Semiconductor ML9205-xx This version: ML9205-xx Jun. 1999 Ch

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Semiconductor ML9205-xx This version: ML9205-xx Jun. 1999 Ch

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E2C0040-19-65 Semiconductor
Semiconductor ML9205-xx
This version: ML9205-xx Jun. 1999
Character 16-Digit Display Controller/Driver with Character
ML9205-xx matrix vacuum fluorescent display tube controller driver which displays characters, numerics symbols. matrix vacuum fluorescent display tube drive signals generated serial data sent from micro-controller. display system easily realized internal character display. ML9205-xx power consumption since made CMOS process technology. available general-purpose code. Custom codes provided customer's request.
FEATURES
Logic power supply (VDD) V±10% V±10% Fluorescent display tube drive power supply (VDISP) V±10% V±10% Fluorescent display tube drive power supply (VFL) driver output current (VFD driver output connected directly fluorescent display tube. pull-down resistor required.) Segment driver (SEG1 SEG35) -5.0 (VFL= Segment driver (AD1 AD4) -10.0 (VFL= Grid driver (COM1 COM24) -50.0 (VFL= General output port output current Output driver ±1.0 (VDD V±10%) ±2.0 (VDD V±10%) Content display CGROM dots types (character data) CGRAM dots types (character data) ADRAM (display digit) bits (symbol data) DCRAM (display digit) bits (register character data display) General output port bits (static operation) Display control function Display digit digits Display duty (brightness adjustment) stages lights ON/OFF interfaces with microcontroller interfaces when RESET added) 1-byte instruction execution (excluding data write RAM) Built-in oscillation circuit (external Package options: 80-pin package (QFP80-P-1414-0.65-K) (Product name ML9205-xxGP) 80-pin package (QFP80-P-1420-0.80-BK)(Product name ML9205-xxGA) indicates code number.
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Semiconductor
ML9205-xx
BLOCK DIAGRAM
VDISP DCRAM CGROM Segment Driver RESET 8-bit Shift Register CGRAM SEG35 Driver SEG1
ADRAM
Address Selector Command Decoder Control Circuit Write Address Counter Read Address Counter
Port Driver Digit Control Duty Control COM1 Grid Driver COM24
Timing Generator OSC0 OSC1 Oscillator
Timing Generator
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Semiconductor
ML9205-xx
INPUT OUTPUT CONFIGURATION
Schematic Diagrams Logic Portion Input Output Circuits Input
INPUT
Output
OUTPUT
Schematic Diagram Driver Output Circuit
VDISP VDISP
OUTPUT
3/33
Semiconductor
ML9205-xx
CONFIGURATION (TOP VIEW)
SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18
VDISP2 VFL2 RESET OSC1 OSC0 VFL1 COM24 COM23
COM22 COM21 COM20 COM19 COM18 COM17 COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3
SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 VDISP1 COM1 COM2
connection
80-Pin Plastic (QFP80-P-1414-0.65-K)
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Semiconductor
ML9205-xx
RESET
VDISP2
OSC1
OSC0
VFL2
VFL1
COM24 COM23 COM22 COM21 COM20 COM19 COM18 COM17 COM16 COM15 COM14 COM13 COM12 COM11 COM10 COM9 COM8 COM7 COM6 COM5 COM4 COM3 COM2 COM1
SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20
SEG21
SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 VDISP1
connection
80-Pin Plastic (QFP80-P-1420-0.80-BK)
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Semiconductor
ML9205-xx
DESCRIPTION
QFP-1* QFP-2*
Symbol Type Connects Fluorescent tube anode electrode Fluorescent tube grid electrode Fluorescent tube anode electrode anode electrode
Description Fluorescent display tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. -5.0 Fluorescent display tube grid electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. -50.0 Fluorescent display tube anode electrode drive output. Directly connected fluorescent display tube pull-down resistor necessary. -10.0 General port output. Output these pins static operation, these pins drive LED. -2.0 VDD-GND power supplies internal logic. VDISP-VFL power supplies driving fluorescent tubes. same power supply VDISP.
SEG1
COM1
VFL1
VDISP1
Power supply
Microcontroller Microcontroller Microcontroller
Serial data input (positive logic). Input from LSB. Shift clock input. Serial data shifted rising edge Chip select input. Serial data transfer disabled when level. Reset input. "Low" initializes functions. Initial status follows. address "00"H Address each Content undefined Data each digits Display digit 8/16 Brightness adjusment mode lights "Low" level outputs RESET (Circuit when connected externally) Application Circuit.
RESET
Microcontroller
OSC0
External oscillation. Connect externally. time constant depends voltage used. target oscillation frequency MHz. OSC0 OSC1 oscillation circuit) Application Circuit.
OSC1
QFP-1: QFP80-P-1414-0.65-K QFP-2: QFP80-P-1420-0.80-BK 6/33
Semiconductor
ML9205-xx
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Supply Voltage Input Voltage Power Dissipation Storage Temperature Symbol VDISP TSTG Output Current Ta25°C Condition
QFP80-P-1414-0.65-K QFP80-P-1420-0.80-BK
Rating -0.3 +6.5 -0.3 +6.5 VDISP+0.3 -0.3 VDD+0.3 +150 -4.0 +4.0
Unit
COM1 COM24 SEG1 SEG35
same power supply VDISP.
RECOMMENDED OPERATING CONDITIONS
When power supply voltage (typ.)
Parameter Supply Voltage Supply Voltage High Level Input Voltage Level Input Voltage Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD, VDISP fOSC Condition input pins excluding OSC0 R1=3.3kW, C1=47pF
DIGIT=1 R1=3.3kW, C1=47pF
Min.
Typ.
Max. 0.3VDD
Unit
input pins excluding OSC0 0.7VDD
When power supply voltage 3.3V (typ.)
Parameter Supply Voltage Supply Voltage High Level Input Voltage Level Input Voltage Frequency Oscillation Frequency Frame Frequency Operating Temperature Symbol VDD, VDISP fOSC Condition input pins excluding OSC0 R1=3.3kW, C1=39pF
DIGIT=1 R1=3.3kW, C1=39pF
Min.
Typ.
Max. 0.2VDD
Unit
input pins excluding OSC0 0.8VDD
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Semiconductor
ML9205-xx
ELECTRICAL CHARACTERISTICS
Characteristics-1
(VDD, VDISP=5.0 V±10%, VFL=-60 Ta=-40 +85°C, unless otherwise specified) Parameter High Level Input Voltage Level Input Voltage High Level Input Current Level Input Current Symbol VOH1 High Level Output Voltage VOH2 VOH3 VOH4 Level Output Voltage VOL2 IDD1 Supply Current IDD2 VDD, VDISP VOL1 Applied RESET RESET RESET RESET COM1 SEG1 COM1 SEG1 IOL1=2 Duty=15/16 fOSC= MHz, load Digit=1 output lights Duty=8/16 Digit=1 output lights VFL+1.0 Condition VIH=VDD VIL=0.0V IOH1=-50.0 IOH2=-10.0 IOH3=-5.0 IOH4=-2.0 Min. 0.7VDD -1.0 -1.0 VDISP-2.0 VDISP-1.5 VDISP-1.5 VDISP-1.0 Max. 0.3VDD +1.0 +1.0 Unit
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Semiconductor Characteristics-2
Parameter High Level Input Voltage Level Input Voltage High Level Input Current Level Input Current
ML9205-xx
(VDD, VDISP=3.3 V±10%, VFL=-60 Ta=-40 +85°C, unless otherwise specified) Symbol VOH1 Applied RESET RESET RESET RESET COM1 SEG1 COM1 SEG1 VOL2 IDD1 IOL1=1mA Duty=15/16 fOSC= VDD, VDISP IDD2 MHz, load Digit=1 output lights Duty=8/16 Digit=1 output lights Condition VIH=VDD VIL=0.0V IOH1=-50.0 IOH2=-10.0 IOH3=-5.0 IOH4=-1.0 Min. 0.8VDD -1.0 -1.0 VDISP-2.0 VDISP-1.5 VDISP-1.5 VDD-1.0 Max. 0.2VDD +1.0 +1.0 VFL+1.0 Unit
High Level Output Voltage
VOH2 VOH3 VOH4
Level Output Voltage
VOL1
Supply Current
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Semiconductor Characteristics-1
ML9205-xx
(VDD, VDISP=5.0V±10%, VFL=-60 Ta=-40 +85°C, unless otherwise specified) Parameter Frequency Pulse Width Setup Time Hold Time Setup Time Hold Time Wait Time Data Processing Time RESET Pulse Width RESET Time Wait Time Output Slew Rate Rise Time Time Symbol tCSS tCSH tCSW tDOFF tWRES Condition R1=3.3 C1=47 R1=3.3 C1=47 When RESET signal input from microcontroller, etc. externally When RESET signal input from microcontroller, etc. externally R2=1.0 C2=0.1 tRSOFF tPRZ tPOF Cl=100pF tR=20% tF=80% Min. Max. Unit
tRSON
When mounted unit When mounted unit, VDD=0.0
Characteristics-2
(VDD, VDISP=3.3V±10%, VFL=-60V, Ta=-40 +85°C, unless otherwise specified) Parameter Frequency Pulse Width Setup Time Hold Time Setup Time Hold Time Wait Time Data Processing Time RESET Pulse Width RESET Time Wait Time Output Slew Rate Rise Time Time Symbol tCSS tCSH tCSW tDOFF tWRES tRSON tRSOFF tPRZ tPOF Cl=100pF Condition R1=3.3 C1=39 R1=3.3 C1=39 When RESET signal input from microcontroller etc. externally When RESET signal input from microcontroller etc. externally R2=1.0 C2=0.1 tR=20% tF=80% Min. Max. Unit
When mounted unit When mounted unit, VDD=0.0
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Semiconductor
ML9205-xx
TIMING DIAGRAM
Symbol VDD=3.3V±10% VDD=5.0V±10%
Data Timing
tCSS 1/fC VALID VALID tDOFF VALID VALID tCSH tCSW
Reset Timing
RESET
tPRZ tRSON tRSOFF tPOF
When input externally
tWRES
When external connected
tRSOFF
Output Timing
outputs
VDISP
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Semiconductor
ML9205-xx
Digit Output Timing (for 16-digit display, duty 15/16)
T=8/ fOSC
Frame cycle t1=1536T Display timing t2=60T Blank timing t3=4T
COM1 COM2 COM3 COM4 COM5 COM6
(t1=6.144 when fosc=2.0 MHz) (t2=240 when fosc=2.0 MHz) (t3=16 when fosc=2.0 MHz)
VDISP
COM19 COM20 COM21 COM22 COM23 COM24 AD1-4 SEG1-35
VDISP
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Semiconductor
ML9205-xx
FUNCTIONAL DESCRIPTION
Commands List
Command DCRAM data write
byte
byte
CGRAM data write
ADRAM data write Display duty Number digits lights ON/OFF Test mode
byte byte byte byte byte
General output port
When data written (DCRAM, CGRAM, ADRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes. Note: test mode used inspection before shipment. user function.
Don't care Address specification each Character code specification each General output port status specification Display duty specification Number digits specification lights instruction lights instruction
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Semiconductor Positional Relationship Between SEGn (one digit)
ML9205-xx
SEG1
ADRAM written data. Corresponds byte
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte
CGRAM written data. Corresponds byte CGRAM written data. Corresponds byte
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Semiconductor Data Transfer Method Command Write Method Display control command data written 8-bit serial transfer. Write timing shown figure below.
ML9205-xx
Setting "Low" level enables data transfer. Data bits sequentially input into from (LSB first). shown figure below, data read shift register rising edge shift clock, which input into pin. 8-bit data input, internal load signals automatically generated data written each register RAM. Therefore necessary input load signals from outside. Setting "High" disables data transfer. Data input from point when changes from "High" "Low" recognized 8-bit units.
tDOFF tCSH
byte
byte
byte
When data written DCRAM* Command address data
Character code data
Character code data next address
When data written (DCRAM, ADRAM, CGRAM) continuously, addresses internally incremented automatically. Therefore necessary specify byte write data later bytes.
Reset Function Reset executed when RESET "L", (when turning power example) initializes functions. Initial status follows: Address each address "00"H Data each contents undefined General output port general output ports "Low" Display digit digits Brightness adjustment 8/16 display lights mode Segment output segment outputs "Low" output outputs "Low" Please functions again according "Setting Flowchart" after reset.
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Semiconductor Description Commands Functions
ML9205-xx
DCRAM data write (Specifies addresses DCRAM writes character codes CGROM CGRAM.) DCRAM (Data Control RAM) 5-bit address store character codes CGROM CGRAM. character code specified DCRAM converted matrix character pattern CGROM CGRAM. (The DCRAM store characters.) [Command format]
byte (1st)
selects DCRAM data write mode specifies DCRAM address (Ex: Specifies DCRAM address 00H.) specifies character codes CGROM CGRAM (written into DCRAM address 00H)
byte (2nd)
specify character code CGROM CGRAM continuously next address, specify only character codes follows. addresses DCRAM automatically incremented. Specification address unnecessary.
byte (3rd)
specifies character codes CGROM CGRAM (written into DCRAM address 01H)
byte (4th) specifies character codes CGROM CGRAM (written into DCRAM address 02H)
byte (25th) specifies character codes CGROM CGRAM (written into DCRAM address 17H)
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Semiconductor character code setting CGROM CGRAM digits completed. character code from DCRAM address continuously. Specify dummy charactor code between DCRAM addresses 1FH. increament DCRAM address automatically 00H)
ML9205-xx
byte (26th) specifies character codes dummy CGROM (Operated times) CGRAM (Not written into DCRAM address)
byte (33th)
byte (34th)
specifies character codes dummy CGROM CGRAM (Not written into DCRAM address) specifies character codes CGROM CGRAM (DCRAM address rewritten)
(LSB) (MSB): DCRAM addresses bits: characters) (LSB) (MSB): Character codes CGROM CGRAM bits: characters) [COM positions DCRAM addresses]
position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 position COM17 COM18 COM19 COM20 COM21 COM22 COM23 COM24 fixed fixed fixed fixed fixed fixed fixed fixed
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Semiconductor CGRAM data write (Specifies addresses CGRAM writes character pattern data.)
ML9205-xx
CGRAM (Character Generator RAM) 4-bit address store matrix character patterns. character pattern stored CGRAM displayed specifying character code (address) DCRAM. address CGRAM assigned 0FH. (All other addresses CGROM addresses.) (The CGRAM store types character patterns.) [Command format]
byte (1st)
selects CGRAM data write mode specifies CGRAM address. (Ex: Specifies CGRAM address 00H.) specifies column data (written into CGRAM address 00H)
byte (2nd)
byte (3rd)
specifies column data (written into CGRAM address 00H)
byte (4th)
specifies column data (written into CGRAM address 00H)
byte (5th)
specifies column data (written into CGRAM address 00H)
byte (6th)
specifies column data (written into CGRAM address 00H)
specify character pattern data continuously next address, specify only character pattern data follows. addresses CGRAM automatically incremented. Specification address therefore unnecessary. byte (character pattern data) regarded data item, sufficient tDOFF time between bytes.
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Semiconductor
ML9205-xx
byte (7th)
specifies column data (written into CGRAM address 01H)
byte (11th)
specifies column data (written into CGRAM address 01H)
byte (12th)
specifies column data (written into CGRAM address 02H)
byte (16th)
specifies column data (written into CGRAM address 02H)
byte (77th)
specifies column data (written into CGRAM address 0FH)
byte (81th)
specifies column data (written into CGRAM address 0FH)
byte (82th)
specifies column data (CGRAM address written)
byte (86th)
specifies column data (CGRAM address written)
(LSB) (MSB): CGRAM addresses bits: characters) (LSB) (MSB) Character pattern data bits: outputs digit) Don't care
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Semiconductor [CGROM addresses CGRAM addresses] Refer ROMCODE table
CGROM address RAM00(00000000B) RAM01(00000001B) RAM02(00000010B) RAM03(00000011B) RAM04(00000100B) RAM05(00000101B) RAM06(00000110B) RAM07(00000111B)
ML9205-xx
CGROM address RAM08(00001000B) RAM09(00001001B) RAM0A(00001010B) RAM0B(00001011B) RAM0C(00001100B) RAM0D(00001101B) RAM0E(00001110B) RAM0F(00001111B)
Positional relationship between output area CGROM that CGRAM
area that corresponds byte (1st column) area that corresponds byte (2nd column) area that corresponds byte (5th column) area that corresponds byte (4th column) area that corresponds byte (3rd column)
Note: CGROM (Character Generator ROM) 8-bit address generate matrix character patterns. CGRAM store types character patterns. General-purpose code available custom codes provided customer's request.
20/33
Semiconductor ADRAM data write (Specifies addresses ADRAM writes symbol data.)
ML9205-xx
ADRAM (Additional Data RAM) 5-bit address store symbol data. Symbol data specified ADRAM directly output without CGROM CGRAM. (The ADRAM store types symbol patterns each digit.) terminal which contents ADRAM output used cursor. [Command format]
byte (1st)
selects ADRAM data write mode specifies ADRAM address (Ex: Specifies ADRAM address 00H.) sets symbol data (written into ADRAM address 00H.)
byte (2nd)
specify symbol data continuously next address, specify only symbol data follows. address ADRAM automatically incremented. Specification addresses therefore unnecessary.
byte (3rd) byte (4th)
sets symbol data (written into ADRAM address 01H) sets symbol data (written into ADRAM address 02H)
byte (25th) sets symbol data (written into ADRAM address 17H)
21/33
Semiconductor symbol data setting digits completed. symbol data from ADRAM address continuously. Specify dummy symbol data between ADRAM addresses 1FH. increment ADRAM address automatically 00H)
ML9205-xx
byte (26th)
sets dummy symbol data (Not written into ADRAM address)
byte (33th) byte (34th)
sets dummy symbol data (Not written into ADRAM address) sets dummy symbol data (ADRAM address rewritten.)
(LSB) (MSB) ADRAM addresses bits: characters) (LSB) (MSB): Symbol data bits: 4-symbol data digit) Don't care
[COM positions ADRAM addresses]
position position COM1 COM2 COM3 COM4 COM5 COM6 COM7 COM8 COM9 COM10 COM11 COM12 COM13 COM14 COM15 COM16 COM17 COM18 COM19 COM20 COM21 COM22 COM23 COM24 fixed fixed fixed fixed fixed fixed fixed fixed
22/33
Semiconductor General output port (Specifies general output port status.)
ML9205-xx
general output port output 4-bit static operation. used control other devices turn LED. (static operation) When "High" level, this output becomes voltage, when "Low" level, becomes ground potential. Therefore, fluorescent display tube cannot driven. [Command format]
byte selects general output port specifies output status
general output ports Don't care [Set data state general output port]
Display state general output port Sets output Sets output High (The state when power applied when RESET input.)
23/33
Semiconductor Display duty (Writes display duty value duty cycle register.)
ML9205-xx
Display duty adjusts brightness stages using 3-bit data. When power turned when RESET signal input, duty cycle register value "0". Always execute this instruction before turning display then desired duty value. [Command format]
byte selects display duty mode sets duty value
(LSB) (MSB) display duty data bits: stages) Don't care [Relation between setup data controlled duty]
duty 8/16 9/16 10/16 11/16 12/16 13/16 14/16 15/16 (The state when power turned when RESET signal input.)
24/33
Semiconductor Number digits (Writes number display digits display digit register.)
ML9205-xx
number digits display digits using 4-bit data. When power turned when RESET signal input, number digit register value "0". Always execute this instruction change number digits before turning dispaly [Command format]
byte selects number digit mode specifies number digit value
(LSB) (MSB) number digit data bits: digits) Don't care [Relation between setup data controlled COM]
Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1 Number digits COM1 COM1 COM1 COM1 COM1 COM1 COM1 COM1
state when power turned when RESET signal input.
25/33
Semiconductor display lights ON/OFF (Turns dispaly lights OFF.)
ML9205-xx
display lights used primarily display testing. display lights primarily used display blink prevent malfunction when power turned This command cannot control general output port. [Command format]
byte selects display lights mode specifies display operation
display operation data Don't care
[Set data display state
Display state Normal display Sets outputs Sets outputs High Sets outputs High (The state when power applied when RESET input.)
26/33
Semiconductor Setting Flowchart (Power applying included)
Apply VDISP
ML9205-xx
Apply
display lights
Status outputs RESET signal input
General output port setting
Number digits setting
Display duty setting Select used
DCRAM Data write mode (with address setting)
Address automatically incremented
CGRAM Data write mode (with address setting)
Address automatically incremented
ADRAM Data write mode (with address setting)
Address automatically incremented
DCRAM Character code DCRAM character code write ended?
CGRAM Character code CGRAM character code write ended?
ADRAM Character code ADRAM character code write ended?
Another set?
Releases display lights mode
Display operation mode
27/33
Semiconductor Power-off Flowchart
Display operation mode
ML9205-xx
Turn
Turn VDISP
28/33
Semiconductor
ML9205-xx
APPLICATION CIRCUIT
Heater Transformer matrix fluorescent display tube
ANODE (SEGMENT) Microcontroller Output Port RESET VDD, AD1-4 VDISP1-2
ANODE GRID (SEGMENT) (DIGIT) SEG1-35 COM1-24 P1-4
ML9205
VFL1-2
OSC0 OSC1
Notes: value depends power supply voltage microcontroller used. Adjust values constants power supply voltage used. value depends fluorescent display tube used. Adjust values constants power supply voltage used.
29/33
Semiconductor
ML9205-xx
REFERENCE DATA
Graphs illustrating versus driver output current capability relationship shown below. Care must taken total power excess allowable power dissipation.
[VDISP-n(V)] -0.5 -1.0 -1.5 -2.0
[Driver output current versus output drop voltage] VFL=-60V,COMn [Output current (mA)] (mA)
[VDISP-n(V)] -0.5
[Driver output current versus output drop voltage] VFL=-20V,COMn [Output current (mA)] (mA)
Ta=-40°C Ta=25°C Ta=85°C
-1.0 -1.5 -2.0 Ta=-40°C
Ta=85°C
Ta=25°C
[VDISP-n(V)] -0.5 -1.0 -1.5 -2.0
[Driver output current versus output drop voltage] VFL=-60V,ADn [Output current (mA)] (mA)
[VDISP-n(V)] -0.5
[Driver output current versus output drop voltage] VFL=-20V,ADn [Output current (mA)] (mA)
Ta=-40°C Ta=25°C Ta=85°C
-1.0 -1.5 -2.0 Ta=-40°C
Ta=85°C
Ta=25°C
[VDISP-n(V)] -0.5 -1.0 -1.5 -2.0
[Driver output current versus output drop voltage] VFL=-60V,SEGn [Output current (mA)] (mA)
[VDISP-n(V)] -0.5
[Driver output current versus output drop voltage] VFL=-20V,SEGn [Output current (mA)] (mA)
Ta=-40°C Ta=25°C Ta=85°C
-1.0 -1.5 -2.0 Ta=-40°C
Ta=85°C
Ta=25°C
30/33
Semiconductor
ML9205-xx
ML9205-01 Code
00000000B (00H) 00000111B (0FH) CGRAM addresses.
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
0000 RAM0
0001 RAM1
0010 RAM2
0011 RAM3
0100 RAM4
0101 RAM5
0110 RAM6
0111 RAM7
1000 RAM8
1001 RAM9
1010 RAMA
1011 RAMB
1100 RAMC
1101 RAMD
1110 RAME
1111 RAMF
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Semiconductor
ML9205-xx
PACKAGE DIMENSIONS
(Unit QFP80-P-1414-0.65-K
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 0.85 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
32/33
Semiconductor
ML9205-xx
(Unit QFP80-P-1420-0.80-BK
Mirror finish
Package material Lead frame material treatment Solder plate thickness Package weight
Epoxy resin alloy Solder plating more 1.27 TYP.
Notes Mounting Surface Mount Type Package SOP, QFP, TSOP, TQFP, LQFP, SOJ, (PLCC), SHP, surface mount type packages, which very susceptible heat reflow mounting humidity absorbed storage. Therefore, before perform reflow mounting, contact Oki's responsible sales person product name, package name, number, package code desired mounting conditions (reflow method, temperature times).
33/33
E2Y0002-29-11
NOTICE
information contained herein change without notice owing product and/or technical improvements. Before using product, please make sure that information being referred up-to-date. outline action examples application circuits described herein have been chosen explanation standard action performance product. When planning product, please ensure that external conditions reflected actual circuit, assembly, program designs. When designing your product, please product below specified maximum ratings within specified operating ranges including, limited operating voltage, power dissipation, operating temperature. assumes responsibility liability whatsoever failure unusual unexpected operation resulting from misuse, neglect, improper installation, repair, alteration accident, improper handling, unusual physical electrical stress including, limited exposure parameters beyond specified maximum ratings operation outside specified operating range. Neither indemnity against license third party's industrial intellectual property right, etc. granted connection with product and/or information drawings contained herein. responsibility assumed infringement third party's right which result from thereof. products listed this document intended general electronics equipment commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products authorized system application that requires special enhanced quality reliability characteristics system application where failure such system application result loss damage property, death injury humans. Such applications include, limited traffic automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, life-support systems. Certain products this document need government approval before they exported particular countries. purchaser assumes responsibility determining legality export these products will take appropriate necessary steps their expense these. part contents cotained herein reprinted reproduced without prior permission. MS-DOS registered trademark Microsoft Corporation.
Copyright 1999 Electric Industry Co., Ltd.
Printed Japan

Semiconductor ML9205-xx This version: ML9205-xx Jun. 1999 Ch

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