-Specific Precautions Usage Considerations
2.4.1 Using Resonators Listed Under "Recommended Types"
Resonators recommended with Toshiba products microcontroller oscillator applications listed Toshiba databooks along with information about oscillation conditions. resonator included this list, please consult Toshiba resonator manufacturer concerning suitability device your application.
2.4.2
Undefined Functions
some microcontrollers certain instruction code values constitute valid processor instructions. Also, possible that values bits registers will become undefined. Take care your applications invalid instructions register values become undefined.
2.4.3
Injuries from Probe Tips
Some probes adapters have sharp pointed leads. careful injure yourself leads devices.
030901
QUA-25
2002-02-20
Quality Reliability Assurance Handling Precautions
Safety Precautions
This section lists important precautions which users semiconductor devices (and anyone else) should observe order avoid injury damage property, ensure safe correct devices. Please sure that understand meanings labels graphic symbol described below before move detailed descriptions precautions. [Explanation labels]
Graphic symbol Meaning Indicates imminently hazardous situation which will result death serious injury follow instructions. Indicates potentially hazardous situation which could result death serious injury follow instructions. Indicates potentially hazardous situation which avoided, result minor injury moderate injury.
[Explanation graphic symbol]
Graphic symbol Meaning
Indicates that caution required (laser beam dangerous eyes).
030901
QUA-26
2002-02-20
Quality Reliability Assurance Handling Precautions
General Precautions Regarding Semiconductor Devices
devices under conditions exceeding their absolute maximum ratings (e.g. current, voltage, power dissipation temperature). This cause device break down, degrade performance, cause catch fire explode, resulting injury. insert devices wrong orientation. Make sure that positive negative terminals power supplies connected correctly. Otherwise rated maximum current power dissipation exceeded device break down undergo performance degradation, causing catch fire explode resulting injury. When power device touch device's heat sink. Heat sinks become hot, burn your hand. touch tips device leads. Because some types device have leads with pointed tips, prick your finger. When conducting kind evaluation, inspection testing, sure connect testing equipment's electrodes probes pins device under test before powering Otherwise, receive electric shock causing injury. Before grounding item measuring equipment soldering iron, check that there electrical leakage from Electrical leakage cause device which testing soldering break down, could give electric shock. Always wear protective glasses when cutting leads device with clippers similar tool. not, small bits metal flying ends damage your eyes.
030901
QUA-27
2002-02-20
Quality Reliability Assurance Handling Precautions
General Safety Precautions Usage Considerations
This section designed help gain better understanding semiconductor devices, ensure safety, quality reliability devices which incorporate into your designs.
From Incoming Shipping
4.1.1 Electrostatic Discharge (ESD)
When handling individual devices (which mounted printed circuit board), sure that environment protected against electrostatic electricity. Operators should wear anti-static clothing, containers other objects which come into direct contact with devices should made anti-static materials should grounded earth 0.5- 1.0-M protective resistor. Please follow precautions described below; this particularly important devices which marked careful static.".
4.1.1.1 Work Environment
When humidity working environment decreases, human body other insulators easily become charged with static electricity friction. Maintain recommended humidity work environment, while also taking into account fact that moisture-proof-packed products absorb moisture after unpacking. sure that equipment, jigs tools working area grounded earth. Place conductive over floor work area, take other appropriate measures, that floor surface protected against static electricity grounded earth. surface resistivity should resistance between surface ground, Cover workbench surface also with conductive (with surface resistivity /sq, resistance between surface ground purpose this disperse static electricity surface (through resistive components) ground earth. Workbench surfaces must constructed low-resistance metallic materials that allow rapid static discharge when charged device touches them directly.
030901
QUA-28
2002-02-20
Quality Reliability Assurance Handling Precautions attention following points when using automatic equipment your workplace: When picking with vacuum unit, conductive rubber fitting pick-up wand protect against electrostatic charge. Minimize friction package surfaces. some rubbing unavoidable device's mechanical structure, minimize friction plane material with small friction coefficient electrical resistance. Also consider ionizer. sections that come into contact with device lead terminals, material which dissipates static electricity. Ensure that statically charged bodies (such work clothes human body) touch devices. Make sure that sections tape carrier which come into contact with installation devices other electrical machinery made low-resistance material. Make sure that jigs tools used assembly process touch devices. processes which packages retain electrostatic charge, ionizer neutralize ions. Make sure that displays working area protected against static charge, example filter. much possible, avoid turning displays off. Doing cause electrostatic induction devices. Keep track charged potential working area taking periodic measurements. Ensure that work chairs protected anti-static textile cover grounded floor surface grounding chain. (Suggested resistance between seat surface grounding chain 1012 Install anti-static mats storage shelf surfaces. (Suggested surface resistivity /sq; suggested resistance between surface ground (10) transport temporary storage devices, containers (boxes, jigs bags) that made anti-static materials materials which dissipate electrostatic charge. (11) Make sure that cart surfaces which come into contact with device packaging made materials which will conduct static electricity, verify that they grounded floor surface grounding chain. (12) location where level static electricity closely controlled, ground resistance level should Class above. different ground wires items equipment which come into physical contact with devices.
030901
QUA-29
2002-02-20
Quality Reliability Assurance Handling Precautions
4.1.1.2 Operating Environment
Operators must wear anti-static clothing conductive shoes heel strap). Operators must wear wrist strap grounded earth resistor about Soldering irons must grounded from iron earth, must used only voltages tweezers likely touch device terminals, anti-static tweezers particular avoid metallic tweezers. charged device touches low-resistance tool, rapid discharge occur. When using vacuum tweezers, attach conductive chucking tip, connect dedicated ground used especially anti-static purposes (suggested resistance value: place devices their containers near sources strong electrical fields (such above CRT). When storing printed circuit boards which have devices mounted them, board container that protected against static charge. avoid occurrence static charge discharge friction, keep boards separate from other stack them directly another. Ensure, possible, that articles (such clipboards) which brought location where level static electricity must closely controlled constructed anti-static materials. cases where human body comes into direct contact with device, sure wear anti-static finger covers gloves (suggested resistance value: less). Equipment safety covers installed near devices should have resistance ratings less. (10) wrist strap cannot used some reason, there possibility imparting friction devices, ionizer. (11) transport film used products manufactured from materials which static charges tend build When using these products, install ionizer prevent film from being charged with static electricity. Also, ensure that static electricity will applied product's copper foils taking measures prevent static occurring peripheral equipment.
030901
QUA-30
2002-02-20
Quality Reliability Assurance Handling Precautions
4.1.2
Vibration, Impact Stress
Handle devices packaging materials with care. avoid damage devices, toss drop packages. Ensure that devices subjected Vibration mechanical vibration shock during transportation. Ceramic package devices devices canister-type packages which have empty space inside them subject damage from vibration shock because bonding wires secured only their ends. Plastic molded devices, other hand, have relatively high level resistance vibration mechanical shock because their bonding wires enveloped fixed resin. However, when device package type installed target equipment, some extent susceptible wiring disconnections other damage from vibration, shock stressed solder junctions. Therefore when devices incorporated into design equipment which will subject vibration, structural design equipment must thought carefully. device subjected especially strong vibration, mechanical shock stress, package chip itself crack. products such CCDs which incorporate window glass, this could cause surface flaws glass cause connection between glass ceramic separate. Furthermore, known that stress applied semiconductor device through package changes resistance characteristics chip because piezoelectric effects. analog circuit design attention must paid problem package stress well dangers vibration shock described above.
030901
QUA-31
2002-02-20
Quality Reliability Assurance Handling Precautions
Storage
4.2.1 General Storage
Avoid storage locations where devices will exposed moisture direct sunlight. Follow instructions printed device cartons regarding transportation storage. Temperature: Humidity: storage area temperature should kept within temperature range 35°C, relative humidity should maintained between 75%. store devices presence harmful (especially corrosive) gases, dusty conditions. storage areas where there minimal temperature fluctuation. Rapid temperature changes cause moisture form stored devices, resulting lead oxidation corrosion. result, solderability leads will degraded. When repacking devices, anti-static containers. allow external forces loads applied devices while they storage. devices have been stored more than years, their electrical characteristics should tested their leads should tested ease soldering before they used.
030901
QUA-32
2002-02-20
Quality Reliability Assurance Handling Precautions
4.2.2
Moisture-Proof Packing
Moisture-proof packing should handled with care. handling procedure specified each packing type should followed scrupulously. proper procedures followed, quality reliability devices degraded. This section describes general precautions handling moisture-proof packing. Since details differ from device device, refer also relevant individual datasheets databook. General precautions Follow instructions printed device cartons regarding transportation storage. drop toss device packing. laminated aluminum material rendered ineffective rough handling. storage area temperature should kept within temperature range 30°C, relative humidity should maintained (max). devices within months date marked package seal. 12-month storage period expired, humidity indicator shown Figure pink when packing opened, advisable, depending device packing type, back devices high temperature remove moisture. Please refer table below. After pack been opened, devices 30°C. environment within effective usage period listed moisture-proof package. effective usage period expired, packing been stored high-humidity environment, bake devices high temperature.
Packing Tray Tube Tape
Moisture removal packing bears "Heatproof" marking indicates maximum temperature which withstand, bake 125°C hours. (Some devices require different procedure.) Transfer devices trays bearing "Heatproof" marking indicating temperature which they withstand, aluminum tubes before baking 125°C hours. Deviced packed tape cannot baked must used within effective usage period after unpacking, specified packing.
When baking devices, protect devices from static electricity. Moisture indicators detect approximate humidity level standard temperature 25°C. 6-point indicators 3-point indicators currently use, eventually indicators will 3-point indicators.
030901
QUA-33
2002-02-20
Quality Reliability Assurance Handling Precautions
HUMIDITY INDICATOR
DANGER PINK CHANGE DESICCANT
HUMIDITY INDICATOR
DANGER PINK
READ LAVENDER BETWEEN PINK BLUE 6-point indicator
READ LAVENDER BETWEEN PINK BLUE 3-point indicator
Figure Humidity Indicator
030901
QUA-34
2002-02-20
Quality Reliability Assurance Handling Precautions
Design
Care must exercised design electronic equipment achieve desired reliability. important only adhere specifications concerning absolute maximum ratings recommended operating conditions, also important consider overall environment which equipment will used, including factors such ambient temperature, transient noise voltage current surges, well mounting conditions which affect device reliability. This section describes some general precautions which should observe when designing circuits when mounting devices printed circuit boards. more detailed information about each product family, refer relevant individual technical datasheets available from Toshiba.
4.3.1
Absolute Maximum Ratings
devices under conditions which their absolute maximum ratings (e.g. current, voltage, power dissipation temperature) will exceeded. device break down performance degraded, causing catch fire explode resulting injury user. absolute maximum ratings rated values which must exceeded during operation, even instant. Although absolute maximum ratings differ from product product, they essentially concern voltage current each pin, allowable power dissipation, junction storage temperatures. voltage current exceeds absolute maximum rating, device's internal circuitry become degraded. worst case, heat generated internal circuitry fuse wiring cause semiconductor chip break down. storage operating temperatures exceed rated values, package seal deteriorate wires become disconnected differences between thermal expansion coefficients materials from which device constructed.
4.3.2
Recommended Operating Conditions
recommended operating conditions each device those necessary guarantee that device will operate specified datasheet. greater reliability required, derate device's absolute maximum ratings voltage, current, power temperature before using
4.3.3
Derating
When incorporating device into your design, reduce rated absolute maximum voltage, current, power dissipation operating temperature order ensure high reliability. Since derating differs from application application, refer technical datasheets available various devices used your design.
030901
QUA-35
2002-02-20
Quality Reliability Assurance Handling Precautions
4.3.4
Unused Pins
unused pins left open, some devices exhibit input instability problems, resulting malfunctions such abrupt increase current flow. Similarly, unused output pins device connected power supply pin, ground other output pins, malfunction break down. Since details regarding handling unused pins differ from device device from pin, please follow instructions given relevant individual datasheets databook. CMOS logic inputs, example, have extremely high impedance. input left open, easily pick extraneous noise become unstable. this case, input voltage level reaches intermediate level, possible that both P-channel N-channel transistors will turned allowing unwanted supply current flow. Therefore, ensure that unused input pins device connected power supply (Vcc) ground (GND) same device. details what with pins heat sinks, refer relevant technical datasheet databook.
4.3.5
Latch-up
Latch-up abnormal condition inherent CMOS devices, which gets shorted ground. This happens when parasitic PN-PN junction (thyristor structure) internal CMOS chip turned causing large current order several hundred more flow between GND, eventually causing device break down. Latch-up occurs when input output voltage exceeds rated value, causing large current flow internal chip, when voltage (Vdd) exceeds rated value, forcing internal chip into breakdown condition. Once chip falls into latch-up state, even though excess voltage have been applied only instant, large current continues flow between (Vdd) (Vss). This causes device heat and, extreme cases, emit fumes well. avoid this problem, observe following precautions: allow voltage levels input output pins either rise above (Vdd) fall below (Vss). Also, follow prescribed power-on sequence, that power applied gradually steps rather than abruptly. allow abnormal noise signals applied device. voltage levels unused input pins (Vdd) (GND) Vss. connect outputs another.
4.3.6
Input/Output Protection
Wired-AND configurations, which outputs connected together, cannot used, since this short-circuits outputs. Outputs should, course, never connected (Vdd) (Vss). Furthermore, with tri-state outputs undergo performance degradation shorted output current allowed flow extended period time. Therefore, when designing circuits, make sure that tri-state outputs will enabled simultaneously.
030901
QUA-36
2002-02-20
Quality Reliability Assurance Handling Precautions
4.3.7
Load Capacitance
Some devices display increased delay times load capacitance large. Also, large charging discharging currents will flow device, causing noise. Furthermore, since outputs shorted relatively long time, wiring become fused. Consult technical information device being used determine recommended load capacitance.
4.3.8
Thermal Design
failure rate semiconductor devices greatly increased operating temperatures increase. shown Figure 4.2, internal thermal stress device ambient temperature temperature rise power dissipation device. Therefore, achieve optimum reliability, observe following precautions concerning thermal design: Keep ambient temperature (Ta) possible. device's dynamic power dissipation relatively large, select most appropriate circuit board material, consider heat sinks forced cooling. Such measures will help lower thermal resistance package. Derate device's absolute maximum ratings minimize thermal stress from power dissipation. Ta)/P Tc)/P Ta)/P which thermal resistance between junction surrounding (°C/W) thermal resistance between junction package surface, internal thermal resistance (°C/W) thermal resistance between package surface surrounding air, external thermal resistance (°C/W) junction temperature chip temperature (°C) package surface temperature case temperature (°C) ambient temperature (°C) power dissipation
Figure Thermal Resistance Package
030901
QUA-37
2002-02-20
Quality Reliability Assurance Handling Precautions
4.3.9
Interfacing
When connecting inputs outputs between devices, make sure input voltage (VIL/VIH) output voltage (VOL/VOH) levels matched. Otherwise, devices malfunction. When connecting devices operating different supply voltages, such dual-power-supply system, aware that erroneous power-on power-off sequences result device breakdown. details interface particular devices, consult relevant technical datasheets databooks. have questions doubts about interfacing, contact your nearest Toshiba office distributor.
4.3.10 Decoupling
Spike currents generated during switching cause (Vdd) (Vss) voltage levels fluctuate, causing ringing output waveform delay response speed. (The power supply wiring impedance normally this reason, impedance power supply lines with respect high frequencies must kept low. This accomplished using thick short wiring (Vdd) (Vss) lines installing decoupling capacitors approximately 0.01 capacitance) high-frequency filters between (Vdd) (Vss) strategic locations printed circuit board. low-frequency filtering, good idea install 100-µF capacitor printed circuit board (one capacitor will suffice). capacitance excessively large, however, (e.g. several thousand latch-up problem. sure choose appropriate capacitance value. important point about wiring that, case high-speed logic ICs, noise caused mainly reflection crosstalk, power supply impedance. Reflections cause increased signal delay, ringing, overshoot undershoot, thereby reducing device's safety margins with respect noise. prevent reflections, reduce wiring length increasing device mounting density lower inductance capacitance wiring. Extreme care must taken, however, when taking this corrective measure, since tends cause crosstalk between wires. practice, there must trade-off between these factors.
4.3.11 External Noise
Printed circuit boards with long signal pattern lines vulnerable induced noise surges from outside sources. Consequently, malfunctions breakdowns result from overcurrent overvoltage, depending types device used. protect against noise, lower impedance pattern line insert noise-canceling circuit. Protective measures must also taken against surges. details appropriate protective measures particular device, consult relevant databook.
030901
QUA-38
2002-02-20
Quality Reliability Assurance Handling Precautions
4.3.12 Electromagnetic Interference
Widespread electrical electronic equipment recent years brought with radio reception problems electromagnetic interference. radio spectrum effectively maintain radio communications quality, each country formulated regulations limiting amount electromagnetic interference which generated individual products. Electromagnetic interference includes conduction noise propagated through power supply telephone lines, noise from direct electromagnetic waves radiated equipment. Different measurement methods corrective measures used assess counteract each specific type noise. Difficulties controlling electromagnetic interference derive from fact that there method available which allows designers calculate, design stage, strength electromagnetic waves which will emanate from each component piece equipment. this reason, only after prototype equipment been completed that designer take measurements using dedicated instrument determine strength electromagnetic interference waves. possible during system design incorporate some measures prevention electromagnetic interference, which facilitate taking corrective measures once design been completed. These include installing shields noise filters, increasing thickness power supply wiring patterns printed circuit board. effective method, example, devise several shielding options during design, then select most suitable shielding method based results measurements taken after prototype been completed.
4.3.13 Peripheral Circuits
most cases semiconductor devices used with peripheral circuits components. input output signal voltages currents these circuits must chosen match semiconductor device's specifications. following factors must taken into account. Inappropriate voltages currents applied device's input pins cause operate erratically. Some devices contain pull-up pull-down resistors. When designing your system, remember take effect this voltage current levels into account. output pins device have predetermined external circuit drive capability. this drive capability greater than that required, either incorporate compensating circuit into your design carefully select suitable components external circuits.
4.3.14 Safety Standards
Each country safety standards which must observed. These safety standards include requirements quality assurance systems design device insulation. Such requirements must fully taken into account ensure that your design conforms applicable safety standards.
030901
QUA-39
2002-02-20
Quality Reliability Assurance Handling Precautions
4.3.15 Other Precautions
When designing system, sure incorporate fail-safe other appropriate measures according intended purpose your system. Also, sure debug your system under actual board-mounted conditions. plastic-package device placed strong electric field, surface leakage occur charge-up phenomenon, resulting device malfunction. such cases, take appropriate measures prevent this problem, example protecting package surface with conductive shield. With some microcomputers memory devices, caution required when powering resetting device. ensure that your design does violate device specifications, consult relevant databook each constituent device. Ensure that conductive material object (such metal pin) drop onto short leads device mounted printed circuit board.
Inspection, Testing Evaluation
4.4.1 Grounding
Ground measuring instruments, jigs, tools soldering irons earth. Electrical leakage cause device break down result electric shock.
4.4.2
Inspection Sequence
insert devices wrong orientation. Make sure that positive negative electrodes power supply correctly connected. Otherwise, rated maximum current maximum power dissipation exceeded device break down undergo performance degradation, causing catch fire explode, resulting injury user. When conducting kind evaluation, inspection testing using power with peak voltage 42.4 power exceeding sure connect electrodes probes testing equipment device under test before powering Connecting electrodes probes testing equipment device while powered result electric shock, causing injury. Apply voltage test only after inserting device securely into When applying removing power, observe relevant precautions, any. Make sure that voltage applied device before removing device from test jig. Otherwise, device undergo performance degradation destroyed.
030901
QUA-40
2002-02-20
Quality Reliability Assurance Handling Precautions Make sure that surge voltages from measuring equipment applied device. chips housed tape carrier packages (TCPs) bare chips therefore exposed. During inspection take care crack chip cause flaws Electrical contact also cause chip become faulty. Therefore make sure that nothing comes into electrical contact with chip.
Mounting
There essentially main types semiconductor device package: lead insertion surface mount. During mounting printed circuit boards, devices become contaminated flux damaged thermal stress from soldering process. With surface-mount devices particular, most significant problem thermal stress from solder reflow, when entire package subjected heat. This section describes recommended temperature profile each mounting method, well general precautions which should take when mounting devices printed circuit boards. Note, however, that even devices with same package type, appropriate mounting method varies according size chip size shape lead frame. Therefore, please consult relevant technical datasheet databook.
4.5.1
Lead Forming
Always wear protective glasses when cutting leads device with clippers similar tool. not, small bits metal flying ends damage your eyes. touch tips device leads. Because some types device have leads with pointed tips, prick your finger. Semiconductor devices must undergo process which leads formed before devices mounted printed circuit board. undue stress applied interior device during this process, mechanical breakdown performance degradation result. This attributable primarily differences between stress device's external leads stress internal leads. relative difference great enough, device's internal leads, adhesive properties sealant damaged. Observe these precautions during lead-forming process (this does apply surface-mount devices): Lead insertion hole intervals printed circuit board should match lead pitch device precisely. lead insertion hole intervals printed circuit board precisely match lead pitch device, attempt forcibly insert devices pressing them pulling their leads.
030901
QUA-41
2002-02-20
Quality Reliability Assurance Handling Precautions
minimum clearance specification between device printed circuit board, refer relevant device's datasheet databook. necessary, achieve required clearance forming device's leads appropriately. spacers which used raise devices above surface printed circuit board during soldering achieve clearance. These spacers normally continue expand heat, even after solder begun solidify; this applies severe stress device. Observe following precautions when forming leads device prior mounting avoid mechanical stress device. Also avoid ending stretching device leads repeatedly. tool secure lead base (where lead meets device package) while bending avoid mechanical stress device. Also avoid bending stretching device leads repeatedly. careful damage lead during lead forming. Follow other precautions described individual datasheets databooks each device package type.
4.5.2
Socket Mounting
When socket mounting devices printed circuit board, sockets which match inserted device's package. sockets whose contacts have appropriate contact pressure. contact pressure insufficient, socket make perfect contact when device repeatedly inserted removed; pressure excessively high, device leads bent damaged when they inserted into removed from socket. When soldering sockets printed circuit board, sockets whose construction prevents flux from penetrating into contacts which allows flux completely cleaned off. Make sure coating agent applied printed circuit board moisture-proofing purposes does stick socket contacts. device leads severely bent socket inserted removed wish repair leads continue using device, make sure that this lead correction only performed once. devices whose leads have been corrected more than once. printed circuit board with devices mounted will subjected vibration from external sources, sockets which have strong contact pressure prevent sockets devices from vibrating relative another.
030901
QUA-42
2002-02-20
Quality Reliability Assurance Handling Precautions
4.5.3
Soldering Temperature Profile
soldering temperature heating time vary from device device. Therefore, when specifying mounting conditions, refer individual datasheets databooks devices used. Using Soldering Iron Complete soldering within seconds lead temperatures 260°C, within three seconds lead temperatures 350°C. Standard Mounting Conditions SMDs (Surface Mount Devices) details, refer section Mounting Precautions chapter Handling Precautions Microcontrollers.
030901
QUA-43
2002-02-20
Quality Reliability Assurance Handling Precautions
4.5.4
Flux Cleaning Ultrasonic Cleaning
When cleaning circuit boards remove flux, make sure that residual reactive ions such remain. Note that organic solvents react with water generate hydrogen chloride other corrosive gases which degrade device performance. Washing devices with water will cause problems. However, make sure that reactive ions such sodium chlorine left residues. Also, sure devices sufficiently after washing. device markings with brush with your hand during cleaning while devices still from cleaning agent. Doing markings. cleaning, shower cleaning steam cleaning processes involve chemical action solvent. only recommended solvents these cleaning methods. When immersing devices solvent steam bath, make sure that temperature liquid 50°C below, that circuit board removed from bath within minute. Ultrasonic cleaning should used with hermetically-sealed ceramic packages such leadless chip carrier (LCC), grid array (PGA) charge-coupled device (CCD), because bonding wires become disconnected resonance during cleaning process. Even device package allows ultrasonic cleaning, limit duration ultrasonic cleaning short time possible, since long hours ultrasonic cleaning degrade adhesion between mold resin frame material. following ultrasonic cleaning conditions recommended: Frequency: Ultrasonic output power: less (0.25 W/cm2 less) Cleaning time: seconds less Suspend circuit board solvent bath during ultrasonic cleaning such that ultrasonic vibrator does come into direct contact with circuit board device.
030901
QUA-44
2002-02-20
Quality Reliability Assurance Handling Precautions
4.5.5
Circuit Board Coating
When devices used equipment requiring high degree reliability extreme environments (where moisture, corrosive dust present), circuit boards coated protection. However, before doing must carefully consider possible stress contamination effects that result then choose coating resin which results minimum level stress device.
Protecting Devices Field
4.6.1 Temperature
Semiconductor devices generally more sensitive temperature than other electronic components. various electrical characteristics semiconductor device dependent ambient temperature which device used. therefore necessary understand temperature characteristics device incorporate device derating into circuit design. Note also that device used above maximum temperature rating, device deterioration more rapid will reach usable life sooner than expected.
4.6.2
Humidity
Resin-molded devices sometimes improperly sealed. When these devices used extended period time high-humidity environment, moisture penetrate into device cause chip degradation malfunction. Furthermore, when devices mounted regular printed circuit board, impedance between wiring components decrease under high-humidity conditions. systems which require high signal-source impedance, circuit board leakage leakage between device lead pins cause malfunctions. application moisture-proof treatment device surface should considered this case. other hand, operation under low-humidity conditions damage device occurrence electrostatic discharge. Unless damp-proofing measures have been specifically taken, devices only environments with appropriate ambient moisture levels (i.e. within relative humidity range 60%).
030901
QUA-45
2002-02-20
Quality Reliability Assurance Handling Precautions
4.6.3
Corrosive Gases
Corrosive gases cause chemical reactions devices, degrading device characteristics. example, sulphur-bearing corrosive gases emanating from rubber placed near device (accompanied condensation under high-humidity conditions) corrode device's leads. resulting chemical reaction between leads forms foreign particles which cause electrical leakage.
4.6.4
Radioactive Cosmic Rays
Most industrial consumer semiconductor devices designed with protection against radioactive cosmic rays. Devices used aerospace equipment radioactive environments must therefore shielded.
4.6.5
Strong Electrical Magnetic Fields
Devices exposed strong magnetic fields undergo polarization phenomenon their plastic material, within chip, which gives rise abnormal symptoms such impedance changes increased leakage current. Failures have been reported LSIs mounted near malfunctioning deflection yokes sets. such cases, device's installation location must changed device must shielded against electrical magnetic field. Shielding against magnetism especially necessary devices used alternating magnetic field because electromotive forces generated this type environment.
4.6.6
Interference from Light (ultraviolet rays, sunlight, fluorescent lamps incandescent lamps)
Light striking semiconductor device generates electromotive force photoelectric effects. some cases device malfunction. This especially true devices which internal chip exposed. When designing circuits, make sure that devices protected against incident light from external sources. This problem limited optical semiconductors EPROMs. types device affected light.
4.6.7
Dust
Just like corrosive gases, dust cause chemical reactions devices, which will adversely affect device's electrical characteristics. avoid this problem, devices dusty oily environments. This especially important optical devices because dust affect device's optical characteristics well physical integrity electrical performance factors mentioned above.
4.6.8
Fire
Semiconductor devices combustible; they emit smoke catch fire heated sufficiently. When this happens, some devices generate poisonous gases. Devices should therefore never used close proximity open flame heat-generating body, near flammable combustible materials.
030901
QUA-46
2002-02-20
Quality Reliability Assurance Handling Precautions
Disposal Devices Packing Materials
When discarding unused devices packing materials, follow procedures specified local regulations order protect environment against contamination.
030901
QUA-47
2002-02-20
Quality Reliability Assurance Handling Precautions
030901
QUA-48
2002-02-20

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