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10Gbps Optical Serializer/Deserializer XENPAK Transceiver Product


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Intel® TXN17401
10Gbps Optical Serializer/Deserializer XENPAK Transceiver
Product Overview Intel® TXN17401 10Gbps Serializer/ Deserializer (SerDes) XENPAK transceiver designed provide IEEE802.3ae, draft 4.0-compliant 10.3Gbps interface between photonic physical layer electrical section layer. module comprised optical transmitter receiver pair integrated with Attachment Unit Interface (XAUI)-to-serial conversion. TXN17401 includes Physical Coding Sublayer (PCS), Physical Medium Attachment (PMA), Physical Medium Dependent (PMD) functions. transmitter section decodes four 8B10B encoded channels 3125Mbps from XAUI parallel data bus, performs 64B/66B scrambling, multiplexes result into 10.312Gbps optical signal launched into single-mode optical fiber pigtail. receiver section demultiplexes single 10.3125Gbps optical signal converts four channels 3125Mbps XAUI. receiver includes photodiode, transimpedance amplifier, clock recovery, decision circuit demultiplexer, operates over both 1.3µm 1.5µm bands. transponder assembled Multi-Source Agreement (MSA)-compatible package (4.8 inches long, inches wide, inches high). heat sinking designed 50°C ambient temperature with linear feet minute airflow. electrical interface through XENPAK MSA-compliant 70-pin board edge connector, with optical connections made using standard SC-UPC optical connectors. 10GBASE-LR transceiver intended link spans 10km, uses 1.3µm Distributed Feedback (DFB) laser source. IEEE802.3ae XENPAK compliant Management Data Interface (MDIO) also included. Intel's automated manufacturing process produces transmitter receiver modules that smaller have excellent optical performance over temperature. This process easily scalable support high volume requirements with repeatability high quality. Intel brings these modules together with it's SerDes components produce optimized, high performance XENPAK solution. Applications
Enterprise switches routers Core-routers
Control Processor
Network Processor
Interconnect centralized switch fabric
TXN17401
SF1-4
Customer Proprietary SF1-4
10GbE Media Access Controller
XAUI
XENPAK
10.3Gbps
TXN17401
XAUI
XENPAK
10.3Gbps
10GbE Enterprise Line Card Modular Switch/Router Application
EEPROM
TXN17401 Block Diagram
LASI PRTAD<04> MDIO XAIP(N), XBIP(N), XCIP(N), XDIP(N) XAUI Receive/ DeMUX/ Deskew
MDC/MDIO Management Laser Diode Control
8B/10B Decoder
FIFO
64/66 Encoder/ Scrambler
Output Driver
Laser Driver
Transmit Laser Diode
REFCLK
XAOP(N), XBOP(N), XCOP(N), XDOP(N)
MUX/ XAUI Transmit
8B/10B Encoder
FIFO
Descrambler/ 66/64 Decoder
DeMUX
Loop Select
Receive Diode
Features
Benefits
pluggable front faceplate
Gives system designer ability install change transceivers both manufacturing field resulting flexible designs lowered inventory cost Enables eight 10Gbps ports single line card Improves time-to-market standardized, turnkey solution Excellent performance temperature
Small cross section Complies with XENPAK Intel miniature un-cooled transmitter receiver
Support Collateral/Tools Item Evaluation Board Intel Access Developer's Site Networking Components Home Page Other Intel Support: Intel Literature Center General Information Hotline http://developer.intel.com (800) 548-4725 a.m. p.m. (U.S. Canada)
International locations please contact your local sales office.
Description
Order Number TXNEB17401
TXN17401 Evaluation Board
(800) 628-8686 (916) 356-3104 a.m. p.m.
Intel trademark registered trademark Intel Corporation subsidiaries United States other countries. Information this document provided connection with Intel® products. license, express implied, estoppel otherwise, intellectual property rights granted this document. Except provided Intel's Terms Conditions Sale such products, Intel assumes liability whatsoever, Intel disclaims express implied warranty, relating sale and/or Intel products including liability warranties relating fitness particular purpose, merchantability, infringement patent, copyright, other intellectual property right. Intel products intended medical, life saving life sustaining applications. Intel make changes specifications product descriptions time, without notice. Designers must rely absence characteristics features instructions marked "reserved" "undefined." Intel reserves these future definition shall have responsibility whatsoever conflicts incompatibilities arising from future changes them. Other names brands claimed property others. UNITED STATES CANADA Intel Corporation Robert Noyce Bldg. 2200 Mission College Blvd. P.O. 58119 Santa Clara, 95052-8119 2002 Intel Corporation EUROPE Intel Corporation (UK) Ltd. Pipers Swindon Wiltshire ASIA-PACIFIC Intel Semiconductor Ltd. 32/F Pacific Place Queensway, Central Hong Kong JAPAN Intel Japan (Tsukuba Tokodai Tsukuba-shi 300-2635 Ibaraki-ken Japan SOUTH AMERICA Intel Semicondutores Brasil Ltda Chucri Zaidan, 940-10° andar 04583-904 Paulo, Brazil
Order Number: 249800-001 Printed USA/0102/5K/MGS/DC

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