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Integrated Relay / Inductive Load Driver

MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document by MDC3105LT1 / D
Integrated Relay / Inductive Load Driver
MDC3105LT1
RELAY / INDUCTIVE LOAD DRIVER SILICON SMALLBLOCK INTEGRATED CIRCUIT
CASE 318-08, STYLE 6 SOT-23 (TO-236AB)
INTERNAL CIRCUIT DIAGRAM Vout Vin 1.0 k 6.6 V (1) 33 k GND (2) (3)
Value 6.0 6.0 - 0.5 50 500 150 - 40 to +85 - 65 to +150
Unit Vdc Vdc Vdc mJ mA °C °C °C
MDC3105LT1
THERMAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
ON CHARACTERISTICS
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High to Low Propagation Delay Figure 1 (5.0 V 74HC04) Low to High Propagation Delay Figure 1 (5.0 V 74HC04) High to Low Propagation Delay Figures 1, 13 (3.0 V 74HC04) Low to High Propagation Delay Figures 1, 13 (3.0 V 74HC04) High to Low Propagation Delay Figures 1, 14 (5.0 V 74LS04) Low to High Propagation Delay Figures 1, 14 (5.0 V 74LS04) Transition Times: Fall Time Figure 1 (5.0 V 74HC04) Rise Time Figure 1 (5.0 V 74HC04) Fall Time Figures 1, 13 (3.0 V 74HC04) Rise Time Figures 1, 13 (3.0 V 74HC04) Fall Time Figures 1, 14 (5.0 V 74LS04) Rise Time Figures 1, 14 (5.0 V 74LS04) Symbol tPHL tPLH tPHL tPLH tPHL tPLH tf tr tf tr tf tr Min - - - - - - - - - - - - Typ 55 430 85 315 55 2.4 45 160 70 195 45 2.4 Max - - - - - - - - - - - - Units nS
Figure 1. Switching Waveforms 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
(ON CHARACTERISTICS)
MC74HC04 @ 4.5 Vdc MC68HC05C8 @ 5.0 Vdc MDC3105LT1 Vin vs. Iin MC74HC04 @ 3.0 Vdc
INPUT CURRENT (mA)
Figure 2. Transistor DC Current Gain
Figure 3. Input V-I Requirement Compared to Possible Source Logic Outputs
VO, OUTPUT VOLTAGE (Vdc)
Figure 4. Threshold Effects
Figure 5. Transistor Output V-I Characteristic
Vout , OUTPUT VOLTAGE (Vdc)
- 40°C
IZ, ZENER CURRENT (mA)
Figure 6. Output Saturation Voltage versus Iout / Iin
Figure 7. Zener Clamp Voltage versus Zener Current
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
-15 5.0 25 45 TJ, JUNCTION TEMPERATURE (°C)
4.0 5.0 2.0 3.0 VCC, SUPPLY VOLTAGE (Vdc)
Figure 8. Output Leakage Current versus Temperature
Figure 9. Output Leakage Current versus Supply Voltage
RCE(sat)
Iout (AMPS)
232 ms
375 ms
TYPICAL IZ vs VZ 10
Figure 10. Safe Operating Area
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
MAX L / R TIME CONSTANT (ms)
10 0.001 0.01 Izpk (AMPS) 0.1 1.0
Figure 11. Zener Repetitive Pulse Energy Limit on L / R Time Constant
1.0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.05 0.02 0.01 Pd(pk)
0.01 SINGLE PULSE 0.001 0.01 0.1 1.0 10 100 t1, PULSE WIDTH (ms) 1000
Figure 12. Transient Thermal Response
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
APPLICATIONS DIAGRAMS
+3.0 VDD +3.75 Vdc +4.5 VCC +5.5 Vdc
+ + AROMAT TX2-L2-5 V
Vout (3) MDC3105LT1 Vin (1)
74HC04 OR EQUIVALENT
GND (2)
Figure 13. A 200 mW, 5.0 V Dual Coil Latching Relay Application with 3.0 V-HCMOS Level Translating Interface
Vout (3) MDC3105LT1
Vin (1) GND (2)
Figure 14. A 140 mW, 5.0 V Relay with TTL Interface
Figure 15. A Quad 5.0 V, 360 mW Coil Relay Bank
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
TYPICAL OPERATING WAVEFORMS
3.5 V in (VOLTS) IC (mA) 10 30 50 TIME (ms) 70 90
25 10 30 50 TIME (ms) 70 90
Figure 16. 20 Hz Square Wave Input
Figure 17. 20 Hz Square Wave Response
7 Vout (VOLTS) IZ (mA) 10 30 50 TIME (ms) 70 90
12 10 30 50 TIME (ms) 70 90
Figure 18. 20 Hz Square Wave Response
Figure 19. 20 Hz Square Wave Response
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.
inches mm
SOT-23 SOT-23 POWER DISSIPATION
The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can
The 556°C / W for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT-23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. · Always preheat the device. · The delta temperature between the preheat and soldering should be 100°C or less. · When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
Thermal Clad is a trademark of the Bergquist Company.
· The soldering temperature and time should not exceed · When shifting from preheating to soldering, the · After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. · Mechanical stress or shock should not be applied during cooling Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. maximum temperature gradient should be 5°C or less. 260°C for more than 10 seconds.
Motorola Small-Signal Transistors, FETs and Diodes Device Data
MDC3105LT1
PACKAGE DIMENSIONS
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR
CASE 318-08 ISSUE AE
MDC3105LT1 / D Motorola Small-Signal Transistors, FETs and Diodes Device Data