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10Gbps Optical Serializer/Deserializer XENPAK Transceiver Product
Top Searches for this datasheetIntel® TXN17401 10Gbps Optical Serializer/Deserializer XENPAK Transceiver Product Overview Intel® TXN17401 10Gbps Serializer/ Deserializer (SerDes) XENPAK transceiver designed provide IEEE802.3ae, draft 4.0-compliant 10.3Gbps interface between photonic physical layer electrical section layer. module comprised optical transmitter receiver pair integrated with Attachment Unit Interface (XAUI)-to-serial conversion. TXN17401 includes Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), Physical Medium Dependent (PMD) functions. transmitter section decodes four 8B10B encoded channels 3125Mbps from XAUI parallel data bus, performs 64B/66B scrambling, multiplexes result into 10.312Gbps optical signal launched into single-mode optical fiber pigtail. receiver section demultiplexes single 10.3125Gbps optical signal converts four channels 3125Mbps XAUI. receiver includes photodiode, transimpedance amplifier, clock recovery, decision circuit demultiplexer, operates over both 1.3µm 1.5µm bands. transponder assembled Multi-Source Agreement (MSA)-compatible package (4.8 inches long, inches wide, inches high). heat sinking designed 50°C ambient temperature with linear feet minute airflow. electrical interface through XENPAK MSA-compliant 70-pin board edge connector, with optical connections made using standard SC-UPC optical connectors. 10GBASE-LR transceiver intended link spans 10km, uses 1.3µm Distributed Feedback (DFB) laser source. IEEE802.3ae XENPAK compliant Management Data Interface (MDIO) also included. Intel's automated manufacturing process produces transmitter receiver modules that smaller have excellent optical performance over temperature. This process easily scalable support high volume requirements with repeatability high quality. Intel brings these modules together with it's SerDes components produce optimized, high performance XENPAK solution. Applications Enterprise switches routers Core-routers Control Processor Network Processor Interconnect centralized switch fabric TXN17401 SF1-4 Customer Proprietary SF1-4 10GbE Media Access Controller XAUI XENPAK 10.3Gbps TXN17401 XAUI XENPAK 10.3Gbps 10GbE Enterprise Line Card Modular Switch/Router Application EEPROM TXN17401 Block Diagram LASI PRTAD<04> MDIO XAIP(N), XBIP(N), XCIP(N), XDIP(N) XAUI Receive/ DeMUX/ Deskew MDC/MDIO Management Laser Diode Control 8B/10B Decoder FIFO 64/66 Encoder/ Scrambler Output Driver Laser Driver Transmit Laser Diode REFCLK XAOP(N), XBOP(N), XCOP(N), XDOP(N) MUX/ XAUI Transmit 8B/10B Encoder FIFO Descrambler/ 66/64 Decoder DeMUX Loop Select Receive Diode Features Benefits pluggable front faceplate Gives system designer ability install change transceivers both manufacturing field resulting flexible designs lowered inventory cost Enables eight 10Gbps ports single line card Improves time-to-market standardized, turnkey solution Excellent performance temperature Small cross section Complies with XENPAK Intel miniature un-cooled transmitter receiver Support Collateral/Tools Item Evaluation Board Intel Access Developer's Site Networking Components Home Page Other Intel Support: Intel Literature Center General Information Hotline http://developer.intel.com (800) 548-4725 a.m. p.m. (U.S. Canada) International locations please contact your local sales office. Description Order Number TXNEB17401 TXN17401 Evaluation Board (800) 628-8686 (916) 356-3104 a.m. p.m. Intel trademark registered trademark Intel Corporation subsidiaries United States other countries. Information this document provided connection with Intel® products. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Intel's Terms Conditions Sale such products, Intel assumes liability whatsoever, Intel disclaims express implied warranty, relating sale and/or Intel products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright, other intellectual property right. Intel products intended medical, life saving life sustaining applications. Intel make changes specifications product descriptions time, without notice. Designers must rely absence characteristics features instructions marked "reserved" "undefined." Intel reserves these future definition shall have responsibility whatsoever conflicts incompatibilities arising from future changes them. Other names brands claimed property others. UNITED STATES CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. 58119 Santa Clara, 95052-8119 2002 Intel Corporation EUROPE Intel Corporation (UK) Ltd. Pipers Swindon Wiltshire ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Pacific Place Queensway, Central Hong Kong JAPAN Intel Japan (Tsukuba Tokodai Tsukuba-shi 300-2635 Ibaraki-ken Japan SOUTH AMERICA Intel Semicondutores Brasil Ltda Chucri Zaidan, 940-10° andar 04583-904 Paulo, Brazil Order Number: 249800-001 Printed USA/0102/5K/MGS/DC Other recent searchesTB0152A - TB0152A TB0152A Datasheet SN74AVCA406 - SN74AVCA406 SN74AVCA406 Datasheet PLQP0216LA-A - PLQP0216LA-A PLQP0216LA-A Datasheet MC10EP05 - MC10EP05 MC10EP05 Datasheet IRLIZ24G - IRLIZ24G IRLIZ24G Datasheet ENA1674 - ENA1674 ENA1674 Datasheet CR2032 - CR2032 CR2032 Datasheet 2N3810 - 2N3810 2N3810 Datasheet 1A0260-3 - 1A0260-3 1A0260-3 Datasheet
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