Rail-to-Rail Gain Bandwidth Product: (typ.) Supply Current: (typ.

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Rail-to-Rail Gain Bandwidth Product: (typ.) Supply Current: (typ.

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MCP6231/2
Rail-to-Rail
Gain Bandwidth Product: (typ.) Supply Current: (typ.) Supply Voltage: 1.8V 5.5V Rail-to-Rail Input/Output Extended Temperature Range: -40°C +125°C Available 5-Pin SC-70 SOT-23 packages
Description
Microchip Technology Inc. MCP6231/2 operational amplifiers amps) provide wide bandwidth quiescent current. MCP6231/2 family Gain Bandwidth Product (GBWP) (typ.) phase margin. This family operates from single supply voltage 1.8V, while drawing (typ.) quiescent current. addition, MCP6231/2 family supports rail-to-rail input output swing, with common mode input voltage range These amps designed Microchip's advanced CMOS processes.
Applications
Automotive Portable Equipment Transimpedance amplifiers Analog Filters Notebooks PDAs Battery-Powered Systems
Package Types
MCP6231 SOT-23-5
VOUT VIN+
MCP6231R SOT-23-5
VOUT VIN- VIN+
Available Tools
SPICE Macro Models www.microchip.com) FilterLab Software www.microchip.com)
VIN-
Typical Application
VIN2 VIN1 MCP6231 VOUT
MCP6231 PDIP, SOIC, MSOP
VIN- VIN+ VOUT
MCP6231U SC-70-5, SOT-23-5
VIN+ VIN-
VOUT
MCP6232 PDIP, SOIC, MSOP
VOUTA VINA_
VOUTB VINB_ VINB+
VINA+
Summing Amplifier Circuit
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" cause permanent damage device. This stress rating only functional operation device those other conditions above those indicated operational listings this specification implied. Exposure maximum rating conditions extended periods affect device reliability.
Absolute Maximum Ratings
.7.0V Inputs Outputs 0.3V 0.3V Difference Input Voltage |VDD VSS| Output Short Circuit Current .continuous Current Input Pins Current Output Supply Pins .±30 Storage Temperature. -65°C +150°C Maximum Junction Temperature (TJ) +150°C Protection Pins (HBM;MM) 400V
FUNCTION TABLE
Name Function
VIN+, VINA+, VINB+ VIN-, VINA-, VINB- VOUT, VOUTA, VOUTB
Non-inverting Input Inverting Input Positive Power Supply Negative Power Supply Output
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VDD/2 VOUT VDD/2.
Parameters
Input Offset Input Offset Voltage Extended Temperature Input Offset Drift with Temperature Power Supply Rejection Input Bias Current Impedance Input Bias Current: Temperature Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common Mode Input Range Common Mode Rejection Ratio Open-Loop Gain Open-Loop Gain (large signal) Output Maximum Output Voltage Swing Output Short-Circuit Current Power Supply Supply Voltage Quiescent Current Amplifier Note:
VOS/TA PSRR ZDIFF VCMR CMRR
-5.0 -7.0
±3.0 ±1.0 1100 ±1.0 1013||6 1013||3
+5.0 +7.0
Units
µV/°C ||pF ||pF
Conditions
-40°C +125°C (Note) -40°C +125°C,
+85°C +125°C
-0.3V 5.3V, VOUT 0.3V 0.3V, 0.5V Output Overdrive 1.8V 5.5V
VOL,
0.5V
SC-70 package only tested +25°C.
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +25°C, +1.8 5.5V, GND, VDD/2, VOUT VDD/2, VDD/2 Parameters Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density µVp-p nV/Hz fA/Hz GBWP 0.10 V/µs Units Conditions
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, +1.8V +5.5V GND. Parameters Temperature Ranges Extended Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Thermal Resistance, 5L-SOT-23 Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 8L-MSOP Note: °C/W °C/W °C/W °C/W °C/W +125 +125 +150 Note Units Conditions
internal Junction Temperature (TJ) must exceed Absolute Maximum specification +150°C.
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
Note:
TYPICAL PERFORMANCE CURVES
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
Percentage Occurrences Input Offset Voltage (mV)
Samples
CMRR, PSRR (dB)
5.0V PSRR (VCM VSS)
CMRR (VCM -0.3 +5.3
Ambient Temperature (°C)
FIGURE 2-1:
Input Offset Voltage.
FIGURE 2-4: Temperature.
Open-Loop Gain (dB)
1.E-01 1.E+00 1.E+01
CMRR, PSRR Ambient
PSRR, CMRR (dB)
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
PSRR-
5.0V
Phase
CMRR PSRR+
-120 -150 -180
1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07
Frequency (Hz)
100k
100k Frequency (Hz)
-210
FIGURE 2-2: Frequency.
PSRR, CMRR
FIGURE 2-5: Frequency.
Open-Loop Gain, Phase
Percentage Occurrences
Percentage Occurrences
Samples +85°C
Samples +125°C
Input Bias Current (pA)
Input Bias Current (nA)
FIGURE 2-3:
Input Bias Current +85°C.
FIGURE 2-6:
Input Bias Current +125°C.
DS21881B-page
2004 Microchip Technology Inc.
Open-Loop Phase
Gain
100.0 5.0V VDD/2
MCP6231/2
Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
1,000 Input Noise Voltage Density (nV/Hz)
Percentage Occurrences Input Offset Voltage Drift (µV/°C)
Samples -40°C +125°C
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
100k
Frequency (Hz)
FIGURE 2-7: Frequency.
Input Noise Voltage Density
FIGURE 2-10:
Input Offset Voltage Drift.
Input Offset Voltage (µV)
Input Offset Voltage (µV)
+125°C +85°C +25°C -40°C
-100 -150 -200 -250 -300
-0.4
-0.2
Common Mode Input Voltage
Output Voltage
FIGURE 2-8: Input Offset Voltage Common Mode Input Voltage 1.8V.
FIGURE 2-11: Output Voltage.
Input Offset Voltage
Input Offset Voltage (µV)
-100 -200 -300
+125°C +85°C +25°C -40°C
Short Circuit Current (mA)
+ISC
+125°C +85°C +25°C -40°C -ISC Power Supply Voltage
-0.5
Common Mode Input Voltage
FIGURE 2-9: Input Offset Voltage Common Mode Input Voltage 5.5V.
FIGURE 2-12: Output Short-Circuit Current Ambient Temperature.
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
Note: Unless otherwise indicated, +25°C, +1.8V +5.5V, GND, VDD/2, VOUT VDD/2, VDD/2
0.30 Falling Edge, 0.25 0.20 0.15 0.10 0.05 Ambient Temperature (°C) Rising Edge, Rising Edge, Falling Edge,
120.00
Output Voltage mV/div)
100.00 80.00 60.00 40.00 20.00 0.00
Slew Rate (V/µs)
-20.00 -9.E+00 -40.00
1.E+00
1.E+01
2.E+01
3.E+01
Time µs/div)
FIGURE 2-13: Temperature.
Output Voltage Headroom (mV)
Slew Rate Ambient
FIGURE 2-16: Pulse Response.
Small Signal Non-Inverting
1,000
Output Voltage
0.0001 0.1µ
0.001
0.01
100µ
-2.E+01 0.E+00 2.E+01
Output Current Magnitude
Time µs/div)
4.E+01
6.E+01
8.E+01
1.E+02
1.E+02
1.E+02
FIGURE 2-14: Output Voltage Headroom Output Current Magnitude.
Output Voltage Swing (Vp-p)
FIGURE 2-17: Pulse Response.
Large Signal Non-Inverting
Quiescent Current Amplifier (µA)
+125°C +85°C +25°C -40°C
1000
100k 10000 100000 Frequency (Hz)
1000000
Power Supply Voltage
FIGURE 2-15: Frequency.
Output Voltage Swing
FIGURE 2-18: Quiescent Current Power Supply Voltage.
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
APPLICATION INFORMATION
MCP623X VOUT MCP6231/2 family amps manufactured using Microchip's state-of-the-art CMOS process specifically designed low-cost, low-power general-purpose applications. supply voltage, quiescent current wide bandwidth makes MCP6231/2 ideal battery-powered applications.
Rail-to-Rail Input
Maximum expected Minimum expected
MCP6231/2 amps designed prevent phase reversal when input pins exceed supply voltages. Figure shows input voltage exceeding supply voltage without phase reversal.
FIGURE 3-2: Resistor (RIN).
Input Current-Limiting
VOUT
Input, Output Voltages
0.E+00 1.E+00 2.E+00 3.E+00 4.E+00 5.E+00 6.E+00 7.E+00
5.0V
Rail-to-Rail Output
output voltage range MCP6231/2 amps (min.) (max.) when connected VDD/2 5.5V. Refer Figure 2-14 more information.
Capacitive Loads
8.E+00
9.E+00
1.E+01
Time ms/div)
FIGURE 3-1: Phase Reversal.
MCP6231/2 Show
input stage MCP6231/2 amps differential input stages parallel. operates common mode input voltage (VCM) other high VCM. With this topology, device operates with above below VSS. input offset voltage measured ensure proper operation. Input voltages that exceed input voltage range (VSS 0.3V 0.3V 25°C) cause excessive current flow into input pins. Current beyond cause reliability problems. Applications that exceed this rating must externally limited with resistor, shown Figure 3-2.
Driving large capacitive loads cause stability problems voltage feedback amps. load capacitance increases, feedback loop's phase margin decreases closed-loop bandwidth reduced. This produces gain peaking frequency response, with overshoot ringing step response. unity-gain buffer most sensitive capacitive loads, gains show same general behavior. When driving large capacitive loads with these amps (e.g., when +1), small series resistor output (RISO Figure 3-3) improves feedback loop's phase margin (stability) making output load resistive higher frequencies. does not, however, improve bandwidth.
MCP623X
RISO VOUT
FIGURE 3-3: Output resistor, RISO stabilizes large capacitive loads.
Figure gives recommended RISO values different capacitive loads gains. x-axis normalized load capacitance (CL/GN), where circuit's noise gain. non-inverting gains, gain equal. inverting gains, |Gain| (e.g., gives V/V).
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
Recommended RISO
1.E+04
easiest reduce surface leakage guard ring around sensitive pins traces). guard ring biased same voltage sensitive pin. example this type layout shown Figure 3-5.
1.E+03
VIN-
VIN+
1.E+02 1.E+01
1.E+02
1.E+03
1.E+04
100p Normalized Load Capacitance; CL/GN
FIGURE 3-4: Recommended RISO Values Capactive Loads.
After selecting RISO your circuit, double-check resulting frequency response peaking step response overshoot. Evaluation bench simulations with MCP6231/2 SPICE macro model very helpful. Modify RISO's value until response reasonable.
Guard Ring
FIGURE 3-5: Inverting Gain.
Example Guard Ring Layout
Supply Bypass
With this amp, power supply (VDD single-supply) should have local bypass capacitor (i.e., 0.01 within good highfrequency performance. also needs bulk capacitor (i.e., larger) within provide large, slow currents. This bulk capacitor shared with other parts.
Surface Leakage
applications where input bias current critical, Printed Circuit Board (PCB) surface leakage effects need considered. Surface leakage caused humidity, dust other contamination board. Under humidity conditions, typical resistance between nearby traces 1012. difference would cause current-to-flow. This greater than MCP6231/2 family's bias current 25°C typ).
Non-inverting Gain Unity-Gain Buffer: Connect non-inverting (VIN+) input with wire that does touch surface. Connect guard ring inverting input (VIN-). This biases guard ring common mode input voltage. Inverting transimpedance gain amplifiers (convert current voltage, such photo detectors): Connect guard ring non-inverting input (VIN+). This biases guard ring same reference voltage (e.g., VDD/2 ground). Connect inverting (VIN-) input with wire that does touch surface.
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
APPLICATION CIRCUITS
Matching Impedance Inputs
Compensating Parasitic Capacitance
minimize effect input bias current amplifier circuit (this important very high sourceimpedance applications, such meters transimpedance amplifiers), impedance both inverting non-inverting inputs needs matched. This done choosing circuit resistor values that total resistance each input same. Figure shows summing amplifier circuit.
VIN2 VIN1 MCP623X VOUT
analog circuit design, parasitic capacitance compromise circuit behavior; Figure shows typical scenario. input amplifier sees parasitic capacitance several picofarad (CPARA, which includes common mode capacitance typical), large frequency response circuit will include zero. This parasitic zero introduces gain peaking cause circuit instability.
MCP623X VOUT
CPARA
CPARA
FIGURE 4-1:
Summing Amplifier Circuit.
match inputs, voltage sources ground calculate total resistance input nodes. this summing amplifier circuit, resistance inverting input calculated setting VIN1, VIN2 VOUT ground. this case, RG1, parallel. total resistance inverting input Where: RVIN- total resistance inverting input non-inverting input, only voltage source. When ground, both parallel. total resistance non-inverting input Where: RVIN+ total resistance inverting input minimize output offset voltage increase circuit accuracy, resistor values need meet conditions:
FIGURE 4-2: Effect Parasitic Capacitance Input.
solution smaller resistor values push zero higher frequency. Another solution compensate introducing pole point which zero occurs. This done adding parallel with feedback resistor (RF). needs selected that ratio CPARA:CF equal ratio RF:RG.
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
DESIGN TOOLS
Microchip provides basic design tools needed MCP6231/2 family amps.
SPICE Macro Model
latest SPICE macro model MCP6231/2 amps available site www.microchip.com. This model intended initial design tool that works well amp's linear region operation room temperature. model file information capabilities. Bench testing very important part design cannot replaced with simulations. Also, simulation results using this macro model need validated comparing them data sheet specifications characteristic curves.
FilterLab® Software
FilterLab software innovative tool that simplifies analog active-filter (using amps) design. Available free charge from site www.microchip.com, FilterLab software active-filter design tool provides full schematic diagrams filter circuit with component values. also outputs filter circuit SPICE format, which used with macro model simulate actual filter performance.
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
PACKAGING INFORMATION
Package Marking Information
5-Lead SC-70 (MCP6231U Only) Example:
5-Lead SOT-23
Example: Device MCP6231 BCNN BDNN BENN
Code
XXNN
MCP6231R MCP6231U Note:
AA07
Applies 5-Lead SOT-23.
8-Lead MSOP XXXXXX YWWNNN
Example: 6232E 418256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: MCP6232 E/P256 0418
8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW
Example: MCP6232 E/SN0418
Legend:
XX.X
Customer specific information* Year code (last digits calendar year) Week code (week January week `01') Alphanumeric traceability code
Note:
event full Microchip part number cannot marked line, will carried over next line thus limiting number available characters customer specific information.
Standard marking consists Microchip part number, year code, week code, traceability code (facility code, mask rev#, assembly code). marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
5-Lead Small Outline Transistor Package (SC-70)
Units Dimension Limits INCHES .026 (BSC) MILLIMETERS* 0.65 (BSC) 0.80 0.80 0.00 1.80 1.15 1.80 0.10 0.10 0.10 0.15
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Molded Lead Shoulder Lead Thickness Lead Width
.031 .031 .000 .071 .045 .071 .004 .004 .004 .006
.043 .039 .004 .094 .053 .087 .012 .016 .007 .012
1.10 1.00 0.10 2.40 1.35 2.20 0.30 0.40 0.18 0.30
*Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. JEITA (EIAJ) Standard: SC-70
Drawing C04-061
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
Number Pins Pitch Outside lead pitch (basic) Overall Height .035 .057 0.90 Molded Package Thickness .035 .051 0.90 Standoff .000 .006 0.00 Overall Width .102 .118 2.60 Molded Package Width .059 .069 1.50 Overall Length .110 .122 2.80 Foot Length .014 .022 0.35 Foot Angle Lead Thickness .004 .008 0.09 Lead Width .014 .020 0.35 Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .005" (0.127mm) side. EIAJ Equivalent: SC-74A
Drawing C04-091
Units Dimension Limits
INCHES* .038 .075 .046 .043 .003 .110 .064 .116 .018 .006 .017
MILLIMETERS 0.95 1.90 1.18 1.10 0.08 2.80 1.63 2.95 0.45 0.15 0.43
1.45 1.30 0.15 3.00 1.75 3.10 0.55 0.20 0.50
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
Number Pins Pitch .043 Overall Height .030 .037 Molded Package Thickness .000 .006 Standoff Overall Width Molded Package Width Overall Length .016 .031 Foot Length Footprint (Reference) Foot Angle Lead Thickness .003 .009 .009 .016 Lead Width Mold Draft Angle Mold Draft Angle Bottom *Controlling Parameter Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MO-187
Drawing C04-111
Units Dimension Limits
INCHES .026 .033 .193 TYP. .118 .118 .024 .037 .006 .012
MILLIMETERS* 0.65 0.75 0.85 0.00 4.90 3.00 3.00 0.40 0.60 0.95 0.08 0.22
1.10 0.95 0.15
0.80 0.23 0.40
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
8-Lead Plastic Dual In-line (PDIP)
Number Pins Pitch Seating Plane Molded Package Thickness Base Seating Plane Shoulder Shoulder Width Molded Package Width Overall Length Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Spacing Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
INCHES* .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430
MILLIMETERS 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-001 Drawing C04-018
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
8-Lead Plastic Small Outline (SN) Narrow, (SOIC)
Number Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Mold Draft Angle Bottom Controlling Parameter Significant Characteristic
Units Dimension Limits
.053 .052 .004 .228 .146 .189 .010 .019 .008 .013
INCHES* .050 .061 .056 .007 .237 .154 .193 .015 .025 .009 .017
.069 .061 .010 .244 .157 .197 .020 .030 .010 .020
MILLIMETERS 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0.20 0.23 0.33 0.42
1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 0.25 0.51
Notes: Dimensions include mold flash protrusions. Mold flash protrusions shall exceed .010" (0.254mm) side. JEDEC Equivalent: MS-012 Drawing C04-057
DS21881B-page
2004 Microchip Technology Inc.
MCP6231/2
PRODUCT IDENTIFICATION SYSTEM
order obtain information, e.g., pricing delivery, refer factory listed sales office. PART Device Tape Reel and/or Alternate Pinout Examples: Extended Temp., SOIC pkg. MCP6231-E/MS: Extended Temp., MSOP pkg. MCP6231-E/P: Extended Temp., PDIP pkg. MCP6231RT-E/OT: Tape Reel, Extended Temp., SOT-23 MCP6231UT-E/OT: Tape Reel, Extended Temp., SOT-23 pkg. MCP6231UT-E/LT: Tape Reel, Extended Temp., SC-70 pkg. MCP6231T-E/OT: Tape Reel, Extended Temp., SOT-23 pkg. MCP6232-E/SN: MCP6232-E/MS: MCP6232-E/P: MCP6232T-E/SN: Extended Temp., SOIC pkg. Extended Temp., MSOP pkg. Extended Temp., PDIP pkg. Tape Reel, Extended Temp., SOIC pkg. MCP6231-E/SN:
Temperature Package Range
Device:
MCP6231: MCP6231T: MCP6231RT: MCP6231UT: MCP6232: MCP6232T:
Single (MSOP, PDIP, SOIC) Single (Tape Reel) (SOT-23) Single (Tape Reel) (SOT-23) Single (Tape Reel) (SC-70, SOT-23) Dual (MSOP, PDIP, SOIC) Dual (Tape Reel)
Temperature Range:
-40°C +125°C
Package:
Plastic Package (SC-70), 5-lead (MCP6231U only) Plastic Micro Small Outline (MSOP), 8-lead Plastic (300 Body), 8-lead Plastic Small Outline Transistor (SOT-23), 5-lead (MCP6231, MCP6231R, MCP6231U) Plastic SOIC, (150 Body), 8-lead
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2004 Microchip Technology Inc.
DS21881B-page
MCP6231/2
NOTES:
DS21881B-page
2004 Microchip Technology Inc.
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DS21881B-page
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Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
Dallas
Addison Plaza Addison, 75001 Tel: 972-818-7423 Fax: 972-818-2924
China Shenzhen
United Plaza Shenzhen 518033, China Tel: 86-755-82901380 Fax: 86-755-8295-1393
Denmark
Regus Business Centre Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910
Detroit
Tri-Atria Office Building Farmington Hills, 48334 Tel: 248-538-2250 Fax: 248-538-2260
China Shunde
Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571
France
91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Kokomo
Kokomo, 46902 Tel: 765-864-8360 Fax: 765-864-8387
China Qingdao
Fullhope Plaza, Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205
Germany
D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Angeles
Mission Viejo, 92691 Tel: 949-462-9523 Fax: 949-462-9608
India
Divyasree Chambers Bangalore, 025, India Tel: 91-80-22290061 Fax: 91-80-22290062
Italy
Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781
Jose
Mountain View, 94043 Tel: 650-215-1444 Fax: 650-961-0286
India
International Trade Tower Delhi, 110019, India Tel: +91-11-5160-8632 Fax: +91-11-5160-8632
Netherlands
NL-5152 Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340
Toronto
Mississauga, Ontario 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
United Kingdom
Wokingham Berkshire, England RG41 Tel: 44-118-921-5869 Fax: 44-118-921-5820
Japan
Yokohama, Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
ASIA/PACIFIC
Australia
Microchip Technology Australia Sydney, Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Korea
Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 82-2-558-5934
China Beijing
Bldg. Beijing, 100027, China Tel: 86-10-85282100 Fax: 86-10-85282104
Singapore
Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
08/16/04
DS21881B-page
2004 Microchip Technology Inc.

Rail-to-Rail Gain Bandwidth Product: (typ.) Supply Current: (typ.

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